Jetalon

 
 
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    GVEP International feed

  • Women in Senegal to benefit from new opportunities in the energy market

    Laura Nolan
    11 Dec 2014 | 5:26 am
    GVEP International and SEM Fund are joining forces to increase women’s participation in the energy market in Senegal and make sustainable energy available to the poorest communities. GVEP International and SEM Fund are joining forces to increase women’s participation in the energy market in Senegal and make sustaread more
  • Clean cooking campaign enters new phase

    alessandra
    25 Nov 2014 | 6:14 am
    Pledges of new activity worth $413m were announced by international organisations and donors at the Cookstove Futures Summit in New York on November 21st. The conference marks the start of phase two of a ten year campaign by the Global Alliance for Clean Cookstoves to bring cleaner cooking to 100 million households. Pledges of new activity worth $413m were announced by international organisations and donors at the Cookstove Futures Summit in New York on November 21st.read more
  • How improved cookstoves are changing the face of Ugandan schools

    Laura Nolan
    19 Nov 2014 | 9:27 am
    Schools in Kampala are cutting down fuel consumption by up to 50% thanks to energy efficient cookstoves, providing staff with a safer smoke-free environment and students with well-cooked, timely meals. Schools in Kampala are cutting down fuel consumption by up to 50% thanks to energy efficient cookstoves, providing staff with a safer smoke-free environment and students with well-cooked, timelread more
  • Challenges that energy businesses face in emerging economies: a survey

    Laura Nolan
    14 Nov 2014 | 5:26 am
    GVEP and Invested Development, in collaboration with Power Africa and the UN SE4All Energy Access Practitioner Network, developed and launched a survey assessing the challenges that renewable energy enterprises experience in emerging economies. Of 131 respondents, 90% operate primarily in Africa and over 50% operate in East Africa. Over 80% of responding companies employ less than 25 individuals and 75% generate up to $500,000 USD in revenue. GVEP and Invested Development, in collaboration with Power Africa and thread more
  • Energy efficient sugarcane bio-electricity plant to reduce Belize’s dependence on imported electricity

    Meghan Smith
    30 Oct 2014 | 8:08 am
    In a bid to address the energy shortage affecting the country, GSR Energy Limited (GSR) fully developed a project, a sugarcane bio-electricity plant and a bio-ethanol distillery in Belize, which will produce electricity for domestic use and ethanol for export. In a bid to address the energy shortage affecting the country, GSR Energy Limited (GSR) fully developed a project, a sugarcane bioread more
 
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    American Biotechnologist

  • Hormonal Changes In Expectant Fathers

    American Biotechnologist
    18 Dec 2014 | 9:13 am
    Impending fatherhood can lower two hormones–testosterone and estradiol–for men, even before their babies are born, a new University of Michigan study found. Other studies indicate that men’s hormones change once they become fathers, and there is some evidence that this is a function of a decline after the child’s birth. The new U-M study is the first to show that the decline may begin even earlier, during the transition to fatherhood, said Robin Edelstein, the study’s lead author. “We don’t yet know exactly why men’s hormones are…
  • 2015 NIH Budget Falls Short of Expectations

    American Biotechnologist
    17 Dec 2014 | 6:59 am
    In 2013 the buzzword for the state of affairs for scientific funding in the US was sequestration. That year saw huge hits to American government funding of the NIH and other scientific endeavors that severely hampered research activities throughout the country. In 2014, there was a slight increase in life science funding, however, it was not enough to put American research back on track to where the NIH hoped it would be. While scientists remain hopeful that 2015 will be the year of recovery, a bill released last week by the Senate Spending Subcommittee seems to suggest otherwise. While…
  • Up All Night To Get Published!

    American Biotechnologist
    16 Dec 2014 | 11:13 am
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  • Superior Profiling of Cancer, Cardiovascular, and Other Disease Biomarkers

    American Biotechnologist
    15 Dec 2014 | 7:29 am
    Bio-Plex Pro Human Inflammation Panels allow simultaneous quantification of 37 key biomarkers of inflammation.Bio-Rad Laboratories announced the launch of its new Bio-Plex Pro™ Human Inflammation Panels, multiplex immunoassays that enable detection and quantification of the most comprehensive set of key inflammation biomarkers in a single assay. Inflammation contributes to seven of the top ten causes of mortality, including heart disease, cancer, and diabetes. This underscores the critical need to identify and monitor underlying inflammation biomarkers — biochemical signs of inflammation…
  • Scientific Communication: Lessons from Penicillin

    American Biotechnologist
    11 Dec 2014 | 11:27 am
    Despite its life-saving potential, the therapeutic benefits of penicillin were not realized until a decade after its discovery. While modern advances in literature dissemination has enabled even the most obscure paper to reach the hands of thirsty scientists, our ability to process the information contained in these papers has remained limited by the capacity of the human mind. In the talk below, Dr. Andrew Su from Scripps Research Institute, proposes that the solution to the human mind bottleneck is what is colloquially known as citizen science. Bookmark It Hide Sites
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    Solid State Technology

  • IoT’s divergent needs will drive different types of technologies

    sdavis
    19 Dec 2014 | 12:49 pm
    By DAVE HEMKER, Senior Vice President and Chief Technology Officer, Lam Research Corp. Given the current buzz around the Internet of Things (IoT), it is easy to lose sight of the challenges – both economic and technical. On the economic side is the need to cost-effectively manufacture the trillions of sensors used to gather data, while on the technical side, the challenge involves building out the infrastructure. This includes enabling the transmission, storage, and analysis of volumes of data far exceeding anything we see today. These divergent needs will drive the semiconductor equipment…
  • LED manufacturing with NMP-free resist stripping

    sdavis
    19 Dec 2014 | 12:39 pm
    The use of a semi-aqueous organic film stripper and residue remover that does not contain N-Methyl-2 pyrrolidone (NMP) is compared with current NMP-based chemistry. By NIK MUSTAPHA and DR. GLENN WESTWOOD, Avantor Performance Materials, Inc. MARKUS TAN, JOACHIM NG, and YANG MING CHIEH, Philips Lumileds Singapore Philips Lumileds collaborated with Avantor Performance Materials, a global manufacturer of high-performance chemistries, to evaluate one of Avantor’s post-etch residue remover and photoresist stripper products as a replacement for a current chemistry. Avantor’s J.T. Baker…
  • The most expensive defect

    sdavis
    18 Dec 2014 | 4:57 pm
    Defects that aren’t detected inline cost fabs the most.  By DAVID W. PRICE and DOUGLAS G. SUTHERLAND, KLA-Tencor, Milpitas, CA Defect inspection tools can be expensive. But regardless of the cost of the inspection tool needed to find a defect, the fab is almost always better off financially if it can find and fix that defect inline versus at the end of line (e.g., electrical test and failure analysis). Here, we are referring to the term defect in a general sense—the same concepts also apply to metrology measurements. The third fundamental truth of process control for the semiconductor IC…
  • From transistors to bumps: Preparing SEM cross-sections by combining site-specific cleaving and broad ion milling

    sdavis
    18 Dec 2014 | 4:42 pm
    Cross section sample preparation is demonstrated using a workflow that combines High Accuracy Cleaving I(HAC) and Broad Ion Beam (BIB) milling. By TESHIMA, LatticeGear, Beaverton, OR and JAMIL J. CLARKE, Hitachi High Technologies America, Inc., Clarksburg, MD  In order to develop and manufacture new materials and processes, the cross section is essential (FIGURE 1). Cross sections allow one to visualize, measure, and characterize the chemistry of the film stack or device structures. This allows engineers to verify the integrity of devices and to make critical decisions about the process. To…
  • Book-to-bill climbs above parity in November

    sdavis
    18 Dec 2014 | 3:13 pm
    North America-based manufacturers of semiconductor equipment posted $1.22 billion in orders worldwide in November 2014 (three-month average basis) and a book-to-bill ratio of 1.02, according to the November EMDS Book-to-Bill Report published today by SEMI.   A book-to-bill of 1.02 means that $102 worth of orders were received for every $100 of product billed for the month. The three-month average of worldwide bookings in November 2014 was $1.22 billion. The bookings figure is 10.4 percent higher than the final October 2014 level of $1.10 billion, and is 1.7 percent lower than the November…
 
