Jetalon

 
 
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    GVEP International feed

  • GVEP create dual finance training for banks and entrepreneurs

    Meghan Smith
    22 Sep 2014 | 5:44 am
    A key challenge facing energy businesses in Africa is the lack of access to finance. Through tailored training to financial institutions and energy businesses alike GVEP aims to improve knowledge of the energy sector and encourage increased lending activity.  A key challenge facing energy businesses in Africa is the lack of access to finance.read more
  • Millions more now benefitting from clean energy across East Africa

    Meghan Smith
    17 Sep 2014 | 9:30 am
    To date, 2.1 million more people in East Africa have now access to clean energy. This has been achieved after just two years implementation of the Capital Access for Renewable Energy Enterprises Programme (CARE2), run by GVEP International through funding from the Swedish government (Sida).   To date, 2.1 million more people in East Africa have now access to clean energy.read more
  • GVEP invited to share experience at the universal energy access agenda

    Meghan Smith
    16 Sep 2014 | 9:47 am
    GVEP took part in a high level meeting last month that addressed issues of policy framework, distribution challenges, approaches to end-user financing and the nexus between energy and health with regards to bringing off-grid electrification solutions to Uganda. ‘Towards Universal Energy Access: Uganda’ was organized by the United Nations Foundation and the World Wide. GVEP took part in a high level meeting last month that addressread more
  • GVEP welcomes Carolyn Tobin as a new Trustee

    Meghan Smith
    9 Sep 2014 | 8:45 am
    GVEP appointed Carolyn Tobin as new Trustee last month. Carolyn is a Management Consultant focusing on acquiring and integrating businesses and other profit enhancement programs. GVEP appointed Carolyn Tobin as new Trustee last month.read more
  • GVEP’s gender focus helping women break market barriers

    Meghan Smith
    8 Sep 2014 | 9:45 am
    The implementation of a programme with integrated gender-specific components is allowing female entrepreneurs to break the mould in business areas that are notoriously impenetrable for women.   The implementation of a programme with integrated gender-specific components is allowing female entrepreneurs to break the mould in business areas that are notoriously impenetrable for women.read more
 
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    American Biotechnologist

  • A Day in the Life of a Molecular Biologist

    American Biotechnologist
    1 Oct 2014 | 10:34 am
    How similar does this sound to your day? Bookmark It Hide Sites
  • The Cultural Side of Science Communication

    American Biotechnologist
    30 Sep 2014 | 1:30 pm
    Do we think of nature as something that we enjoy when we visit a national park and something we need to “preserve?” Or do we think of ourselves as a part of nature? A bird’s nest is a part of nature, but what about a house? The answers to these questions reflect different cultural orientations. They are also reflected in our actions, our speech and in cultural artifacts. A new Northwestern University study, in partnership with the University of Washington, the American Indian Center of Chicago and the Menominee tribe of Wisconsin, focuses on science communication and how…
  • Image Lab™ Software: Learn Volume Analysis from the Experts

    American Biotechnologist
    29 Sep 2014 | 1:04 pm
    Presented by:Ben Wang, PhDSenior Technical Support Specialist Join us for a 30 minute live webinar developed and delivered by our knowledgeable Technical Support Team. Tomorrow – Tuesday, September 30, 2014 | 10:00 AM Pacific As you get ready to use your new system, we will provide you with an opportunity to learn about the analysis tools built into the Image Lab software. This training will cover the steps to use our volume tools to successfully quantitate bands, dot blots, and arrays. Bookmark It Hide Sites
  • The 2014 Ig Nobels Have Arrived!

    American Biotechnologist
    25 Sep 2014 | 8:00 am
    Bookmark It Hide Sites
  • Life Through an MRI Machine

    American Biotechnologist
    24 Sep 2014 | 7:00 am
    Now trending #1 on Google. Very cool. Bookmark It Hide Sites
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    Solid State Technology

  • FlipChip International creates 250 multi-product wafer bump designs

    sdavis
    1 Oct 2014 | 2:20 pm
    FlipChip International (FCI), a developer of flip chip bumping and advanced wafer level packaging technologies, announced that their engineering team had completed design and production of the 250th Multi-Product Wafer Bump design since January 2013. Multi-Product Wafer (MPW) Bump Designs are complex and challenging to create but provide a way for customers to quickly test multiple IC designs and provide samples to customers. MPW wafers have many different ICs fabricated on the same wafer. These can be design variations of a single base IC, to help optimize functional performance, or many…
  • Quantum Materials scaling up photoactive quantum dot production for solar power generation

    sdavis
    1 Oct 2014 | 2:14 pm
    Quantum Materials Corp today announced that it is scaling volume production of photoactive quantum dots for use in next-generation photovoltaic solar power technologies. While offering numerous advantages for solar power generation, the high cost and difficulty of producing large quantities of quantum dots with which to develop thin film solar cells has until now kept them from commercial utilization and acceptance. The company is also seeking partners for pilot thin-film quantum dot solar cell factories with Quantum Materials’ automated quantum dot production system supplying the…
  • Boston Semi Equipment creates industry’s largest independent ATE organization

    sdavis
    1 Oct 2014 | 12:48 pm
    Boston Semi Equipment LLC (BSE) today announced it has combined all of its automated test equipment (ATE) businesses under the Boston Semi Equipment brand name. Effective immediately, the Test Advantage Hardware and MVTS Technologies businesses will operate using the Boston Semi Equipment name. This follows the company’s announcement in July that it was integrating all sales and service for ATE, Prober and Test Handler products into the Boston Semi Equipment field sales organization. Boston Semi Equipment has now built an organization of tester, handler and prober integration…
  • SEMICON Japan features “World of IoT”

    sdavis
    1 Oct 2014 | 12:00 pm
    Today, SEMI opens registration for the SEMICON Japan 2014 exposition and programs through its website at www.semiconjapan.org. SEMICON Japan 2014, Japan’s largest exhibition for the microelectronics manufacturing supply chain, will take place at Tokyo Big Sight in the Tokyo metropolitan area on December 3-5. For the first time, SEMICON Japan will feature a show-within-a-show  “World of IoT” to showcase applications and technologies of companies enabling the IoT revolution, including Toyota Motor, Intel, IBM, Toshiba and Cisco. “Japan is a key region for the semiconductor industry,…
  • All directions are not created equal for nanoscale heat sources

    sdavis
    1 Oct 2014 | 11:14 am
    Thermal considerations are rapidly becoming one of the most serious design constraints in microelectronics, especially on submicron scale lengths. A study by researchers from the University of Illinois at Urbana-Champaign has shown that standard thermal models will lead to the wrong answer in a three-dimensional heat-transfer problem if the dimensions of the heating element are on the order of one micron or smaller. “As materials shrink, the rules governing heat transfer change as well,” explained David Cahill, a professor of materials science and engineering at Illinois.
 
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    Solid State Technology

  • FlipChip International creates 250 multi-product wafer bump designs

    sdavis
    1 Oct 2014 | 2:20 pm
    FlipChip International (FCI), a developer of flip chip bumping and advanced wafer level packaging technologies, announced that their engineering team had completed design and production of the 250th Multi-Product Wafer Bump design since January 2013. Multi-Product Wafer (MPW) Bump Designs are complex and challenging to create but provide a way for customers to quickly test multiple IC designs and provide samples to customers. MPW wafers have many different ICs fabricated on the same wafer. These can be design variations of a single base IC, to help optimize functional performance, or many…
  • Quantum Materials scaling up photoactive quantum dot production for solar power generation

    sdavis
    1 Oct 2014 | 2:14 pm
    Quantum Materials Corp today announced that it is scaling volume production of photoactive quantum dots for use in next-generation photovoltaic solar power technologies. While offering numerous advantages for solar power generation, the high cost and difficulty of producing large quantities of quantum dots with which to develop thin film solar cells has until now kept them from commercial utilization and acceptance. The company is also seeking partners for pilot thin-film quantum dot solar cell factories with Quantum Materials’ automated quantum dot production system supplying the…
  • Boston Semi Equipment creates industry’s largest independent ATE organization

    sdavis
    1 Oct 2014 | 12:48 pm
    Boston Semi Equipment LLC (BSE) today announced it has combined all of its automated test equipment (ATE) businesses under the Boston Semi Equipment brand name. Effective immediately, the Test Advantage Hardware and MVTS Technologies businesses will operate using the Boston Semi Equipment name. This follows the company’s announcement in July that it was integrating all sales and service for ATE, Prober and Test Handler products into the Boston Semi Equipment field sales organization. Boston Semi Equipment has now built an organization of tester, handler and prober integration…
  • SEMICON Japan features “World of IoT”