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    Solid State Technology

  • IoT’s divergent needs will drive different types of technologies

    sdavis
    19 Dec 2014 | 12:49 pm
    By DAVE HEMKER, Senior Vice President and Chief Technology Officer, Lam Research Corp. Given the current buzz around the Internet of Things (IoT), it is easy to lose sight of the challenges – both economic and technical. On the economic side is the need to cost-effectively manufacture the trillions of sensors used to gather data, while on the technical side, the challenge involves building out the infrastructure. This includes enabling the transmission, storage, and analysis of volumes of data far exceeding anything we see today. These divergent needs will drive the semiconductor equipment…
  • LED manufacturing with NMP-free resist stripping

    sdavis
    19 Dec 2014 | 12:39 pm
    The use of a semi-aqueous organic film stripper and residue remover that does not contain N-Methyl-2 pyrrolidone (NMP) is compared with current NMP-based chemistry. By NIK MUSTAPHA and DR. GLENN WESTWOOD, Avantor Performance Materials, Inc. MARKUS TAN, JOACHIM NG, and YANG MING CHIEH, Philips Lumileds Singapore Philips Lumileds collaborated with Avantor Performance Materials, a global manufacturer of high-performance chemistries, to evaluate one of Avantor’s post-etch residue remover and photoresist stripper products as a replacement for a current chemistry. Avantor’s J.T. Baker…
  • The most expensive defect

    sdavis
    18 Dec 2014 | 4:57 pm
    Defects that aren’t detected inline cost fabs the most.  By DAVID W. PRICE and DOUGLAS G. SUTHERLAND, KLA-Tencor, Milpitas, CA Defect inspection tools can be expensive. But regardless of the cost of the inspection tool needed to find a defect, the fab is almost always better off financially if it can find and fix that defect inline versus at the end of line (e.g., electrical test and failure analysis). Here, we are referring to the term defect in a general sense—the same concepts also apply to metrology measurements. The third fundamental truth of process control for the semiconductor IC…
  • From transistors to bumps: Preparing SEM cross-sections by combining site-specific cleaving and broad ion milling

    sdavis
    18 Dec 2014 | 4:42 pm
    Cross section sample preparation is demonstrated using a workflow that combines High Accuracy Cleaving I(HAC) and Broad Ion Beam (BIB) milling. By TESHIMA, LatticeGear, Beaverton, OR and JAMIL J. CLARKE, Hitachi High Technologies America, Inc., Clarksburg, MD  In order to develop and manufacture new materials and processes, the cross section is essential (FIGURE 1). Cross sections allow one to visualize, measure, and characterize the chemistry of the film stack or device structures. This allows engineers to verify the integrity of devices and to make critical decisions about the process. To…
  • Book-to-bill climbs above parity in November

    sdavis
    18 Dec 2014 | 3:13 pm
    North America-based manufacturers of semiconductor equipment posted $1.22 billion in orders worldwide in November 2014 (three-month average basis) and a book-to-bill ratio of 1.02, according to the November EMDS Book-to-Bill Report published today by SEMI.   A book-to-bill of 1.02 means that $102 worth of orders were received for every $100 of product billed for the month. The three-month average of worldwide bookings in November 2014 was $1.22 billion. The bookings figure is 10.4 percent higher than the final October 2014 level of $1.10 billion, and is 1.7 percent lower than the November…
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    Solid State Technology

  • IoT’s divergent needs will drive different types of technologies

    sdavis
    19 Dec 2014 | 12:49 pm
    By DAVE HEMKER, Senior Vice President and Chief Technology Officer, Lam Research Corp. Given the current buzz around the Internet of Things (IoT), it is easy to lose sight of the challenges – both economic and technical. On the economic side is the need to cost-effectively manufacture the trillions of sensors used to gather data, while on the technical side, the challenge involves building out the infrastructure. This includes enabling the transmission, storage, and analysis of volumes of data far exceeding anything we see today. These divergent needs will drive the semiconductor equipment…
  • LED manufacturing with NMP-free resist stripping

    sdavis
    19 Dec 2014 | 12:39 pm
    The use of a semi-aqueous organic film stripper and residue remover that does not contain N-Methyl-2 pyrrolidone (NMP) is compared with current NMP-based chemistry. By NIK MUSTAPHA and DR. GLENN WESTWOOD, Avantor Performance Materials, Inc. MARKUS TAN, JOACHIM NG, and YANG MING CHIEH, Philips Lumileds Singapore Philips Lumileds collaborated with Avantor Performance Materials, a global manufacturer of high-performance chemistries, to evaluate one of Avantor’s post-etch residue remover and photoresist stripper products as a replacement for a current chemistry. Avantor’s J.T. Baker…
  • The most expensive defect

    sdavis
    18 Dec 2014 | 4:57 pm
    Defects that aren’t detected inline cost fabs the most.  By DAVID W. PRICE and DOUGLAS G. SUTHERLAND, KLA-Tencor, Milpitas, CA Defect inspection tools can be expensive. But regardless of the cost of the inspection tool needed to find a defect, the fab is almost always better off financially if it can find and fix that defect inline versus at the end of line (e.g., electrical test and failure analysis). Here, we are referring to the term defect in a general sense—the same concepts also apply to metrology measurements. The third fundamental truth of process control for the semiconductor IC…
  • From transistors to bumps: Preparing SEM cross-sections by combining site-specific cleaving and broad ion milling

    sdavis
    18 Dec 2014 | 4:42 pm
    Cross section sample preparation is demonstrated using a workflow that combines High Accuracy Cleaving I(HAC) and Broad Ion Beam (BIB) milling. By TESHIMA, LatticeGear, Beaverton, OR and JAMIL J. CLARKE, Hitachi High Technologies America, Inc., Clarksburg, MD  In order to develop and manufacture new materials and processes, the cross section is essential (FIGURE 1). Cross sections allow one to visualize, measure, and characterize the chemistry of the film stack or device structures. This allows engineers to verify the integrity of devices and to make critical decisions about the process. To…
  • Book-to-bill climbs above parity in November

    sdavis
    18 Dec 2014 | 3:13 pm
    North America-based manufacturers of semiconductor equipment posted $1.22 billion in orders worldwide in November 2014 (three-month average basis) and a book-to-bill ratio of 1.02, according to the November EMDS Book-to-Bill Report published today by SEMI.   A book-to-bill of 1.02 means that $102 worth of orders were received for every $100 of product billed for the month. The three-month average of worldwide bookings in November 2014 was $1.22 billion. The bookings figure is 10.4 percent higher than the final October 2014 level of $1.10 billion, and is 1.7 percent lower than the November…
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    Solid State Technology

  • IoT’s divergent needs will drive different types of technologies

    sdavis
    19 Dec 2014 | 12:49 pm
    By DAVE HEMKER, Senior Vice President and Chief Technology Officer, Lam Research Corp. Given the current buzz around the Internet of Things (IoT), it is easy to lose sight of the challenges – both economic and technical. On the economic side is the need to cost-effectively manufacture the trillions of sensors used to gather data, while on the technical side, the challenge involves building out the infrastructure. This includes enabling the transmission, storage, and analysis of volumes of data far exceeding anything we see today. These divergent needs will drive the semiconductor equipment…
  • LED manufacturing with NMP-free resist stripping

    sdavis
    19 Dec 2014 | 12:39 pm
    The use of a semi-aqueous organic film stripper and residue remover that does not contain N-Methyl-2 pyrrolidone (NMP) is compared with current NMP-based chemistry. By NIK MUSTAPHA and DR. GLENN WESTWOOD, Avantor Performance Materials, Inc. MARKUS TAN, JOACHIM NG, and YANG MING CHIEH, Philips Lumileds Singapore Philips Lumileds collaborated with Avantor Performance Materials, a global manufacturer of high-performance chemistries, to evaluate one of Avantor’s post-etch residue remover and photoresist stripper products as a replacement for a current chemistry. Avantor’s J.T. Baker…
  • The most expensive defect

    sdavis
    18 Dec 2014 | 4:57 pm
    Defects that aren’t detected inline cost fabs the most.  By DAVID W. PRICE and DOUGLAS G. SUTHERLAND, KLA-Tencor, Milpitas, CA Defect inspection tools can be expensive. But regardless of the cost of the inspection tool needed to find a defect, the fab is almost always better off financially if it can find and fix that defect inline versus at the end of line (e.g., electrical test and failure analysis). Here, we are referring to the term defect in a general sense—the same concepts also apply to metrology measurements. The third fundamental truth of process control for the semiconductor IC…
  • From transistors to bumps: Preparing SEM cross-sections by combining site-specific cleaving and broad ion milling

    sdavis
    18 Dec 2014 | 4:42 pm
    Cross section sample preparation is demonstrated using a workflow that combines High Accuracy Cleaving I(HAC) and Broad Ion Beam (BIB) milling. By TESHIMA, LatticeGear, Beaverton, OR and JAMIL J. CLARKE, Hitachi High Technologies America, Inc., Clarksburg, MD  In order to develop and manufacture new materials and processes, the cross section is essential (FIGURE 1). Cross sections allow one to visualize, measure, and characterize the chemistry of the film stack or device structures. This allows engineers to verify the integrity of devices and to make critical decisions about the process. To…
  • Book-to-bill climbs above parity in November

    sdavis
    18 Dec 2014 | 3:13 pm
    North America-based manufacturers of semiconductor equipment posted $1.22 billion in orders worldwide in November 2014 (three-month average basis) and a book-to-bill ratio of 1.02, according to the November EMDS Book-to-Bill Report published today by SEMI.   A book-to-bill of 1.02 means that $102 worth of orders were received for every $100 of product billed for the month. The three-month average of worldwide bookings in November 2014 was $1.22 billion. The bookings figure is 10.4 percent higher than the final October 2014 level of $1.10 billion, and is 1.7 percent lower than the November…
 