    sdavis
    1 Oct 2014 | 12:00 pm
    Today, SEMI opens registration for the SEMICON Japan 2014 exposition and programs through its website at www.semiconjapan.org. SEMICON Japan 2014, Japan’s largest exhibition for the microelectronics manufacturing supply chain, will take place at Tokyo Big Sight in the Tokyo metropolitan area on December 3-5. For the first time, SEMICON Japan will feature a show-within-a-show  “World of IoT” to showcase applications and technologies of companies enabling the IoT revolution, including Toyota Motor, Intel, IBM, Toshiba and Cisco. “Japan is a key region for the semiconductor industry,…
  • All directions are not created equal for nanoscale heat sources

    sdavis
    1 Oct 2014 | 11:14 am
    Thermal considerations are rapidly becoming one of the most serious design constraints in microelectronics, especially on submicron scale lengths. A study by researchers from the University of Illinois at Urbana-Champaign has shown that standard thermal models will lead to the wrong answer in a three-dimensional heat-transfer problem if the dimensions of the heating element are on the order of one micron or smaller. “As materials shrink, the rules governing heat transfer change as well,” explained David Cahill, a professor of materials science and engineering at Illinois.
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    Solid State Technology

  • FlipChip International creates 250 multi-product wafer bump designs

    sdavis
    1 Oct 2014 | 2:20 pm
    FlipChip International (FCI), a developer of flip chip bumping and advanced wafer level packaging technologies, announced that their engineering team had completed design and production of the 250th Multi-Product Wafer Bump design since January 2013. Multi-Product Wafer (MPW) Bump Designs are complex and challenging to create but provide a way for customers to quickly test multiple IC designs and provide samples to customers. MPW wafers have many different ICs fabricated on the same wafer. These can be design variations of a single base IC, to help optimize functional performance, or many…
  • Quantum Materials scaling up photoactive quantum dot production for solar power generation

    sdavis
    1 Oct 2014 | 2:14 pm
    Quantum Materials Corp today announced that it is scaling volume production of photoactive quantum dots for use in next-generation photovoltaic solar power technologies. While offering numerous advantages for solar power generation, the high cost and difficulty of producing large quantities of quantum dots with which to develop thin film solar cells has until now kept them from commercial utilization and acceptance. The company is also seeking partners for pilot thin-film quantum dot solar cell factories with Quantum Materials’ automated quantum dot production system supplying the…
  • Boston Semi Equipment creates industry’s largest independent ATE organization

    sdavis
    1 Oct 2014 | 12:48 pm
    Boston Semi Equipment LLC (BSE) today announced it has combined all of its automated test equipment (ATE) businesses under the Boston Semi Equipment brand name. Effective immediately, the Test Advantage Hardware and MVTS Technologies businesses will operate using the Boston Semi Equipment name. This follows the company’s announcement in July that it was integrating all sales and service for ATE, Prober and Test Handler products into the Boston Semi Equipment field sales organization. Boston Semi Equipment has now built an organization of tester, handler and prober integration…
  • SEMICON Japan features “World of IoT”

    sdavis
    1 Oct 2014 | 12:00 pm
    Today, SEMI opens registration for the SEMICON Japan 2014 exposition and programs through its website at www.semiconjapan.org. SEMICON Japan 2014, Japan’s largest exhibition for the microelectronics manufacturing supply chain, will take place at Tokyo Big Sight in the Tokyo metropolitan area on December 3-5. For the first time, SEMICON Japan will feature a show-within-a-show  “World of IoT” to showcase applications and technologies of companies enabling the IoT revolution, including Toyota Motor, Intel, IBM, Toshiba and Cisco. “Japan is a key region for the semiconductor industry,…
  • All directions are not created equal for nanoscale heat sources

    sdavis
    1 Oct 2014 | 11:14 am
    Thermal considerations are rapidly becoming one of the most serious design constraints in microelectronics, especially on submicron scale lengths. A study by researchers from the University of Illinois at Urbana-Champaign has shown that standard thermal models will lead to the wrong answer in a three-dimensional heat-transfer problem if the dimensions of the heating element are on the order of one micron or smaller. “As materials shrink, the rules governing heat transfer change as well,” explained David Cahill, a professor of materials science and engineering at Illinois.
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    Solid State Technology

  • FlipChip International creates 250 multi-product wafer bump designs

    sdavis
    1 Oct 2014 | 2:20 pm
    FlipChip International (FCI), a developer of flip chip bumping and advanced wafer level packaging technologies, announced that their engineering team had completed design and production of the 250th Multi-Product Wafer Bump design since January 2013. Multi-Product Wafer (MPW) Bump Designs are complex and challenging to create but provide a way for customers to quickly test multiple IC designs and provide samples to customers. MPW wafers have many different ICs fabricated on the same wafer. These can be design variations of a single base IC, to help optimize functional performance, or many…
  • Quantum Materials scaling up photoactive quantum dot production for solar power generation

    sdavis
    1 Oct 2014 | 2:14 pm
    Quantum Materials Corp today announced that it is scaling volume production of photoactive quantum dots for use in next-generation photovoltaic solar power technologies. While offering numerous advantages for solar power generation, the high cost and difficulty of producing large quantities of quantum dots with which to develop thin film solar cells has until now kept them from commercial utilization and acceptance. The company is also seeking partners for pilot thin-film quantum dot solar cell factories with Quantum Materials’ automated quantum dot production system supplying the…
  • Boston Semi Equipment creates industry’s largest independent ATE organization

    sdavis
    1 Oct 2014 | 12:48 pm
    Boston Semi Equipment LLC (BSE) today announced it has combined all of its automated test equipment (ATE) businesses under the Boston Semi Equipment brand name. Effective immediately, the Test Advantage Hardware and MVTS Technologies businesses will operate using the Boston Semi Equipment name. This follows the company’s announcement in July that it was integrating all sales and service for ATE, Prober and Test Handler products into the Boston Semi Equipment field sales organization. Boston Semi Equipment has now built an organization of tester, handler and prober integration…
  • SEMICON Japan features “World of IoT”

    sdavis
    1 Oct 2014 | 12:00 pm
    Today, SEMI opens registration for the SEMICON Japan 2014 exposition and programs through its website at www.semiconjapan.org. SEMICON Japan 2014, Japan’s largest exhibition for the microelectronics manufacturing supply chain, will take place at Tokyo Big Sight in the Tokyo metropolitan area on December 3-5. For the first time, SEMICON Japan will feature a show-within-a-show  “World of IoT” to showcase applications and technologies of companies enabling the IoT revolution, including Toyota Motor, Intel, IBM, Toshiba and Cisco. “Japan is a key region for the semiconductor industry,…
  • All directions are not created equal for nanoscale heat sources

    sdavis
    1 Oct 2014 | 11:14 am
    Thermal considerations are rapidly becoming one of the most serious design constraints in microelectronics, especially on submicron scale lengths. A study by researchers from the University of Illinois at Urbana-Champaign has shown that standard thermal models will lead to the wrong answer in a three-dimensional heat-transfer problem if the dimensions of the heating element are on the order of one micron or smaller. “As materials shrink, the rules governing heat transfer change as well,” explained David Cahill, a professor of materials science and engineering at Illinois.
 
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    Solid State Technology

  • FlipChip International creates 250 multi-product wafer bump designs

    sdavis
    1 Oct 2014 | 2:20 pm
    FlipChip International (FCI), a developer of flip chip bumping and advanced wafer level packaging technologies, announced that their engineering team had completed design and production of the 250th Multi-Product Wafer Bump design since January 2013. Multi-Product Wafer (MPW) Bump Designs are complex and challenging to create but provide a way for customers to quickly test multiple IC designs and provide samples to customers. MPW wafers have many different ICs fabricated on the same wafer. These can be design variations of a single base IC, to help optimize functional performance, or many…
  • Quantum Materials scaling up photoactive quantum dot production for solar power generation

    sdavis
    1 Oct 2014 | 2:14 pm
    Quantum Materials Corp today announced that it is scaling volume production of photoactive quantum dots for use in next-generation photovoltaic solar power technologies. While offering numerous advantages for solar power generation, the high cost and difficulty of producing large quantities of quantum dots with which to develop thin film solar cells has until now kept them from commercial utilization and acceptance. The company is also seeking partners for pilot thin-film quantum dot solar cell factories with Quantum Materials’ automated quantum dot production system supplying the…
  • Boston Semi Equipment creates industry’s largest independent ATE organization

    sdavis
    1 Oct 2014 | 12:48 pm
    Boston Semi Equipment LLC (BSE) today announced it has combined all of its automated test equipment (ATE) businesses under the Boston Semi Equipment brand name. Effective immediately, the Test Advantage Hardware and MVTS Technologies businesses will operate using the Boston Semi Equipment name. This follows the company’s announcement in July that it was integrating all sales and service for ATE, Prober and Test Handler products into the Boston Semi Equipment field sales organization. Boston Semi Equipment has now built an organization of tester, handler and prober integration…
  • SEMICON Japan features “World of IoT”

    sdavis
    1 Oct 2014 | 12:00 pm
    Today, SEMI opens registration for the SEMICON Japan 2014 exposition and programs through its website at www.semiconjapan.org. SEMICON Japan 2014, Japan’s largest exhibition for the microelectronics manufacturing supply chain, will take place at Tokyo Big Sight in the Tokyo metropolitan area on December 3-5. For the first time, SEMICON Japan will feature a show-within-a-show  “World of IoT” to showcase applications and technologies of companies enabling the IoT revolution, including Toyota Motor, Intel, IBM, Toshiba and Cisco. “Japan is a key region for the semiconductor industry,…
  • All directions are not created equal for nanoscale heat sources

    sdavis
    1 Oct 2014 | 11:14 am
    Thermal considerations are rapidly becoming one of the most serious design constraints in microelectronics, especially on submicron scale lengths. A study by researchers from the University of Illinois at Urbana-Champaign has shown that standard thermal models will lead to the wrong answer in a three-dimensional heat-transfer problem if the dimensions of the heating element are on the order of one micron or smaller. “As materials shrink, the rules governing heat transfer change as well,” explained David Cahill, a professor of materials science and engineering at Illinois.
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    Solid State Technology

  • FlipChip International creates 250 multi-product wafer bump designs

    sdavis
    1 Oct 2014 | 2:20 pm
    FlipChip International (FCI), a developer of flip chip bumping and advanced wafer level packaging technologies, announced that their engineering team had completed design and production of the 250th Multi-Product Wafer Bump design since January 2013. Multi-Product Wafer (MPW) Bump Designs are complex and challenging to create but provide a way for customers to quickly test multiple IC designs and provide samples to customers. MPW wafers have many different ICs fabricated on the same wafer. These can be design variations of a single base IC, to help optimize functional performance, or many…
  • Quantum Materials scaling up photoactive quantum dot production for solar power generation

    sdavis
    1 Oct 2014 | 2:14 pm
    Quantum Materials Corp today announced that it is scaling volume production of photoactive quantum dots for use in next-generation photovoltaic solar power technologies. While offering numerous advantages for solar power generation, the high cost and difficulty of producing large quantities of quantum dots with which to develop thin film solar cells has until now kept them from commercial utilization and acceptance. The company is also seeking partners for pilot thin-film quantum dot solar cell factories with Quantum Materials’ automated quantum dot production system supplying the…
  • Boston Semi Equipment creates industry’s largest independent ATE organization

    sdavis
    1 Oct 2014 | 12:48 pm
    Boston Semi Equipment LLC (BSE) today announced it has combined all of its automated test equipment (ATE) businesses under the Boston Semi Equipment brand name. Effective immediately, the Test Advantage Hardware and MVTS Technologies businesses will operate using the Boston Semi Equipment name. This follows the company’s announcement in July that it was integrating all sales and service for ATE, Prober and Test Handler products into the Boston Semi Equipment field sales organization. Boston Semi Equipment has now built an organization of tester, handler and prober integration…
  • SEMICON Japan features “World of IoT”

    sdavis
    1 Oct 2014 | 12:00 pm
    Today, SEMI opens registration for the SEMICON Japan 2014 exposition and programs through its website at www.semiconjapan.org. SEMICON Japan 2014, Japan’s largest exhibition for the microelectronics manufacturing supply chain, will take place at Tokyo Big Sight in the Tokyo metropolitan area on December 3-5. For the first time, SEMICON Japan will feature a show-within-a-show  “World of IoT” to showcase applications and technologies of companies enabling the IoT revolution, including Toyota Motor, Intel, IBM, Toshiba and Cisco. “Japan is a key region for the semiconductor industry,…
  • All directions are not created equal for nanoscale heat sources

    sdavis
    1 Oct 2014 | 11:14 am
    Thermal considerations are rapidly becoming one of the most serious design constraints in microelectronics, especially on submicron scale lengths. A study by researchers from the University of Illinois at Urbana-Champaign has shown that standard thermal models will lead to the wrong answer in a three-dimensional heat-transfer problem if the dimensions of the heating element are on the order of one micron or smaller. “As materials shrink, the rules governing heat transfer change as well,” explained David Cahill, a professor of materials science and engineering at Illinois.
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    Solid State Technology

  • FlipChip International creates 250 multi-product wafer bump designs

    sdavis
    1 Oct 2014 | 2:20 pm
    FlipChip International (FCI), a developer of flip chip bumping and advanced wafer level packaging technologies, announced that their engineering team had completed design and production of the 250th Multi-Product Wafer Bump design since January 2013. Multi-Product Wafer (MPW) Bump Designs are complex and challenging to create but provide a way for customers to quickly test multiple IC designs and provide samples to customers. MPW wafers have many different ICs fabricated on the same wafer. These can be design variations of a single base IC, to help optimize functional performance, or many…
  • Quantum Materials scaling up photoactive quantum dot production for solar power generation

    sdavis
    1 Oct 2014 | 2:14 pm
    Quantum Materials Corp today announced that it is scaling volume production of photoactive quantum dots for use in next-generation photovoltaic solar power technologies. While offering numerous advantages for solar power generation, the high cost and difficulty of producing large quantities of quantum dots with which to develop thin film solar cells has until now kept them from commercial utilization and acceptance. The company is also seeking partners for pilot thin-film quantum dot solar cell factories with Quantum Materials’ automated quantum dot production system supplying the…
  • Boston Semi Equipment creates industry’s largest independent ATE organization

    sdavis
    1 Oct 2014 | 12:48 pm
    Boston Semi Equipment LLC (BSE) today announced it has combined all of its automated test equipment (ATE) businesses under the Boston Semi Equipment brand name. Effective immediately, the Test Advantage Hardware and MVTS Technologies businesses will operate using the Boston Semi Equipment name. This follows the company’s announcement in July that it was integrating all sales and service for ATE, Prober and Test Handler products into the Boston Semi Equipment field sales organization. Boston Semi Equipment has now built an organization of tester, handler and prober integration…
  • SEMICON Japan features “World of IoT”

    sdavis
    1 Oct 2014 | 12:00 pm
    Today, SEMI opens registration for the SEMICON Japan 2014 exposition and programs through its website at www.semiconjapan.org. SEMICON Japan 2014, Japan’s largest exhibition for the microelectronics manufacturing supply chain, will take place at Tokyo Big Sight in the Tokyo metropolitan area on December 3-5. For the first time, SEMICON Japan will feature a show-within-a-show  “World of IoT” to showcase applications and technologies of companies enabling the IoT revolution, including Toyota Motor, Intel, IBM, Toshiba and Cisco. “Japan is a key region for the semiconductor industry,…
  • All directions are not created equal for nanoscale heat sources

    sdavis
    1 Oct 2014 | 11:14 am
    Thermal considerations are rapidly becoming one of the most serious design constraints in microelectronics, especially on submicron scale lengths. A study by researchers from the University of Illinois at Urbana-Champaign has shown that standard thermal models will lead to the wrong answer in a three-dimensional heat-transfer problem if the dimensions of the heating element are on the order of one micron or smaller. “As materials shrink, the rules governing heat transfer change as well,” explained David Cahill, a professor of materials science and engineering at Illinois.
 