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    Solid State Technology

  • IoT’s divergent needs will drive different types of technologies

    sdavis
    19 Dec 2014 | 12:49 pm
    By DAVE HEMKER, Senior Vice President and Chief Technology Officer, Lam Research Corp. Given the current buzz around the Internet of Things (IoT), it is easy to lose sight of the challenges – both economic and technical. On the economic side is the need to cost-effectively manufacture the trillions of sensors used to gather data, while on the technical side, the challenge involves building out the infrastructure. This includes enabling the transmission, storage, and analysis of volumes of data far exceeding anything we see today. These divergent needs will drive the semiconductor equipment…
  • LED manufacturing with NMP-free resist stripping

    sdavis
    19 Dec 2014 | 12:39 pm
    The use of a semi-aqueous organic film stripper and residue remover that does not contain N-Methyl-2 pyrrolidone (NMP) is compared with current NMP-based chemistry. By NIK MUSTAPHA and DR. GLENN WESTWOOD, Avantor Performance Materials, Inc. MARKUS TAN, JOACHIM NG, and YANG MING CHIEH, Philips Lumileds Singapore Philips Lumileds collaborated with Avantor Performance Materials, a global manufacturer of high-performance chemistries, to evaluate one of Avantor’s post-etch residue remover and photoresist stripper products as a replacement for a current chemistry. Avantor’s J.T. Baker…
  • The most expensive defect

    sdavis
    18 Dec 2014 | 4:57 pm
    Defects that aren’t detected inline cost fabs the most.  By DAVID W. PRICE and DOUGLAS G. SUTHERLAND, KLA-Tencor, Milpitas, CA Defect inspection tools can be expensive. But regardless of the cost of the inspection tool needed to find a defect, the fab is almost always better off financially if it can find and fix that defect inline versus at the end of line (e.g., electrical test and failure analysis). Here, we are referring to the term defect in a general sense—the same concepts also apply to metrology measurements. The third fundamental truth of process control for the semiconductor IC…
  • From transistors to bumps: Preparing SEM cross-sections by combining site-specific cleaving and broad ion milling

    sdavis
    18 Dec 2014 | 4:42 pm
    Cross section sample preparation is demonstrated using a workflow that combines High Accuracy Cleaving I(HAC) and Broad Ion Beam (BIB) milling. By TESHIMA, LatticeGear, Beaverton, OR and JAMIL J. CLARKE, Hitachi High Technologies America, Inc., Clarksburg, MD  In order to develop and manufacture new materials and processes, the cross section is essential (FIGURE 1). Cross sections allow one to visualize, measure, and characterize the chemistry of the film stack or device structures. This allows engineers to verify the integrity of devices and to make critical decisions about the process. To…
  • Book-to-bill climbs above parity in November

    sdavis
    18 Dec 2014 | 3:13 pm
    North America-based manufacturers of semiconductor equipment posted $1.22 billion in orders worldwide in November 2014 (three-month average basis) and a book-to-bill ratio of 1.02, according to the November EMDS Book-to-Bill Report published today by SEMI.   A book-to-bill of 1.02 means that $102 worth of orders were received for every $100 of product billed for the month. The three-month average of worldwide bookings in November 2014 was $1.22 billion. The bookings figure is 10.4 percent higher than the final October 2014 level of $1.10 billion, and is 1.7 percent lower than the November…
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    Solid State Technology

  • IoT’s divergent needs will drive different types of technologies

    sdavis
    19 Dec 2014 | 12:49 pm
    By DAVE HEMKER, Senior Vice President and Chief Technology Officer, Lam Research Corp. Given the current buzz around the Internet of Things (IoT), it is easy to lose sight of the challenges – both economic and technical. On the economic side is the need to cost-effectively manufacture the trillions of sensors used to gather data, while on the technical side, the challenge involves building out the infrastructure. This includes enabling the transmission, storage, and analysis of volumes of data far exceeding anything we see today. These divergent needs will drive the semiconductor equipment…
  • LED manufacturing with NMP-free resist stripping

    sdavis
    19 Dec 2014 | 12:39 pm
    The use of a semi-aqueous organic film stripper and residue remover that does not contain N-Methyl-2 pyrrolidone (NMP) is compared with current NMP-based chemistry. By NIK MUSTAPHA and DR. GLENN WESTWOOD, Avantor Performance Materials, Inc. MARKUS TAN, JOACHIM NG, and YANG MING CHIEH, Philips Lumileds Singapore Philips Lumileds collaborated with Avantor Performance Materials, a global manufacturer of high-performance chemistries, to evaluate one of Avantor’s post-etch residue remover and photoresist stripper products as a replacement for a current chemistry. Avantor’s J.T. Baker…
  • The most expensive defect

    sdavis
    18 Dec 2014 | 4:57 pm
    Defects that aren’t detected inline cost fabs the most.  By DAVID W. PRICE and DOUGLAS G. SUTHERLAND, KLA-Tencor, Milpitas, CA Defect inspection tools can be expensive. But regardless of the cost of the inspection tool needed to find a defect, the fab is almost always better off financially if it can find and fix that defect inline versus at the end of line (e.g., electrical test and failure analysis). Here, we are referring to the term defect in a general sense—the same concepts also apply to metrology measurements. The third fundamental truth of process control for the semiconductor IC…
  • From transistors to bumps: Preparing SEM cross-sections by combining site-specific cleaving and broad ion milling

    sdavis
    18 Dec 2014 | 4:42 pm
    Cross section sample preparation is demonstrated using a workflow that combines High Accuracy Cleaving I(HAC) and Broad Ion Beam (BIB) milling. By TESHIMA, LatticeGear, Beaverton, OR and JAMIL J. CLARKE, Hitachi High Technologies America, Inc., Clarksburg, MD  In order to develop and manufacture new materials and processes, the cross section is essential (FIGURE 1). Cross sections allow one to visualize, measure, and characterize the chemistry of the film stack or device structures. This allows engineers to verify the integrity of devices and to make critical decisions about the process. To…
  • Book-to-bill climbs above parity in November

    sdavis
    18 Dec 2014 | 3:13 pm
    North America-based manufacturers of semiconductor equipment posted $1.22 billion in orders worldwide in November 2014 (three-month average basis) and a book-to-bill ratio of 1.02, according to the November EMDS Book-to-Bill Report published today by SEMI.   A book-to-bill of 1.02 means that $102 worth of orders were received for every $100 of product billed for the month. The three-month average of worldwide bookings in November 2014 was $1.22 billion. The bookings figure is 10.4 percent higher than the final October 2014 level of $1.10 billion, and is 1.7 percent lower than the November…
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    Solid State Technology

  • IoT’s divergent needs will drive different types of technologies

    sdavis
    19 Dec 2014 | 12:49 pm
    By DAVE HEMKER, Senior Vice President and Chief Technology Officer, Lam Research Corp. Given the current buzz around the Internet of Things (IoT), it is easy to lose sight of the challenges – both economic and technical. On the economic side is the need to cost-effectively manufacture the trillions of sensors used to gather data, while on the technical side, the challenge involves building out the infrastructure. This includes enabling the transmission, storage, and analysis of volumes of data far exceeding anything we see today. These divergent needs will drive the semiconductor equipment…
  • LED manufacturing with NMP-free resist stripping

    sdavis
    19 Dec 2014 | 12:39 pm
    The use of a semi-aqueous organic film stripper and residue remover that does not contain N-Methyl-2 pyrrolidone (NMP) is compared with current NMP-based chemistry. By NIK MUSTAPHA and DR. GLENN WESTWOOD, Avantor Performance Materials, Inc. MARKUS TAN, JOACHIM NG, and YANG MING CHIEH, Philips Lumileds Singapore Philips Lumileds collaborated with Avantor Performance Materials, a global manufacturer of high-performance chemistries, to evaluate one of Avantor’s post-etch residue remover and photoresist stripper products as a replacement for a current chemistry. Avantor’s J.T. Baker…
  • The most expensive defect

    sdavis
    18 Dec 2014 | 4:57 pm
    Defects that aren’t detected inline cost fabs the most.  By DAVID W. PRICE and DOUGLAS G. SUTHERLAND, KLA-Tencor, Milpitas, CA Defect inspection tools can be expensive. But regardless of the cost of the inspection tool needed to find a defect, the fab is almost always better off financially if it can find and fix that defect inline versus at the end of line (e.g., electrical test and failure analysis). Here, we are referring to the term defect in a general sense—the same concepts also apply to metrology measurements. The third fundamental truth of process control for the semiconductor IC…
  • From transistors to bumps: Preparing SEM cross-sections by combining site-specific cleaving and broad ion milling

    sdavis
    18 Dec 2014 | 4:42 pm
    Cross section sample preparation is demonstrated using a workflow that combines High Accuracy Cleaving I(HAC) and Broad Ion Beam (BIB) milling. By TESHIMA, LatticeGear, Beaverton, OR and JAMIL J. CLARKE, Hitachi High Technologies America, Inc., Clarksburg, MD  In order to develop and manufacture new materials and processes, the cross section is essential (FIGURE 1). Cross sections allow one to visualize, measure, and characterize the chemistry of the film stack or device structures. This allows engineers to verify the integrity of devices and to make critical decisions about the process. To…
  • Book-to-bill climbs above parity in November

    sdavis
    18 Dec 2014 | 3:13 pm
    North America-based manufacturers of semiconductor equipment posted $1.22 billion in orders worldwide in November 2014 (three-month average basis) and a book-to-bill ratio of 1.02, according to the November EMDS Book-to-Bill Report published today by SEMI.   A book-to-bill of 1.02 means that $102 worth of orders were received for every $100 of product billed for the month. The three-month average of worldwide bookings in November 2014 was $1.22 billion. The bookings figure is 10.4 percent higher than the final October 2014 level of $1.10 billion, and is 1.7 percent lower than the November…
 