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    Solid State Technology

  • FlipChip International creates 250 multi-product wafer bump designs

    sdavis
    1 Oct 2014 | 2:20 pm
    FlipChip International (FCI), a developer of flip chip bumping and advanced wafer level packaging technologies, announced that their engineering team had completed design and production of the 250th Multi-Product Wafer Bump design since January 2013. Multi-Product Wafer (MPW) Bump Designs are complex and challenging to create but provide a way for customers to quickly test multiple IC designs and provide samples to customers. MPW wafers have many different ICs fabricated on the same wafer. These can be design variations of a single base IC, to help optimize functional performance, or many…
  • Quantum Materials scaling up photoactive quantum dot production for solar power generation

    sdavis
    1 Oct 2014 | 2:14 pm
    Quantum Materials Corp today announced that it is scaling volume production of photoactive quantum dots for use in next-generation photovoltaic solar power technologies. While offering numerous advantages for solar power generation, the high cost and difficulty of producing large quantities of quantum dots with which to develop thin film solar cells has until now kept them from commercial utilization and acceptance. The company is also seeking partners for pilot thin-film quantum dot solar cell factories with Quantum Materials’ automated quantum dot production system supplying the…
  • Boston Semi Equipment creates industry’s largest independent ATE organization

    sdavis
    1 Oct 2014 | 12:48 pm
    Boston Semi Equipment LLC (BSE) today announced it has combined all of its automated test equipment (ATE) businesses under the Boston Semi Equipment brand name. Effective immediately, the Test Advantage Hardware and MVTS Technologies businesses will operate using the Boston Semi Equipment name. This follows the company’s announcement in July that it was integrating all sales and service for ATE, Prober and Test Handler products into the Boston Semi Equipment field sales organization. Boston Semi Equipment has now built an organization of tester, handler and prober integration…
  • SEMICON Japan features “World of IoT”

    sdavis
    1 Oct 2014 | 12:00 pm
    Today, SEMI opens registration for the SEMICON Japan 2014 exposition and programs through its website at www.semiconjapan.org. SEMICON Japan 2014, Japan’s largest exhibition for the microelectronics manufacturing supply chain, will take place at Tokyo Big Sight in the Tokyo metropolitan area on December 3-5. For the first time, SEMICON Japan will feature a show-within-a-show  “World of IoT” to showcase applications and technologies of companies enabling the IoT revolution, including Toyota Motor, Intel, IBM, Toshiba and Cisco. “Japan is a key region for the semiconductor industry,…
  • All directions are not created equal for nanoscale heat sources

    sdavis
    1 Oct 2014 | 11:14 am
    Thermal considerations are rapidly becoming one of the most serious design constraints in microelectronics, especially on submicron scale lengths. A study by researchers from the University of Illinois at Urbana-Champaign has shown that standard thermal models will lead to the wrong answer in a three-dimensional heat-transfer problem if the dimensions of the heating element are on the order of one micron or smaller. “As materials shrink, the rules governing heat transfer change as well,” explained David Cahill, a professor of materials science and engineering at Illinois.
  • add this feed to my.Alltop

    Solid State Technology

  • FlipChip International creates 250 multi-product wafer bump designs

    sdavis
    1 Oct 2014 | 2:20 pm
    FlipChip International (FCI), a developer of flip chip bumping and advanced wafer level packaging technologies, announced that their engineering team had completed design and production of the 250th Multi-Product Wafer Bump design since January 2013. Multi-Product Wafer (MPW) Bump Designs are complex and challenging to create but provide a way for customers to quickly test multiple IC designs and provide samples to customers. MPW wafers have many different ICs fabricated on the same wafer. These can be design variations of a single base IC, to help optimize functional performance, or many…
  • Quantum Materials scaling up photoactive quantum dot production for solar power generation

    sdavis
    1 Oct 2014 | 2:14 pm
    Quantum Materials Corp today announced that it is scaling volume production of photoactive quantum dots for use in next-generation photovoltaic solar power technologies. While offering numerous advantages for solar power generation, the high cost and difficulty of producing large quantities of quantum dots with which to develop thin film solar cells has until now kept them from commercial utilization and acceptance. The company is also seeking partners for pilot thin-film quantum dot solar cell factories with Quantum Materials’ automated quantum dot production system supplying the…
  • Boston Semi Equipment creates industry’s largest independent ATE organization

    sdavis
    1 Oct 2014 | 12:48 pm
    Boston Semi Equipment LLC (BSE) today announced it has combined all of its automated test equipment (ATE) businesses under the Boston Semi Equipment brand name. Effective immediately, the Test Advantage Hardware and MVTS Technologies businesses will operate using the Boston Semi Equipment name. This follows the company’s announcement in July that it was integrating all sales and service for ATE, Prober and Test Handler products into the Boston Semi Equipment field sales organization. Boston Semi Equipment has now built an organization of tester, handler and prober integration…
  • SEMICON Japan features “World of IoT”

    sdavis
    1 Oct 2014 | 12:00 pm
    Today, SEMI opens registration for the SEMICON Japan 2014 exposition and programs through its website at www.semiconjapan.org. SEMICON Japan 2014, Japan’s largest exhibition for the microelectronics manufacturing supply chain, will take place at Tokyo Big Sight in the Tokyo metropolitan area on December 3-5. For the first time, SEMICON Japan will feature a show-within-a-show  “World of IoT” to showcase applications and technologies of companies enabling the IoT revolution, including Toyota Motor, Intel, IBM, Toshiba and Cisco. “Japan is a key region for the semiconductor industry,…
  • All directions are not created equal for nanoscale heat sources

    sdavis
    1 Oct 2014 | 11:14 am
    Thermal considerations are rapidly becoming one of the most serious design constraints in microelectronics, especially on submicron scale lengths. A study by researchers from the University of Illinois at Urbana-Champaign has shown that standard thermal models will lead to the wrong answer in a three-dimensional heat-transfer problem if the dimensions of the heating element are on the order of one micron or smaller. “As materials shrink, the rules governing heat transfer change as well,” explained David Cahill, a professor of materials science and engineering at Illinois.
  • add this feed to my.Alltop

    Solid State Technology

  • FlipChip International creates 250 multi-product wafer bump designs

    sdavis
    1 Oct 2014 | 2:20 pm
    FlipChip International (FCI), a developer of flip chip bumping and advanced wafer level packaging technologies, announced that their engineering team had completed design and production of the 250th Multi-Product Wafer Bump design since January 2013. Multi-Product Wafer (MPW) Bump Designs are complex and challenging to create but provide a way for customers to quickly test multiple IC designs and provide samples to customers. MPW wafers have many different ICs fabricated on the same wafer. These can be design variations of a single base IC, to help optimize functional performance, or many…
  • Quantum Materials scaling up photoactive quantum dot production for solar power generation

    sdavis
    1 Oct 2014 | 2:14 pm
    Quantum Materials Corp today announced that it is scaling volume production of photoactive quantum dots for use in next-generation photovoltaic solar power technologies. While offering numerous advantages for solar power generation, the high cost and difficulty of producing large quantities of quantum dots with which to develop thin film solar cells has until now kept them from commercial utilization and acceptance. The company is also seeking partners for pilot thin-film quantum dot solar cell factories with Quantum Materials’ automated quantum dot production system supplying the…
  • Boston Semi Equipment creates industry’s largest independent ATE organization

    sdavis
    1 Oct 2014 | 12:48 pm
    Boston Semi Equipment LLC (BSE) today announced it has combined all of its automated test equipment (ATE) businesses under the Boston Semi Equipment brand name. Effective immediately, the Test Advantage Hardware and MVTS Technologies businesses will operate using the Boston Semi Equipment name. This follows the company’s announcement in July that it was integrating all sales and service for ATE, Prober and Test Handler products into the Boston Semi Equipment field sales organization. Boston Semi Equipment has now built an organization of tester, handler and prober integration…
  • SEMICON Japan features “World of IoT”

    sdavis
    1 Oct 2014 | 12:00 pm
    Today, SEMI opens registration for the SEMICON Japan 2014 exposition and programs through its website at www.semiconjapan.org. SEMICON Japan 2014, Japan’s largest exhibition for the microelectronics manufacturing supply chain, will take place at Tokyo Big Sight in the Tokyo metropolitan area on December 3-5. For the first time, SEMICON Japan will feature a show-within-a-show  “World of IoT” to showcase applications and technologies of companies enabling the IoT revolution, including Toyota Motor, Intel, IBM, Toshiba and Cisco. “Japan is a key region for the semiconductor industry,…
  • All directions are not created equal for nanoscale heat sources

    sdavis
    1 Oct 2014 | 11:14 am
    Thermal considerations are rapidly becoming one of the most serious design constraints in microelectronics, especially on submicron scale lengths. A study by researchers from the University of Illinois at Urbana-Champaign has shown that standard thermal models will lead to the wrong answer in a three-dimensional heat-transfer problem if the dimensions of the heating element are on the order of one micron or smaller. “As materials shrink, the rules governing heat transfer change as well,” explained David Cahill, a professor of materials science and engineering at Illinois.
 