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    Solid State Technology

  • IoT’s divergent needs will drive different types of technologies

    sdavis
    19 Dec 2014 | 12:49 pm
    By DAVE HEMKER, Senior Vice President and Chief Technology Officer, Lam Research Corp. Given the current buzz around the Internet of Things (IoT), it is easy to lose sight of the challenges – both economic and technical. On the economic side is the need to cost-effectively manufacture the trillions of sensors used to gather data, while on the technical side, the challenge involves building out the infrastructure. This includes enabling the transmission, storage, and analysis of volumes of data far exceeding anything we see today. These divergent needs will drive the semiconductor equipment…
  • LED manufacturing with NMP-free resist stripping

    sdavis
    19 Dec 2014 | 12:39 pm
    The use of a semi-aqueous organic film stripper and residue remover that does not contain N-Methyl-2 pyrrolidone (NMP) is compared with current NMP-based chemistry. By NIK MUSTAPHA and DR. GLENN WESTWOOD, Avantor Performance Materials, Inc. MARKUS TAN, JOACHIM NG, and YANG MING CHIEH, Philips Lumileds Singapore Philips Lumileds collaborated with Avantor Performance Materials, a global manufacturer of high-performance chemistries, to evaluate one of Avantor’s post-etch residue remover and photoresist stripper products as a replacement for a current chemistry. Avantor’s J.T. Baker…
  • The most expensive defect

    sdavis
    18 Dec 2014 | 4:57 pm
    Defects that aren’t detected inline cost fabs the most.  By DAVID W. PRICE and DOUGLAS G. SUTHERLAND, KLA-Tencor, Milpitas, CA Defect inspection tools can be expensive. But regardless of the cost of the inspection tool needed to find a defect, the fab is almost always better off financially if it can find and fix that defect inline versus at the end of line (e.g., electrical test and failure analysis). Here, we are referring to the term defect in a general sense—the same concepts also apply to metrology measurements. The third fundamental truth of process control for the semiconductor IC…
  • From transistors to bumps: Preparing SEM cross-sections by combining site-specific cleaving and broad ion milling

    sdavis
    18 Dec 2014 | 4:42 pm
    Cross section sample preparation is demonstrated using a workflow that combines High Accuracy Cleaving I(HAC) and Broad Ion Beam (BIB) milling. By TESHIMA, LatticeGear, Beaverton, OR and JAMIL J. CLARKE, Hitachi High Technologies America, Inc., Clarksburg, MD  In order to develop and manufacture new materials and processes, the cross section is essential (FIGURE 1). Cross sections allow one to visualize, measure, and characterize the chemistry of the film stack or device structures. This allows engineers to verify the integrity of devices and to make critical decisions about the process. To…
  • Book-to-bill climbs above parity in November

    sdavis
    18 Dec 2014 | 3:13 pm
    North America-based manufacturers of semiconductor equipment posted $1.22 billion in orders worldwide in November 2014 (three-month average basis) and a book-to-bill ratio of 1.02, according to the November EMDS Book-to-Bill Report published today by SEMI.   A book-to-bill of 1.02 means that $102 worth of orders were received for every $100 of product billed for the month. The three-month average of worldwide bookings in November 2014 was $1.22 billion. The bookings figure is 10.4 percent higher than the final October 2014 level of $1.10 billion, and is 1.7 percent lower than the November…
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    Solid State Technology

  • IoT’s divergent needs will drive different types of technologies

    sdavis
    19 Dec 2014 | 12:49 pm
    By DAVE HEMKER, Senior Vice President and Chief Technology Officer, Lam Research Corp. Given the current buzz around the Internet of Things (IoT), it is easy to lose sight of the challenges – both economic and technical. On the economic side is the need to cost-effectively manufacture the trillions of sensors used to gather data, while on the technical side, the challenge involves building out the infrastructure. This includes enabling the transmission, storage, and analysis of volumes of data far exceeding anything we see today. These divergent needs will drive the semiconductor equipment…
  • LED manufacturing with NMP-free resist stripping

    sdavis
    19 Dec 2014 | 12:39 pm
    The use of a semi-aqueous organic film stripper and residue remover that does not contain N-Methyl-2 pyrrolidone (NMP) is compared with current NMP-based chemistry. By NIK MUSTAPHA and DR. GLENN WESTWOOD, Avantor Performance Materials, Inc. MARKUS TAN, JOACHIM NG, and YANG MING CHIEH, Philips Lumileds Singapore Philips Lumileds collaborated with Avantor Performance Materials, a global manufacturer of high-performance chemistries, to evaluate one of Avantor’s post-etch residue remover and photoresist stripper products as a replacement for a current chemistry. Avantor’s J.T. Baker…
  • The most expensive defect

    sdavis
    18 Dec 2014 | 4:57 pm
    Defects that aren’t detected inline cost fabs the most.  By DAVID W. PRICE and DOUGLAS G. SUTHERLAND, KLA-Tencor, Milpitas, CA Defect inspection tools can be expensive. But regardless of the cost of the inspection tool needed to find a defect, the fab is almost always better off financially if it can find and fix that defect inline versus at the end of line (e.g., electrical test and failure analysis). Here, we are referring to the term defect in a general sense—the same concepts also apply to metrology measurements. The third fundamental truth of process control for the semiconductor IC…
  • From transistors to bumps: Preparing SEM cross-sections by combining site-specific cleaving and broad ion milling

    sdavis
    18 Dec 2014 | 4:42 pm
    Cross section sample preparation is demonstrated using a workflow that combines High Accuracy Cleaving I(HAC) and Broad Ion Beam (BIB) milling. By TESHIMA, LatticeGear, Beaverton, OR and JAMIL J. CLARKE, Hitachi High Technologies America, Inc., Clarksburg, MD  In order to develop and manufacture new materials and processes, the cross section is essential (FIGURE 1). Cross sections allow one to visualize, measure, and characterize the chemistry of the film stack or device structures. This allows engineers to verify the integrity of devices and to make critical decisions about the process. To…
  • Book-to-bill climbs above parity in November

    sdavis
    18 Dec 2014 | 3:13 pm
    North America-based manufacturers of semiconductor equipment posted $1.22 billion in orders worldwide in November 2014 (three-month average basis) and a book-to-bill ratio of 1.02, according to the November EMDS Book-to-Bill Report published today by SEMI.   A book-to-bill of 1.02 means that $102 worth of orders were received for every $100 of product billed for the month. The three-month average of worldwide bookings in November 2014 was $1.22 billion. The bookings figure is 10.4 percent higher than the final October 2014 level of $1.10 billion, and is 1.7 percent lower than the November…
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    Solid State Technology