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    Solid State Technology

  • FlipChip International creates 250 multi-product wafer bump designs

    sdavis
    1 Oct 2014 | 2:20 pm
    FlipChip International (FCI), a developer of flip chip bumping and advanced wafer level packaging technologies, announced that their engineering team had completed design and production of the 250th Multi-Product Wafer Bump design since January 2013. Multi-Product Wafer (MPW) Bump Designs are complex and challenging to create but provide a way for customers to quickly test multiple IC designs and provide samples to customers. MPW wafers have many different ICs fabricated on the same wafer. These can be design variations of a single base IC, to help optimize functional performance, or many…
  • Quantum Materials scaling up photoactive quantum dot production for solar power generation

    sdavis
    1 Oct 2014 | 2:14 pm
    Quantum Materials Corp today announced that it is scaling volume production of photoactive quantum dots for use in next-generation photovoltaic solar power technologies. While offering numerous advantages for solar power generation, the high cost and difficulty of producing large quantities of quantum dots with which to develop thin film solar cells has until now kept them from commercial utilization and acceptance. The company is also seeking partners for pilot thin-film quantum dot solar cell factories with Quantum Materials’ automated quantum dot production system supplying the…
  • Boston Semi Equipment creates industry’s largest independent ATE organization

    sdavis
    1 Oct 2014 | 12:48 pm
    Boston Semi Equipment LLC (BSE) today announced it has combined all of its automated test equipment (ATE) businesses under the Boston Semi Equipment brand name. Effective immediately, the Test Advantage Hardware and MVTS Technologies businesses will operate using the Boston Semi Equipment name. This follows the company’s announcement in July that it was integrating all sales and service for ATE, Prober and Test Handler products into the Boston Semi Equipment field sales organization. Boston Semi Equipment has now built an organization of tester, handler and prober integration…
  • SEMICON Japan features “World of IoT”

    sdavis
    1 Oct 2014 | 12:00 pm
    Today, SEMI opens registration for the SEMICON Japan 2014 exposition and programs through its website at www.semiconjapan.org. SEMICON Japan 2014, Japan’s largest exhibition for the microelectronics manufacturing supply chain, will take place at Tokyo Big Sight in the Tokyo metropolitan area on December 3-5. For the first time, SEMICON Japan will feature a show-within-a-show  “World of IoT” to showcase applications and technologies of companies enabling the IoT revolution, including Toyota Motor, Intel, IBM, Toshiba and Cisco. “Japan is a key region for the semiconductor industry,…
  • All directions are not created equal for nanoscale heat sources

    sdavis
    1 Oct 2014 | 11:14 am
    Thermal considerations are rapidly becoming one of the most serious design constraints in microelectronics, especially on submicron scale lengths. A study by researchers from the University of Illinois at Urbana-Champaign has shown that standard thermal models will lead to the wrong answer in a three-dimensional heat-transfer problem if the dimensions of the heating element are on the order of one micron or smaller. “As materials shrink, the rules governing heat transfer change as well,” explained David Cahill, a professor of materials science and engineering at Illinois.
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    Solid State Technology

  • FlipChip International creates 250 multi-product wafer bump designs

    sdavis
    1 Oct 2014 | 2:20 pm
    FlipChip International (FCI), a developer of flip chip bumping and advanced wafer level packaging technologies, announced that their engineering team had completed design and production of the 250th Multi-Product Wafer Bump design since January 2013. Multi-Product Wafer (MPW) Bump Designs are complex and challenging to create but provide a way for customers to quickly test multiple IC designs and provide samples to customers. MPW wafers have many different ICs fabricated on the same wafer. These can be design variations of a single base IC, to help optimize functional performance, or many…
  • Quantum Materials scaling up photoactive quantum dot production for solar power generation

    sdavis
    1 Oct 2014 | 2:14 pm
    Quantum Materials Corp today announced that it is scaling volume production of photoactive quantum dots for use in next-generation photovoltaic solar power technologies. While offering numerous advantages for solar power generation, the high cost and difficulty of producing large quantities of quantum dots with which to develop thin film solar cells has until now kept them from commercial utilization and acceptance. The company is also seeking partners for pilot thin-film quantum dot solar cell factories with Quantum Materials’ automated quantum dot production system supplying the…
  • Boston Semi Equipment creates industry’s largest independent ATE organization

    sdavis
    1 Oct 2014 | 12:48 pm
    Boston Semi Equipment LLC (BSE) today announced it has combined all of its automated test equipment (ATE) businesses under the Boston Semi Equipment brand name. Effective immediately, the Test Advantage Hardware and MVTS Technologies businesses will operate using the Boston Semi Equipment name. This follows the company’s announcement in July that it was integrating all sales and service for ATE, Prober and Test Handler products into the Boston Semi Equipment field sales organization. Boston Semi Equipment has now built an organization of tester, handler and prober integration…
  • SEMICON Japan features “World of IoT”

    sdavis
    1 Oct 2014 | 12:00 pm
    Today, SEMI opens registration for the SEMICON Japan 2014 exposition and programs through its website at www.semiconjapan.org. SEMICON Japan 2014, Japan’s largest exhibition for the microelectronics manufacturing supply chain, will take place at Tokyo Big Sight in the Tokyo metropolitan area on December 3-5. For the first time, SEMICON Japan will feature a show-within-a-show  “World of IoT” to showcase applications and technologies of companies enabling the IoT revolution, including Toyota Motor, Intel, IBM, Toshiba and Cisco. “Japan is a key region for the semiconductor industry,…
  • All directions are not created equal for nanoscale heat sources

    sdavis
    1 Oct 2014 | 11:14 am
    Thermal considerations are rapidly becoming one of the most serious design constraints in microelectronics, especially on submicron scale lengths. A study by researchers from the University of Illinois at Urbana-Champaign has shown that standard thermal models will lead to the wrong answer in a three-dimensional heat-transfer problem if the dimensions of the heating element are on the order of one micron or smaller. “As materials shrink, the rules governing heat transfer change as well,” explained David Cahill, a professor of materials science and engineering at Illinois.
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    Solid State Technology

  • FlipChip International creates 250 multi-product wafer bump designs

    sdavis
    1 Oct 2014 | 2:20 pm
    FlipChip International (FCI), a developer of flip chip bumping and advanced wafer level packaging technologies, announced that their engineering team had completed design and production of the 250th Multi-Product Wafer Bump design since January 2013. Multi-Product Wafer (MPW) Bump Designs are complex and challenging to create but provide a way for customers to quickly test multiple IC designs and provide samples to customers. MPW wafers have many different ICs fabricated on the same wafer. These can be design variations of a single base IC, to help optimize functional performance, or many…
  • Quantum Materials scaling up photoactive quantum dot production for solar power generation

    sdavis
    1 Oct 2014 | 2:14 pm
    Quantum Materials Corp today announced that it is scaling volume production of photoactive quantum dots for use in next-generation photovoltaic solar power technologies. While offering numerous advantages for solar power generation, the high cost and difficulty of producing large quantities of quantum dots with which to develop thin film solar cells has until now kept them from commercial utilization and acceptance. The company is also seeking partners for pilot thin-film quantum dot solar cell factories with Quantum Materials’ automated quantum dot production system supplying the…
  • Boston Semi Equipment creates industry’s largest independent ATE organization

    sdavis
    1 Oct 2014 | 12:48 pm
    Boston Semi Equipment LLC (BSE) today announced it has combined all of its automated test equipment (ATE) businesses under the Boston Semi Equipment brand name. Effective immediately, the Test Advantage Hardware and MVTS Technologies businesses will operate using the Boston Semi Equipment name. This follows the company’s announcement in July that it was integrating all sales and service for ATE, Prober and Test Handler products into the Boston Semi Equipment field sales organization. Boston Semi Equipment has now built an organization of tester, handler and prober integration…
  • SEMICON Japan features “World of IoT”

    sdavis
    1 Oct 2014 | 12:00 pm
    Today, SEMI opens registration for the SEMICON Japan 2014 exposition and programs through its website at www.semiconjapan.org. SEMICON Japan 2014, Japan’s largest exhibition for the microelectronics manufacturing supply chain, will take place at Tokyo Big Sight in the Tokyo metropolitan area on December 3-5. For the first time, SEMICON Japan will feature a show-within-a-show  “World of IoT” to showcase applications and technologies of companies enabling the IoT revolution, including Toyota Motor, Intel, IBM, Toshiba and Cisco. “Japan is a key region for the semiconductor industry,…
  • All directions are not created equal for nanoscale heat sources

    sdavis
    1 Oct 2014 | 11:14 am
    Thermal considerations are rapidly becoming one of the most serious design constraints in microelectronics, especially on submicron scale lengths. A study by researchers from the University of Illinois at Urbana-Champaign has shown that standard thermal models will lead to the wrong answer in a three-dimensional heat-transfer problem if the dimensions of the heating element are on the order of one micron or smaller. “As materials shrink, the rules governing heat transfer change as well,” explained David Cahill, a professor of materials science and engineering at Illinois.
 