  • IoT’s divergent needs will drive different types of technologies

    sdavis
    19 Dec 2014 | 12:49 pm
    By DAVE HEMKER, Senior Vice President and Chief Technology Officer, Lam Research Corp. Given the current buzz around the Internet of Things (IoT), it is easy to lose sight of the challenges – both economic and technical. On the economic side is the need to cost-effectively manufacture the trillions of sensors used to gather data, while on the technical side, the challenge involves building out the infrastructure. This includes enabling the transmission, storage, and analysis of volumes of data far exceeding anything we see today. These divergent needs will drive the semiconductor equipment…
  • LED manufacturing with NMP-free resist stripping

    sdavis
    19 Dec 2014 | 12:39 pm
    The use of a semi-aqueous organic film stripper and residue remover that does not contain N-Methyl-2 pyrrolidone (NMP) is compared with current NMP-based chemistry. By NIK MUSTAPHA and DR. GLENN WESTWOOD, Avantor Performance Materials, Inc. MARKUS TAN, JOACHIM NG, and YANG MING CHIEH, Philips Lumileds Singapore Philips Lumileds collaborated with Avantor Performance Materials, a global manufacturer of high-performance chemistries, to evaluate one of Avantor’s post-etch residue remover and photoresist stripper products as a replacement for a current chemistry. Avantor’s J.T. Baker…
  • The most expensive defect

    sdavis
    18 Dec 2014 | 4:57 pm
    Defects that aren’t detected inline cost fabs the most.  By DAVID W. PRICE and DOUGLAS G. SUTHERLAND, KLA-Tencor, Milpitas, CA Defect inspection tools can be expensive. But regardless of the cost of the inspection tool needed to find a defect, the fab is almost always better off financially if it can find and fix that defect inline versus at the end of line (e.g., electrical test and failure analysis). Here, we are referring to the term defect in a general sense—the same concepts also apply to metrology measurements. The third fundamental truth of process control for the semiconductor IC…
  • From transistors to bumps: Preparing SEM cross-sections by combining site-specific cleaving and broad ion milling

    sdavis
    18 Dec 2014 | 4:42 pm
    Cross section sample preparation is demonstrated using a workflow that combines High Accuracy Cleaving I(HAC) and Broad Ion Beam (BIB) milling. By TESHIMA, LatticeGear, Beaverton, OR and JAMIL J. CLARKE, Hitachi High Technologies America, Inc., Clarksburg, MD  In order to develop and manufacture new materials and processes, the cross section is essential (FIGURE 1). Cross sections allow one to visualize, measure, and characterize the chemistry of the film stack or device structures. This allows engineers to verify the integrity of devices and to make critical decisions about the process. To…
  • Book-to-bill climbs above parity in November

    sdavis
    18 Dec 2014 | 3:13 pm
    North America-based manufacturers of semiconductor equipment posted $1.22 billion in orders worldwide in November 2014 (three-month average basis) and a book-to-bill ratio of 1.02, according to the November EMDS Book-to-Bill Report published today by SEMI.   A book-to-bill of 1.02 means that $102 worth of orders were received for every $100 of product billed for the month. The three-month average of worldwide bookings in November 2014 was $1.22 billion. The bookings figure is 10.4 percent higher than the final October 2014 level of $1.10 billion, and is 1.7 percent lower than the November…
 
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    Solid State Technology

  • IoT’s divergent needs will drive different types of technologies

    sdavis
    19 Dec 2014 | 12:49 pm
    By DAVE HEMKER, Senior Vice President and Chief Technology Officer, Lam Research Corp. Given the current buzz around the Internet of Things (IoT), it is easy to lose sight of the challenges – both economic and technical. On the economic side is the need to cost-effectively manufacture the trillions of sensors used to gather data, while on the technical side, the challenge involves building out the infrastructure. This includes enabling the transmission, storage, and analysis of volumes of data far exceeding anything we see today. These divergent needs will drive the semiconductor equipment…
  • LED manufacturing with NMP-free resist stripping

    sdavis
    19 Dec 2014 | 12:39 pm
    The use of a semi-aqueous organic film stripper and residue remover that does not contain N-Methyl-2 pyrrolidone (NMP) is compared with current NMP-based chemistry. By NIK MUSTAPHA and DR. GLENN WESTWOOD, Avantor Performance Materials, Inc. MARKUS TAN, JOACHIM NG, and YANG MING CHIEH, Philips Lumileds Singapore Philips Lumileds collaborated with Avantor Performance Materials, a global manufacturer of high-performance chemistries, to evaluate one of Avantor’s post-etch residue remover and photoresist stripper products as a replacement for a current chemistry. Avantor’s J.T. Baker…
  • The most expensive defect

    sdavis
    18 Dec 2014 | 4:57 pm
    Defects that aren’t detected inline cost fabs the most.  By DAVID W. PRICE and DOUGLAS G. SUTHERLAND, KLA-Tencor, Milpitas, CA Defect inspection tools can be expensive. But regardless of the cost of the inspection tool needed to find a defect, the fab is almost always better off financially if it can find and fix that defect inline versus at the end of line (e.g., electrical test and failure analysis). Here, we are referring to the term defect in a general sense—the same concepts also apply to metrology measurements. The third fundamental truth of process control for the semiconductor IC…
  • From transistors to bumps: Preparing SEM cross-sections by combining site-specific cleaving and broad ion milling

    sdavis
    18 Dec 2014 | 4:42 pm
    Cross section sample preparation is demonstrated using a workflow that combines High Accuracy Cleaving I(HAC) and Broad Ion Beam (BIB) milling. By TESHIMA, LatticeGear, Beaverton, OR and JAMIL J. CLARKE, Hitachi High Technologies America, Inc., Clarksburg, MD  In order to develop and manufacture new materials and processes, the cross section is essential (FIGURE 1). Cross sections allow one to visualize, measure, and characterize the chemistry of the film stack or device structures. This allows engineers to verify the integrity of devices and to make critical decisions about the process. To…
  • Book-to-bill climbs above parity in November

    sdavis
    18 Dec 2014 | 3:13 pm
    North America-based manufacturers of semiconductor equipment posted $1.22 billion in orders worldwide in November 2014 (three-month average basis) and a book-to-bill ratio of 1.02, according to the November EMDS Book-to-Bill Report published today by SEMI.   A book-to-bill of 1.02 means that $102 worth of orders were received for every $100 of product billed for the month. The three-month average of worldwide bookings in November 2014 was $1.22 billion. The bookings figure is 10.4 percent higher than the final October 2014 level of $1.10 billion, and is 1.7 percent lower than the November…
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    Solid State Technology

  • IoT’s divergent needs will drive different types of technologies

    sdavis
    19 Dec 2014 | 12:49 pm
    By DAVE HEMKER, Senior Vice President and Chief Technology Officer, Lam Research Corp. Given the current buzz around the Internet of Things (IoT), it is easy to lose sight of the challenges – both economic and technical. On the economic side is the need to cost-effectively manufacture the trillions of sensors used to gather data, while on the technical side, the challenge involves building out the infrastructure. This includes enabling the transmission, storage, and analysis of volumes of data far exceeding anything we see today. These divergent needs will drive the semiconductor equipment…
  • LED manufacturing with NMP-free resist stripping

    sdavis
    19 Dec 2014 | 12:39 pm
    The use of a semi-aqueous organic film stripper and residue remover that does not contain N-Methyl-2 pyrrolidone (NMP) is compared with current NMP-based chemistry. By NIK MUSTAPHA and DR. GLENN WESTWOOD, Avantor Performance Materials, Inc. MARKUS TAN, JOACHIM NG, and YANG MING CHIEH, Philips Lumileds Singapore Philips Lumileds collaborated with Avantor Performance Materials, a global manufacturer of high-performance chemistries, to evaluate one of Avantor’s post-etch residue remover and photoresist stripper products as a replacement for a current chemistry. Avantor’s J.T. Baker…
  • The most expensive defect

    sdavis
    18 Dec 2014 | 4:57 pm
    Defects that aren’t detected inline cost fabs the most.  By DAVID W. PRICE and DOUGLAS G. SUTHERLAND, KLA-Tencor, Milpitas, CA Defect inspection tools can be expensive. But regardless of the cost of the inspection tool needed to find a defect, the fab is almost always better off financially if it can find and fix that defect inline versus at the end of line (e.g., electrical test and failure analysis). Here, we are referring to the term defect in a general sense—the same concepts also apply to metrology measurements. The third fundamental truth of process control for the semiconductor IC…
  • From transistors to bumps: Preparing SEM cross-sections by combining site-specific cleaving and broad ion milling

    sdavis
    18 Dec 2014 | 4:42 pm
    Cross section sample preparation is demonstrated using a workflow that combines High Accuracy Cleaving I(HAC) and Broad Ion Beam (BIB) milling. By TESHIMA, LatticeGear, Beaverton, OR and JAMIL J. CLARKE, Hitachi High Technologies America, Inc., Clarksburg, MD  In order to develop and manufacture new materials and processes, the cross section is essential (FIGURE 1). Cross sections allow one to visualize, measure, and characterize the chemistry of the film stack or device structures. This allows engineers to verify the integrity of devices and to make critical decisions about the process. To…
  • Book-to-bill climbs above parity in November

    sdavis
    18 Dec 2014 | 3:13 pm
    North America-based manufacturers of semiconductor equipment posted $1.22 billion in orders worldwide in November 2014 (three-month average basis) and a book-to-bill ratio of 1.02, according to the November EMDS Book-to-Bill Report published today by SEMI.   A book-to-bill of 1.02 means that $102 worth of orders were received for every $100 of product billed for the month. The three-month average of worldwide bookings in November 2014 was $1.22 billion. The bookings figure is 10.4 percent higher than the final October 2014 level of $1.10 billion, and is 1.7 percent lower than the November…
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    Solid State Technology

  • IoT’s divergent needs will drive different types of technologies

    sdavis
    19 Dec 2014 | 12:49 pm
    By DAVE HEMKER, Senior Vice President and Chief Technology Officer, Lam Research Corp. Given the current buzz around the Internet of Things (IoT), it is easy to lose sight of the challenges – both economic and technical. On the economic side is the need to cost-effectively manufacture the trillions of sensors used to gather data, while on the technical side, the challenge involves building out the infrastructure. This includes enabling the transmission, storage, and analysis of volumes of data far exceeding anything we see today. These divergent needs will drive the semiconductor equipment…
  • LED manufacturing with NMP-free resist stripping

    sdavis
    19 Dec 2014 | 12:39 pm
    The use of a semi-aqueous organic film stripper and residue remover that does not contain N-Methyl-2 pyrrolidone (NMP) is compared with current NMP-based chemistry. By NIK MUSTAPHA and DR. GLENN WESTWOOD, Avantor Performance Materials, Inc. MARKUS TAN, JOACHIM NG, and YANG MING CHIEH, Philips Lumileds Singapore Philips Lumileds collaborated with Avantor Performance Materials, a global manufacturer of high-performance chemistries, to evaluate one of Avantor’s post-etch residue remover and photoresist stripper products as a replacement for a current chemistry. Avantor’s J.T. Baker…
  • The most expensive defect

    sdavis
    18 Dec 2014 | 4:57 pm
    Defects that aren’t detected inline cost fabs the most.  By DAVID W. PRICE and DOUGLAS G. SUTHERLAND, KLA-Tencor, Milpitas, CA Defect inspection tools can be expensive. But regardless of the cost of the inspection tool needed to find a defect, the fab is almost always better off financially if it can find and fix that defect inline versus at the end of line (e.g., electrical test and failure analysis). Here, we are referring to the term defect in a general sense—the same concepts also apply to metrology measurements. The third fundamental truth of process control for the semiconductor IC…
  • From transistors to bumps: Preparing SEM cross-sections by combining site-specific cleaving and broad ion milling

    sdavis
    18 Dec 2014 | 4:42 pm
    Cross section sample preparation is demonstrated using a workflow that combines High Accuracy Cleaving I(HAC) and Broad Ion Beam (BIB) milling. By TESHIMA, LatticeGear, Beaverton, OR and JAMIL J. CLARKE, Hitachi High Technologies America, Inc., Clarksburg, MD  In order to develop and manufacture new materials and processes, the cross section is essential (FIGURE 1). Cross sections allow one to visualize, measure, and characterize the chemistry of the film stack or device structures. This allows engineers to verify the integrity of devices and to make critical decisions about the process. To…
  • Book-to-bill climbs above parity in November

    sdavis
    18 Dec 2014 | 3:13 pm
    North America-based manufacturers of semiconductor equipment posted $1.22 billion in orders worldwide in November 2014 (three-month average basis) and a book-to-bill ratio of 1.02, according to the November EMDS Book-to-Bill Report published today by SEMI.   A book-to-bill of 1.02 means that $102 worth of orders were received for every $100 of product billed for the month. The three-month average of worldwide bookings in November 2014 was $1.22 billion. The bookings figure is 10.4 percent higher than the final October 2014 level of $1.10 billion, and is 1.7 percent lower than the November…
 
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    Solid State Technology

  • IoT’s divergent needs will drive different types of technologies

    sdavis
    19 Dec 2014 | 12:49 pm
    By DAVE HEMKER, Senior Vice President and Chief Technology Officer, Lam Research Corp. Given the current buzz around the Internet of Things (IoT), it is easy to lose sight of the challenges – both economic and technical. On the economic side is the need to cost-effectively manufacture the trillions of sensors used to gather data, while on the technical side, the challenge involves building out the infrastructure. This includes enabling the transmission, storage, and analysis of volumes of data far exceeding anything we see today. These divergent needs will drive the semiconductor equipment…
  • LED manufacturing with NMP-free resist stripping

    sdavis
    19 Dec 2014 | 12:39 pm
    The use of a semi-aqueous organic film stripper and residue remover that does not contain N-Methyl-2 pyrrolidone (NMP) is compared with current NMP-based chemistry. By NIK MUSTAPHA and DR. GLENN WESTWOOD, Avantor Performance Materials, Inc. MARKUS TAN, JOACHIM NG, and YANG MING CHIEH, Philips Lumileds Singapore Philips Lumileds collaborated with Avantor Performance Materials, a global manufacturer of high-performance chemistries, to evaluate one of Avantor’s post-etch residue remover and photoresist stripper products as a replacement for a current chemistry. Avantor’s J.T. Baker…
  • The most expensive defect

    sdavis
    18 Dec 2014 | 4:57 pm
    Defects that aren’t detected inline cost fabs the most.  By DAVID W. PRICE and DOUGLAS G. SUTHERLAND, KLA-Tencor, Milpitas, CA Defect inspection tools can be expensive. But regardless of the cost of the inspection tool needed to find a defect, the fab is almost always better off financially if it can find and fix that defect inline versus at the end of line (e.g., electrical test and failure analysis). Here, we are referring to the term defect in a general sense—the same concepts also apply to metrology measurements. The third fundamental truth of process control for the semiconductor IC…
  • From transistors to bumps: Preparing SEM cross-sections by combining site-specific cleaving and broad ion milling

    sdavis
    18 Dec 2014 | 4:42 pm
    Cross section sample preparation is demonstrated using a workflow that combines High Accuracy Cleaving I(HAC) and Broad Ion Beam (BIB) milling. By TESHIMA, LatticeGear, Beaverton, OR and JAMIL J. CLARKE, Hitachi High Technologies America, Inc., Clarksburg, MD  In order to develop and manufacture new materials and processes, the cross section is essential (FIGURE 1). Cross sections allow one to visualize, measure, and characterize the chemistry of the film stack or device structures. This allows engineers to verify the integrity of devices and to make critical decisions about the process. To…
  • Book-to-bill climbs above parity in November

    sdavis
    18 Dec 2014 | 3:13 pm
    North America-based manufacturers of semiconductor equipment posted $1.22 billion in orders worldwide in November 2014 (three-month average basis) and a book-to-bill ratio of 1.02, according to the November EMDS Book-to-Bill Report published today by SEMI.   A book-to-bill of 1.02 means that $102 worth of orders were received for every $100 of product billed for the month. The three-month average of worldwide bookings in November 2014 was $1.22 billion. The bookings figure is 10.4 percent higher than the final October 2014 level of $1.10 billion, and is 1.7 percent lower than the November…
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    Solid State Technology

  • IoT’s divergent needs will drive different types of technologies

    sdavis
    19 Dec 2014 | 12:49 pm
    By DAVE HEMKER, Senior Vice President and Chief Technology Officer, Lam Research Corp. Given the current buzz around the Internet of Things (IoT), it is easy to lose sight of the challenges – both economic and technical. On the economic side is the need to cost-effectively manufacture the trillions of sensors used to gather data, while on the technical side, the challenge involves building out the infrastructure. This includes enabling the transmission, storage, and analysis of volumes of data far exceeding anything we see today. These divergent needs will drive the semiconductor equipment…
  • LED manufacturing with NMP-free resist stripping

    sdavis
    19 Dec 2014 | 12:39 pm
    The use of a semi-aqueous organic film stripper and residue remover that does not contain N-Methyl-2 pyrrolidone (NMP) is compared with current NMP-based chemistry. By NIK MUSTAPHA and DR. GLENN WESTWOOD, Avantor Performance Materials, Inc. MARKUS TAN, JOACHIM NG, and YANG MING CHIEH, Philips Lumileds Singapore Philips Lumileds collaborated with Avantor Performance Materials, a global manufacturer of high-performance chemistries, to evaluate one of Avantor’s post-etch residue remover and photoresist stripper products as a replacement for a current chemistry. Avantor’s J.T. Baker…
  • The most expensive defect

    sdavis
    18 Dec 2014 | 4:57 pm
    Defects that aren’t detected inline cost fabs the most.  By DAVID W. PRICE and DOUGLAS G. SUTHERLAND, KLA-Tencor, Milpitas, CA Defect inspection tools can be expensive. But regardless of the cost of the inspection tool needed to find a defect, the fab is almost always better off financially if it can find and fix that defect inline versus at the end of line (e.g., electrical test and failure analysis). Here, we are referring to the term defect in a general sense—the same concepts also apply to metrology measurements. The third fundamental truth of process control for the semiconductor IC…
  • From transistors to bumps: Preparing SEM cross-sections by combining site-specific cleaving and broad ion milling

    sdavis
    18 Dec 2014 | 4:42 pm
    Cross section sample preparation is demonstrated using a workflow that combines High Accuracy Cleaving I(HAC) and Broad Ion Beam (BIB) milling. By TESHIMA, LatticeGear, Beaverton, OR and JAMIL J. CLARKE, Hitachi High Technologies America, Inc., Clarksburg, MD  In order to develop and manufacture new materials and processes, the cross section is essential (FIGURE 1). Cross sections allow one to visualize, measure, and characterize the chemistry of the film stack or device structures. This allows engineers to verify the integrity of devices and to make critical decisions about the process. To…
  • Book-to-bill climbs above parity in November

    sdavis
    18 Dec 2014 | 3:13 pm
    North America-based manufacturers of semiconductor equipment posted $1.22 billion in orders worldwide in November 2014 (three-month average basis) and a book-to-bill ratio of 1.02, according to the November EMDS Book-to-Bill Report published today by SEMI.   A book-to-bill of 1.02 means that $102 worth of orders were received for every $100 of product billed for the month. The three-month average of worldwide bookings in November 2014 was $1.22 billion. The bookings figure is 10.4 percent higher than the final October 2014 level of $1.10 billion, and is 1.7 percent lower than the November…
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    Solid State Technology