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    Solid State Technology

  • FlipChip International creates 250 multi-product wafer bump designs

    sdavis
    1 Oct 2014 | 2:20 pm
    FlipChip International (FCI), a developer of flip chip bumping and advanced wafer level packaging technologies, announced that their engineering team had completed design and production of the 250th Multi-Product Wafer Bump design since January 2013. Multi-Product Wafer (MPW) Bump Designs are complex and challenging to create but provide a way for customers to quickly test multiple IC designs and provide samples to customers. MPW wafers have many different ICs fabricated on the same wafer. These can be design variations of a single base IC, to help optimize functional performance, or many…
  • Quantum Materials scaling up photoactive quantum dot production for solar power generation

    sdavis
    1 Oct 2014 | 2:14 pm
    Quantum Materials Corp today announced that it is scaling volume production of photoactive quantum dots for use in next-generation photovoltaic solar power technologies. While offering numerous advantages for solar power generation, the high cost and difficulty of producing large quantities of quantum dots with which to develop thin film solar cells has until now kept them from commercial utilization and acceptance. The company is also seeking partners for pilot thin-film quantum dot solar cell factories with Quantum Materials’ automated quantum dot production system supplying the…
  • Boston Semi Equipment creates industry’s largest independent ATE organization

    sdavis
    1 Oct 2014 | 12:48 pm
    Boston Semi Equipment LLC (BSE) today announced it has combined all of its automated test equipment (ATE) businesses under the Boston Semi Equipment brand name. Effective immediately, the Test Advantage Hardware and MVTS Technologies businesses will operate using the Boston Semi Equipment name. This follows the company’s announcement in July that it was integrating all sales and service for ATE, Prober and Test Handler products into the Boston Semi Equipment field sales organization. Boston Semi Equipment has now built an organization of tester, handler and prober integration…
  • SEMICON Japan features “World of IoT”

    sdavis
    1 Oct 2014 | 12:00 pm
    Today, SEMI opens registration for the SEMICON Japan 2014 exposition and programs through its website at www.semiconjapan.org. SEMICON Japan 2014, Japan’s largest exhibition for the microelectronics manufacturing supply chain, will take place at Tokyo Big Sight in the Tokyo metropolitan area on December 3-5. For the first time, SEMICON Japan will feature a show-within-a-show  “World of IoT” to showcase applications and technologies of companies enabling the IoT revolution, including Toyota Motor, Intel, IBM, Toshiba and Cisco. “Japan is a key region for the semiconductor industry,…
  • All directions are not created equal for nanoscale heat sources

    sdavis
    1 Oct 2014 | 11:14 am
    Thermal considerations are rapidly becoming one of the most serious design constraints in microelectronics, especially on submicron scale lengths. A study by researchers from the University of Illinois at Urbana-Champaign has shown that standard thermal models will lead to the wrong answer in a three-dimensional heat-transfer problem if the dimensions of the heating element are on the order of one micron or smaller. “As materials shrink, the rules governing heat transfer change as well,” explained David Cahill, a professor of materials science and engineering at Illinois.
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    Solid State Technology

  • FlipChip International creates 250 multi-product wafer bump designs

    sdavis
    1 Oct 2014 | 2:20 pm
    FlipChip International (FCI), a developer of flip chip bumping and advanced wafer level packaging technologies, announced that their engineering team had completed design and production of the 250th Multi-Product Wafer Bump design since January 2013. Multi-Product Wafer (MPW) Bump Designs are complex and challenging to create but provide a way for customers to quickly test multiple IC designs and provide samples to customers. MPW wafers have many different ICs fabricated on the same wafer. These can be design variations of a single base IC, to help optimize functional performance, or many…
  • Quantum Materials scaling up photoactive quantum dot production for solar power generation

    sdavis
    1 Oct 2014 | 2:14 pm
    Quantum Materials Corp today announced that it is scaling volume production of photoactive quantum dots for use in next-generation photovoltaic solar power technologies. While offering numerous advantages for solar power generation, the high cost and difficulty of producing large quantities of quantum dots with which to develop thin film solar cells has until now kept them from commercial utilization and acceptance. The company is also seeking partners for pilot thin-film quantum dot solar cell factories with Quantum Materials’ automated quantum dot production system supplying the…
  • Boston Semi Equipment creates industry’s largest independent ATE organization

    sdavis
    1 Oct 2014 | 12:48 pm
    Boston Semi Equipment LLC (BSE) today announced it has combined all of its automated test equipment (ATE) businesses under the Boston Semi Equipment brand name. Effective immediately, the Test Advantage Hardware and MVTS Technologies businesses will operate using the Boston Semi Equipment name. This follows the company’s announcement in July that it was integrating all sales and service for ATE, Prober and Test Handler products into the Boston Semi Equipment field sales organization. Boston Semi Equipment has now built an organization of tester, handler and prober integration…
  • SEMICON Japan features “World of IoT”

    sdavis
    1 Oct 2014 | 12:00 pm
    Today, SEMI opens registration for the SEMICON Japan 2014 exposition and programs through its website at www.semiconjapan.org. SEMICON Japan 2014, Japan’s largest exhibition for the microelectronics manufacturing supply chain, will take place at Tokyo Big Sight in the Tokyo metropolitan area on December 3-5. For the first time, SEMICON Japan will feature a show-within-a-show  “World of IoT” to showcase applications and technologies of companies enabling the IoT revolution, including Toyota Motor, Intel, IBM, Toshiba and Cisco. “Japan is a key region for the semiconductor industry,…
  • All directions are not created equal for nanoscale heat sources

    sdavis
    1 Oct 2014 | 11:14 am
    Thermal considerations are rapidly becoming one of the most serious design constraints in microelectronics, especially on submicron scale lengths. A study by researchers from the University of Illinois at Urbana-Champaign has shown that standard thermal models will lead to the wrong answer in a three-dimensional heat-transfer problem if the dimensions of the heating element are on the order of one micron or smaller. “As materials shrink, the rules governing heat transfer change as well,” explained David Cahill, a professor of materials science and engineering at Illinois.
  • add this feed to my.Alltop

    Solid State Technology

  • FlipChip International creates 250 multi-product wafer bump designs

    sdavis
    1 Oct 2014 | 2:20 pm
    FlipChip International (FCI), a developer of flip chip bumping and advanced wafer level packaging technologies, announced that their engineering team had completed design and production of the 250th Multi-Product Wafer Bump design since January 2013. Multi-Product Wafer (MPW) Bump Designs are complex and challenging to create but provide a way for customers to quickly test multiple IC designs and provide samples to customers. MPW wafers have many different ICs fabricated on the same wafer. These can be design variations of a single base IC, to help optimize functional performance, or many…
  • Quantum Materials scaling up photoactive quantum dot production for solar power generation

    sdavis
    1 Oct 2014 | 2:14 pm
    Quantum Materials Corp today announced that it is scaling volume production of photoactive quantum dots for use in next-generation photovoltaic solar power technologies. While offering numerous advantages for solar power generation, the high cost and difficulty of producing large quantities of quantum dots with which to develop thin film solar cells has until now kept them from commercial utilization and acceptance. The company is also seeking partners for pilot thin-film quantum dot solar cell factories with Quantum Materials’ automated quantum dot production system supplying the…
  • Boston Semi Equipment creates industry’s largest independent ATE organization