  • IoT’s divergent needs will drive different types of technologies

    sdavis
    19 Dec 2014 | 12:49 pm
    By DAVE HEMKER, Senior Vice President and Chief Technology Officer, Lam Research Corp. Given the current buzz around the Internet of Things (IoT), it is easy to lose sight of the challenges – both economic and technical. On the economic side is the need to cost-effectively manufacture the trillions of sensors used to gather data, while on the technical side, the challenge involves building out the infrastructure. This includes enabling the transmission, storage, and analysis of volumes of data far exceeding anything we see today. These divergent needs will drive the semiconductor equipment…
  • LED manufacturing with NMP-free resist stripping

    sdavis
    19 Dec 2014 | 12:39 pm
    The use of a semi-aqueous organic film stripper and residue remover that does not contain N-Methyl-2 pyrrolidone (NMP) is compared with current NMP-based chemistry. By NIK MUSTAPHA and DR. GLENN WESTWOOD, Avantor Performance Materials, Inc. MARKUS TAN, JOACHIM NG, and YANG MING CHIEH, Philips Lumileds Singapore Philips Lumileds collaborated with Avantor Performance Materials, a global manufacturer of high-performance chemistries, to evaluate one of Avantor’s post-etch residue remover and photoresist stripper products as a replacement for a current chemistry. Avantor’s J.T. Baker…
  • The most expensive defect

    sdavis
    18 Dec 2014 | 4:57 pm
    Defects that aren’t detected inline cost fabs the most.  By DAVID W. PRICE and DOUGLAS G. SUTHERLAND, KLA-Tencor, Milpitas, CA Defect inspection tools can be expensive. But regardless of the cost of the inspection tool needed to find a defect, the fab is almost always better off financially if it can find and fix that defect inline versus at the end of line (e.g., electrical test and failure analysis). Here, we are referring to the term defect in a general sense—the same concepts also apply to metrology measurements. The third fundamental truth of process control for the semiconductor IC…
  • From transistors to bumps: Preparing SEM cross-sections by combining site-specific cleaving and broad ion milling

    sdavis
    18 Dec 2014 | 4:42 pm
    Cross section sample preparation is demonstrated using a workflow that combines High Accuracy Cleaving I(HAC) and Broad Ion Beam (BIB) milling. By TESHIMA, LatticeGear, Beaverton, OR and JAMIL J. CLARKE, Hitachi High Technologies America, Inc., Clarksburg, MD  In order to develop and manufacture new materials and processes, the cross section is essential (FIGURE 1). Cross sections allow one to visualize, measure, and characterize the chemistry of the film stack or device structures. This allows engineers to verify the integrity of devices and to make critical decisions about the process. To…
  • Book-to-bill climbs above parity in November

    sdavis
    18 Dec 2014 | 3:13 pm
    North America-based manufacturers of semiconductor equipment posted $1.22 billion in orders worldwide in November 2014 (three-month average basis) and a book-to-bill ratio of 1.02, according to the November EMDS Book-to-Bill Report published today by SEMI.   A book-to-bill of 1.02 means that $102 worth of orders were received for every $100 of product billed for the month. The three-month average of worldwide bookings in November 2014 was $1.22 billion. The bookings figure is 10.4 percent higher than the final October 2014 level of $1.10 billion, and is 1.7 percent lower than the November…
 
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    Solid State Technology

  • IoT’s divergent needs will drive different types of technologies

    sdavis
    19 Dec 2014 | 12:49 pm
    By DAVE HEMKER, Senior Vice President and Chief Technology Officer, Lam Research Corp. Given the current buzz around the Internet of Things (IoT), it is easy to lose sight of the challenges – both economic and technical. On the economic side is the need to cost-effectively manufacture the trillions of sensors used to gather data, while on the technical side, the challenge involves building out the infrastructure. This includes enabling the transmission, storage, and analysis of volumes of data far exceeding anything we see today. These divergent needs will drive the semiconductor equipment…
  • LED manufacturing with NMP-free resist stripping

    sdavis
    19 Dec 2014 | 12:39 pm
    The use of a semi-aqueous organic film stripper and residue remover that does not contain N-Methyl-2 pyrrolidone (NMP) is compared with current NMP-based chemistry. By NIK MUSTAPHA and DR. GLENN WESTWOOD, Avantor Performance Materials, Inc. MARKUS TAN, JOACHIM NG, and YANG MING CHIEH, Philips Lumileds Singapore Philips Lumileds collaborated with Avantor Performance Materials, a global manufacturer of high-performance chemistries, to evaluate one of Avantor’s post-etch residue remover and photoresist stripper products as a replacement for a current chemistry. Avantor’s J.T. Baker…
  • The most expensive defect

    sdavis
    18 Dec 2014 | 4:57 pm
    Defects that aren’t detected inline cost fabs the most.  By DAVID W. PRICE and DOUGLAS G. SUTHERLAND, KLA-Tencor, Milpitas, CA Defect inspection tools can be expensive. But regardless of the cost of the inspection tool needed to find a defect, the fab is almost always better off financially if it can find and fix that defect inline versus at the end of line (e.g., electrical test and failure analysis). Here, we are referring to the term defect in a general sense—the same concepts also apply to metrology measurements. The third fundamental truth of process control for the semiconductor IC…
  • From transistors to bumps: Preparing SEM cross-sections by combining site-specific cleaving and broad ion milling

    sdavis
    18 Dec 2014 | 4:42 pm
    Cross section sample preparation is demonstrated using a workflow that combines High Accuracy Cleaving I(HAC) and Broad Ion Beam (BIB) milling. By TESHIMA, LatticeGear, Beaverton, OR and JAMIL J. CLARKE, Hitachi High Technologies America, Inc., Clarksburg, MD  In order to develop and manufacture new materials and processes, the cross section is essential (FIGURE 1). Cross sections allow one to visualize, measure, and characterize the chemistry of the film stack or device structures. This allows engineers to verify the integrity of devices and to make critical decisions about the process. To…
  • Book-to-bill climbs above parity in November

    sdavis
    18 Dec 2014 | 3:13 pm
    North America-based manufacturers of semiconductor equipment posted $1.22 billion in orders worldwide in November 2014 (three-month average basis) and a book-to-bill ratio of 1.02, according to the November EMDS Book-to-Bill Report published today by SEMI.   A book-to-bill of 1.02 means that $102 worth of orders were received for every $100 of product billed for the month. The three-month average of worldwide bookings in November 2014 was $1.22 billion. The bookings figure is 10.4 percent higher than the final October 2014 level of $1.10 billion, and is 1.7 percent lower than the November…
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    Solid State Technology

  • IoT’s divergent needs will drive different types of technologies

    sdavis
    19 Dec 2014 | 12:49 pm
    By DAVE HEMKER, Senior Vice President and Chief Technology Officer, Lam Research Corp. Given the current buzz around the Internet of Things (IoT), it is easy to lose sight of the challenges – both economic and technical. On the economic side is the need to cost-effectively manufacture the trillions of sensors used to gather data, while on the technical side, the challenge involves building out the infrastructure. This includes enabling the transmission, storage, and analysis of volumes of data far exceeding anything we see today. These divergent needs will drive the semiconductor equipment…
  • LED manufacturing with NMP-free resist stripping

    sdavis
    19 Dec 2014 | 12:39 pm
    The use of a semi-aqueous organic film stripper and residue remover that does not contain N-Methyl-2 pyrrolidone (NMP) is compared with current NMP-based chemistry. By NIK MUSTAPHA and DR. GLENN WESTWOOD, Avantor Performance Materials, Inc. MARKUS TAN, JOACHIM NG, and YANG MING CHIEH, Philips Lumileds Singapore Philips Lumileds collaborated with Avantor Performance Materials, a global manufacturer of high-performance chemistries, to evaluate one of Avantor’s post-etch residue remover and photoresist stripper products as a replacement for a current chemistry. Avantor’s J.T. Baker…
  • The most expensive defect

    sdavis
    18 Dec 2014 | 4:57 pm
    Defects that aren’t detected inline cost fabs the most.  By DAVID W. PRICE and DOUGLAS G. SUTHERLAND, KLA-Tencor, Milpitas, CA Defect inspection tools can be expensive. But regardless of the cost of the inspection tool needed to find a defect, the fab is almost always better off financially if it can find and fix that defect inline versus at the end of line (e.g., electrical test and failure analysis). Here, we are referring to the term defect in a general sense—the same concepts also apply to metrology measurements. The third fundamental truth of process control for the semiconductor IC…
  • From transistors to bumps: Preparing SEM cross-sections by combining site-specific cleaving and broad ion milling

    sdavis
    18 Dec 2014 | 4:42 pm
    Cross section sample preparation is demonstrated using a workflow that combines High Accuracy Cleaving I(HAC) and Broad Ion Beam (BIB) milling. By TESHIMA, LatticeGear, Beaverton, OR and JAMIL J. CLARKE, Hitachi High Technologies America, Inc., Clarksburg, MD  In order to develop and manufacture new materials and processes, the cross section is essential (FIGURE 1). Cross sections allow one to visualize, measure, and characterize the chemistry of the film stack or device structures. This allows engineers to verify the integrity of devices and to make critical decisions about the process. To…
  • Book-to-bill climbs above parity in November

    sdavis
    18 Dec 2014 | 3:13 pm
    North America-based manufacturers of semiconductor equipment posted $1.22 billion in orders worldwide in November 2014 (three-month average basis) and a book-to-bill ratio of 1.02, according to the November EMDS Book-to-Bill Report published today by SEMI.   A book-to-bill of 1.02 means that $102 worth of orders were received for every $100 of product billed for the month. The three-month average of worldwide bookings in November 2014 was $1.22 billion. The bookings figure is 10.4 percent higher than the final October 2014 level of $1.10 billion, and is 1.7 percent lower than the November…
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    Solid State Technology