    sdavis
    1 Oct 2014 | 12:48 pm
    Boston Semi Equipment LLC (BSE) today announced it has combined all of its automated test equipment (ATE) businesses under the Boston Semi Equipment brand name. Effective immediately, the Test Advantage Hardware and MVTS Technologies businesses will operate using the Boston Semi Equipment name. This follows the company’s announcement in July that it was integrating all sales and service for ATE, Prober and Test Handler products into the Boston Semi Equipment field sales organization. Boston Semi Equipment has now built an organization of tester, handler and prober integration…
  • SEMICON Japan features “World of IoT”

    sdavis
    1 Oct 2014 | 12:00 pm
    Today, SEMI opens registration for the SEMICON Japan 2014 exposition and programs through its website at www.semiconjapan.org. SEMICON Japan 2014, Japan’s largest exhibition for the microelectronics manufacturing supply chain, will take place at Tokyo Big Sight in the Tokyo metropolitan area on December 3-5. For the first time, SEMICON Japan will feature a show-within-a-show  “World of IoT” to showcase applications and technologies of companies enabling the IoT revolution, including Toyota Motor, Intel, IBM, Toshiba and Cisco. “Japan is a key region for the semiconductor industry,…
  • All directions are not created equal for nanoscale heat sources

    sdavis
    1 Oct 2014 | 11:14 am
    Thermal considerations are rapidly becoming one of the most serious design constraints in microelectronics, especially on submicron scale lengths. A study by researchers from the University of Illinois at Urbana-Champaign has shown that standard thermal models will lead to the wrong answer in a three-dimensional heat-transfer problem if the dimensions of the heating element are on the order of one micron or smaller. “As materials shrink, the rules governing heat transfer change as well,” explained David Cahill, a professor of materials science and engineering at Illinois.
 
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    Solid State Technology

  • FlipChip International creates 250 multi-product wafer bump designs

    sdavis
    1 Oct 2014 | 2:20 pm
    FlipChip International (FCI), a developer of flip chip bumping and advanced wafer level packaging technologies, announced that their engineering team had completed design and production of the 250th Multi-Product Wafer Bump design since January 2013. Multi-Product Wafer (MPW) Bump Designs are complex and challenging to create but provide a way for customers to quickly test multiple IC designs and provide samples to customers. MPW wafers have many different ICs fabricated on the same wafer. These can be design variations of a single base IC, to help optimize functional performance, or many…
  • Quantum Materials scaling up photoactive quantum dot production for solar power generation

    sdavis
    1 Oct 2014 | 2:14 pm
    Quantum Materials Corp today announced that it is scaling volume production of photoactive quantum dots for use in next-generation photovoltaic solar power technologies. While offering numerous advantages for solar power generation, the high cost and difficulty of producing large quantities of quantum dots with which to develop thin film solar cells has until now kept them from commercial utilization and acceptance. The company is also seeking partners for pilot thin-film quantum dot solar cell factories with Quantum Materials’ automated quantum dot production system supplying the…
  • Boston Semi Equipment creates industry’s largest independent ATE organization

    sdavis
    1 Oct 2014 | 12:48 pm
    Boston Semi Equipment LLC (BSE) today announced it has combined all of its automated test equipment (ATE) businesses under the Boston Semi Equipment brand name. Effective immediately, the Test Advantage Hardware and MVTS Technologies businesses will operate using the Boston Semi Equipment name. This follows the company’s announcement in July that it was integrating all sales and service for ATE, Prober and Test Handler products into the Boston Semi Equipment field sales organization. Boston Semi Equipment has now built an organization of tester, handler and prober integration…
  • SEMICON Japan features “World of IoT”

    sdavis
    1 Oct 2014 | 12:00 pm
    Today, SEMI opens registration for the SEMICON Japan 2014 exposition and programs through its website at www.semiconjapan.org. SEMICON Japan 2014, Japan’s largest exhibition for the microelectronics manufacturing supply chain, will take place at Tokyo Big Sight in the Tokyo metropolitan area on December 3-5. For the first time, SEMICON Japan will feature a show-within-a-show  “World of IoT” to showcase applications and technologies of companies enabling the IoT revolution, including Toyota Motor, Intel, IBM, Toshiba and Cisco. “Japan is a key region for the semiconductor industry,…
  • All directions are not created equal for nanoscale heat sources

    sdavis
    1 Oct 2014 | 11:14 am
    Thermal considerations are rapidly becoming one of the most serious design constraints in microelectronics, especially on submicron scale lengths. A study by researchers from the University of Illinois at Urbana-Champaign has shown that standard thermal models will lead to the wrong answer in a three-dimensional heat-transfer problem if the dimensions of the heating element are on the order of one micron or smaller. “As materials shrink, the rules governing heat transfer change as well,” explained David Cahill, a professor of materials science and engineering at Illinois.
  • add this feed to my.Alltop

    Solid State Technology

  • FlipChip International creates 250 multi-product wafer bump designs

    sdavis
    1 Oct 2014 | 2:20 pm
    FlipChip International (FCI), a developer of flip chip bumping and advanced wafer level packaging technologies, announced that their engineering team had completed design and production of the 250th Multi-Product Wafer Bump design since January 2013. Multi-Product Wafer (MPW) Bump Designs are complex and challenging to create but provide a way for customers to quickly test multiple IC designs and provide samples to customers. MPW wafers have many different ICs fabricated on the same wafer. These can be design variations of a single base IC, to help optimize functional performance, or many…
  • Quantum Materials scaling up photoactive quantum dot production for solar power generation

    sdavis
    1 Oct 2014 | 2:14 pm
    Quantum Materials Corp today announced that it is scaling volume production of photoactive quantum dots for use in next-generation photovoltaic solar power technologies. While offering numerous advantages for solar power generation, the high cost and difficulty of producing large quantities of quantum dots with which to develop thin film solar cells has until now kept them from commercial utilization and acceptance. The company is also seeking partners for pilot thin-film quantum dot solar cell factories with Quantum Materials’ automated quantum dot production system supplying the…
  • Boston Semi Equipment creates industry’s largest independent ATE organization

    sdavis
    1 Oct 2014 | 12:48 pm
    Boston Semi Equipment LLC (BSE) today announced it has combined all of its automated test equipment (ATE) businesses under the Boston Semi Equipment brand name. Effective immediately, the Test Advantage Hardware and MVTS Technologies businesses will operate using the Boston Semi Equipment name. This follows the company’s announcement in July that it was integrating all sales and service for ATE, Prober and Test Handler products into the Boston Semi Equipment field sales organization. Boston Semi Equipment has now built an organization of tester, handler and prober integration…
  • SEMICON Japan features “World of IoT”

    sdavis
    1 Oct 2014 | 12:00 pm
    Today, SEMI opens registration for the SEMICON Japan 2014 exposition and programs through its website at www.semiconjapan.org. SEMICON Japan 2014, Japan’s largest exhibition for the microelectronics manufacturing supply chain, will take place at Tokyo Big Sight in the Tokyo metropolitan area on December 3-5. For the first time, SEMICON Japan will feature a show-within-a-show  “World of IoT” to showcase applications and technologies of companies enabling the IoT revolution, including Toyota Motor, Intel, IBM, Toshiba and Cisco. “Japan is a key region for the semiconductor industry,…
  • All directions are not created equal for nanoscale heat sources

    sdavis
    1 Oct 2014 | 11:14 am
    Thermal considerations are rapidly becoming one of the most serious design constraints in microelectronics, especially on submicron scale lengths. A study by researchers from the University of Illinois at Urbana-Champaign has shown that standard thermal models will lead to the wrong answer in a three-dimensional heat-transfer problem if the dimensions of the heating element are on the order of one micron or smaller. “As materials shrink, the rules governing heat transfer change as well,” explained David Cahill, a professor of materials science and engineering at Illinois.
  • add this feed to my.Alltop

    Solid State Technology

  • FlipChip International creates 250 multi-product wafer bump designs

    sdavis
    1 Oct 2014 | 2:20 pm
    FlipChip International (FCI), a developer of flip chip bumping and advanced wafer level packaging technologies, announced that their engineering team had completed design and production of the 250th Multi-Product Wafer Bump design since January 2013. Multi-Product Wafer (MPW) Bump Designs are complex and challenging to create but provide a way for customers to quickly test multiple IC designs and provide samples to customers. MPW wafers have many different ICs fabricated on the same wafer. These can be design variations of a single base IC, to help optimize functional performance, or many…
  • Quantum Materials scaling up photoactive quantum dot production for solar power generation

    sdavis
    1 Oct 2014 | 2:14 pm
    Quantum Materials Corp today announced that it is scaling volume production of photoactive quantum dots for use in next-generation photovoltaic solar power technologies. While offering numerous advantages for solar power generation, the high cost and difficulty of producing large quantities of quantum dots with which to develop thin film solar cells has until now kept them from commercial utilization and acceptance. The company is also seeking partners for pilot thin-film quantum dot solar cell factories with Quantum Materials’ automated quantum dot production system supplying the…
  • Boston Semi Equipment creates industry’s largest independent ATE organization

    sdavis
    1 Oct 2014 | 12:48 pm
    Boston Semi Equipment LLC (BSE) today announced it has combined all of its automated test equipment (ATE) businesses under the Boston Semi Equipment brand name. Effective immediately, the Test Advantage Hardware and MVTS Technologies businesses will operate using the Boston Semi Equipment name. This follows the company’s announcement in July that it was integrating all sales and service for ATE, Prober and Test Handler products into the Boston Semi Equipment field sales organization. Boston Semi Equipment has now built an organization of tester, handler and prober integration…
  • SEMICON Japan features “World of IoT”

    sdavis
    1 Oct 2014 | 12:00 pm
    Today, SEMI opens registration for the SEMICON Japan 2014 exposition and programs through its website at www.semiconjapan.org. SEMICON Japan 2014, Japan’s largest exhibition for the microelectronics manufacturing supply chain, will take place at Tokyo Big Sight in the Tokyo metropolitan area on December 3-5. For the first time, SEMICON Japan will feature a show-within-a-show  “World of IoT” to showcase applications and technologies of companies enabling the IoT revolution, including Toyota Motor, Intel, IBM, Toshiba and Cisco. “Japan is a key region for the semiconductor industry,…
  • All directions are not created equal for nanoscale heat sources

    sdavis
    1 Oct 2014 | 11:14 am
    Thermal considerations are rapidly becoming one of the most serious design constraints in microelectronics, especially on submicron scale lengths. A study by researchers from the University of Illinois at Urbana-Champaign has shown that standard thermal models will lead to the wrong answer in a three-dimensional heat-transfer problem if the dimensions of the heating element are on the order of one micron or smaller. “As materials shrink, the rules governing heat transfer change as well,” explained David Cahill, a professor of materials science and engineering at Illinois.
 
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    Solid State Technology

  • FlipChip International creates 250 multi-product wafer bump designs

    sdavis
    1 Oct 2014 | 2:20 pm
    FlipChip International (FCI), a developer of flip chip bumping and advanced wafer level packaging technologies, announced that their engineering team had completed design and production of the 250th Multi-Product Wafer Bump design since January 2013. Multi-Product Wafer (MPW) Bump Designs are complex and challenging to create but provide a way for customers to quickly test multiple IC designs and provide samples to customers. MPW wafers have many different ICs fabricated on the same wafer. These can be design variations of a single base IC, to help optimize functional performance, or many…
  • Quantum Materials scaling up photoactive quantum dot production for solar power generation

    sdavis
    1 Oct 2014 | 2:14 pm
    Quantum Materials Corp today announced that it is scaling volume production of photoactive quantum dots for use in next-generation photovoltaic solar power technologies. While offering numerous advantages for solar power generation, the high cost and difficulty of producing large quantities of quantum dots with which to develop thin film solar cells has until now kept them from commercial utilization and acceptance. The company is also seeking partners for pilot thin-film quantum dot solar cell factories with Quantum Materials’ automated quantum dot production system supplying the…
  • Boston Semi Equipment creates industry’s largest independent ATE organization

    sdavis
    1 Oct 2014 | 12:48 pm
    Boston Semi Equipment LLC (BSE) today announced it has combined all of its automated test equipment (ATE) businesses under the Boston Semi Equipment brand name. Effective immediately, the Test Advantage Hardware and MVTS Technologies businesses will operate using the Boston Semi Equipment name. This follows the company’s announcement in July that it was integrating all sales and service for ATE, Prober and Test Handler products into the Boston Semi Equipment field sales organization. Boston Semi Equipment has now built an organization of tester, handler and prober integration…
  • SEMICON Japan features “World of IoT”

    sdavis
    1 Oct 2014 | 12:00 pm
    Today, SEMI opens registration for the SEMICON Japan 2014 exposition and programs through its website at www.semiconjapan.org. SEMICON Japan 2014, Japan’s largest exhibition for the microelectronics manufacturing supply chain, will take place at Tokyo Big Sight in the Tokyo metropolitan area on December 3-5. For the first time, SEMICON Japan will feature a show-within-a-show  “World of IoT” to showcase applications and technologies of companies enabling the IoT revolution, including Toyota Motor, Intel, IBM, Toshiba and Cisco. “Japan is a key region for the semiconductor industry,…
  • All directions are not created equal for nanoscale heat sources

    sdavis
    1 Oct 2014 | 11:14 am
    Thermal considerations are rapidly becoming one of the most serious design constraints in microelectronics, especially on submicron scale lengths. A study by researchers from the University of Illinois at Urbana-Champaign has shown that standard thermal models will lead to the wrong answer in a three-dimensional heat-transfer problem if the dimensions of the heating element are on the order of one micron or smaller. “As materials shrink, the rules governing heat transfer change as well,” explained David Cahill, a professor of materials science and engineering at Illinois.
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    Solid State Technology

  • FlipChip International creates 250 multi-product wafer bump designs

    sdavis
    1 Oct 2014 | 2:20 pm
    FlipChip International (FCI), a developer of flip chip bumping and advanced wafer level packaging technologies, announced that their engineering team had completed design and production of the 250th Multi-Product Wafer Bump design since January 2013. Multi-Product Wafer (MPW) Bump Designs are complex and challenging to create but provide a way for customers to quickly test multiple IC designs and provide samples to customers. MPW wafers have many different ICs fabricated on the same wafer. These can be design variations of a single base IC, to help optimize functional performance, or many…
  • Quantum Materials scaling up photoactive quantum dot production for solar power generation

    sdavis
    1 Oct 2014 | 2:14 pm
    Quantum Materials Corp today announced that it is scaling volume production of photoactive quantum dots for use in next-generation photovoltaic solar power technologies. While offering numerous advantages for solar power generation, the high cost and difficulty of producing large quantities of quantum dots with which to develop thin film solar cells has until now kept them from commercial utilization and acceptance. The company is also seeking partners for pilot thin-film quantum dot solar cell factories with Quantum Materials’ automated quantum dot production system supplying the…
  • Boston Semi Equipment creates industry’s largest independent ATE organization

    sdavis
    1 Oct 2014 | 12:48 pm
    Boston Semi Equipment LLC (BSE) today announced it has combined all of its automated test equipment (ATE) businesses under the Boston Semi Equipment brand name. Effective immediately, the Test Advantage Hardware and MVTS Technologies businesses will operate using the Boston Semi Equipment name. This follows the company’s announcement in July that it was integrating all sales and service for ATE, Prober and Test Handler products into the Boston Semi Equipment field sales organization. Boston Semi Equipment has now built an organization of tester, handler and prober integration…
  • SEMICON Japan features “World of IoT”

    sdavis
    1 Oct 2014 | 12:00 pm
    Today, SEMI opens registration for the SEMICON Japan 2014 exposition and programs through its website at www.semiconjapan.org. SEMICON Japan 2014, Japan’s largest exhibition for the microelectronics manufacturing supply chain, will take place at Tokyo Big Sight in the Tokyo metropolitan area on December 3-5. For the first time, SEMICON Japan will feature a show-within-a-show  “World of IoT” to showcase applications and technologies of companies enabling the IoT revolution, including Toyota Motor, Intel, IBM, Toshiba and Cisco. “Japan is a key region for the semiconductor industry,…
  • All directions are not created equal for nanoscale heat sources

    sdavis
    1 Oct 2014 | 11:14 am
    Thermal considerations are rapidly becoming one of the most serious design constraints in microelectronics, especially on submicron scale lengths. A study by researchers from the University of Illinois at Urbana-Champaign has shown that standard thermal models will lead to the wrong answer in a three-dimensional heat-transfer problem if the dimensions of the heating element are on the order of one micron or smaller. “As materials shrink, the rules governing heat transfer change as well,” explained David Cahill, a professor of materials science and engineering at Illinois.
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