  • IoT’s divergent needs will drive different types of technologies

    sdavis
    19 Dec 2014 | 12:49 pm
    By DAVE HEMKER, Senior Vice President and Chief Technology Officer, Lam Research Corp. Given the current buzz around the Internet of Things (IoT), it is easy to lose sight of the challenges – both economic and technical. On the economic side is the need to cost-effectively manufacture the trillions of sensors used to gather data, while on the technical side, the challenge involves building out the infrastructure. This includes enabling the transmission, storage, and analysis of volumes of data far exceeding anything we see today. These divergent needs will drive the semiconductor equipment…
  • LED manufacturing with NMP-free resist stripping

    sdavis
    19 Dec 2014 | 12:39 pm
    The use of a semi-aqueous organic film stripper and residue remover that does not contain N-Methyl-2 pyrrolidone (NMP) is compared with current NMP-based chemistry. By NIK MUSTAPHA and DR. GLENN WESTWOOD, Avantor Performance Materials, Inc. MARKUS TAN, JOACHIM NG, and YANG MING CHIEH, Philips Lumileds Singapore Philips Lumileds collaborated with Avantor Performance Materials, a global manufacturer of high-performance chemistries, to evaluate one of Avantor’s post-etch residue remover and photoresist stripper products as a replacement for a current chemistry. Avantor’s J.T. Baker…
  • The most expensive defect

    sdavis
    18 Dec 2014 | 4:57 pm
    Defects that aren’t detected inline cost fabs the most.  By DAVID W. PRICE and DOUGLAS G. SUTHERLAND, KLA-Tencor, Milpitas, CA Defect inspection tools can be expensive. But regardless of the cost of the inspection tool needed to find a defect, the fab is almost always better off financially if it can find and fix that defect inline versus at the end of line (e.g., electrical test and failure analysis). Here, we are referring to the term defect in a general sense—the same concepts also apply to metrology measurements. The third fundamental truth of process control for the semiconductor IC…
  • From transistors to bumps: Preparing SEM cross-sections by combining site-specific cleaving and broad ion milling

    sdavis
    18 Dec 2014 | 4:42 pm
    Cross section sample preparation is demonstrated using a workflow that combines High Accuracy Cleaving I(HAC) and Broad Ion Beam (BIB) milling. By TESHIMA, LatticeGear, Beaverton, OR and JAMIL J. CLARKE, Hitachi High Technologies America, Inc., Clarksburg, MD  In order to develop and manufacture new materials and processes, the cross section is essential (FIGURE 1). Cross sections allow one to visualize, measure, and characterize the chemistry of the film stack or device structures. This allows engineers to verify the integrity of devices and to make critical decisions about the process. To…
  • Book-to-bill climbs above parity in November

    sdavis
    18 Dec 2014 | 3:13 pm
    North America-based manufacturers of semiconductor equipment posted $1.22 billion in orders worldwide in November 2014 (three-month average basis) and a book-to-bill ratio of 1.02, according to the November EMDS Book-to-Bill Report published today by SEMI.   A book-to-bill of 1.02 means that $102 worth of orders were received for every $100 of product billed for the month. The three-month average of worldwide bookings in November 2014 was $1.22 billion. The bookings figure is 10.4 percent higher than the final October 2014 level of $1.10 billion, and is 1.7 percent lower than the November…
 
  • add this feed to my.Alltop

    Solid State Technology

  • IoT’s divergent needs will drive different types of technologies

    sdavis
    19 Dec 2014 | 12:49 pm
    By DAVE HEMKER, Senior Vice President and Chief Technology Officer, Lam Research Corp. Given the current buzz around the Internet of Things (IoT), it is easy to lose sight of the challenges – both economic and technical. On the economic side is the need to cost-effectively manufacture the trillions of sensors used to gather data, while on the technical side, the challenge involves building out the infrastructure. This includes enabling the transmission, storage, and analysis of volumes of data far exceeding anything we see today. These divergent needs will drive the semiconductor equipment…
  • LED manufacturing with NMP-free resist stripping

    sdavis
    19 Dec 2014 | 12:39 pm
    The use of a semi-aqueous organic film stripper and residue remover that does not contain N-Methyl-2 pyrrolidone (NMP) is compared with current NMP-based chemistry. By NIK MUSTAPHA and DR. GLENN WESTWOOD, Avantor Performance Materials, Inc. MARKUS TAN, JOACHIM NG, and YANG MING CHIEH, Philips Lumileds Singapore Philips Lumileds collaborated with Avantor Performance Materials, a global manufacturer of high-performance chemistries, to evaluate one of Avantor’s post-etch residue remover and photoresist stripper products as a replacement for a current chemistry. Avantor’s J.T. Baker…
  • The most expensive defect

    sdavis
    18 Dec 2014 | 4:57 pm
    Defects that aren’t detected inline cost fabs the most.  By DAVID W. PRICE and DOUGLAS G. SUTHERLAND, KLA-Tencor, Milpitas, CA Defect inspection tools can be expensive. But regardless of the cost of the inspection tool needed to find a defect, the fab is almost always better off financially if it can find and fix that defect inline versus at the end of line (e.g., electrical test and failure analysis). Here, we are referring to the term defect in a general sense—the same concepts also apply to metrology measurements. The third fundamental truth of process control for the semiconductor IC…
  • From transistors to bumps: Preparing SEM cross-sections by combining site-specific cleaving and broad ion milling

    sdavis
    18 Dec 2014 | 4:42 pm
    Cross section sample preparation is demonstrated using a workflow that combines High Accuracy Cleaving I(HAC) and Broad Ion Beam (BIB) milling. By TESHIMA, LatticeGear, Beaverton, OR and JAMIL J. CLARKE, Hitachi High Technologies America, Inc., Clarksburg, MD  In order to develop and manufacture new materials and processes, the cross section is essential (FIGURE 1). Cross sections allow one to visualize, measure, and characterize the chemistry of the film stack or device structures. This allows engineers to verify the integrity of devices and to make critical decisions about the process. To…
  • Book-to-bill climbs above parity in November

    sdavis
    18 Dec 2014 | 3:13 pm
    North America-based manufacturers of semiconductor equipment posted $1.22 billion in orders worldwide in November 2014 (three-month average basis) and a book-to-bill ratio of 1.02, according to the November EMDS Book-to-Bill Report published today by SEMI.   A book-to-bill of 1.02 means that $102 worth of orders were received for every $100 of product billed for the month. The three-month average of worldwide bookings in November 2014 was $1.22 billion. The bookings figure is 10.4 percent higher than the final October 2014 level of $1.10 billion, and is 1.7 percent lower than the November…
  • add this feed to my.Alltop

    Solid State Technology

  • IoT’s divergent needs will drive different types of technologies

    sdavis
    19 Dec 2014 | 12:49 pm
    By DAVE HEMKER, Senior Vice President and Chief Technology Officer, Lam Research Corp. Given the current buzz around the Internet of Things (IoT), it is easy to lose sight of the challenges – both economic and technical. On the economic side is the need to cost-effectively manufacture the trillions of sensors used to gather data, while on the technical side, the challenge involves building out the infrastructure. This includes enabling the transmission, storage, and analysis of volumes of data far exceeding anything we see today. These divergent needs will drive the semiconductor equipment…
  • LED manufacturing with NMP-free resist stripping

    sdavis
    19 Dec 2014 | 12:39 pm
    The use of a semi-aqueous organic film stripper and residue remover that does not contain N-Methyl-2 pyrrolidone (NMP) is compared with current NMP-based chemistry. By NIK MUSTAPHA and DR. GLENN WESTWOOD, Avantor Performance Materials, Inc. MARKUS TAN, JOACHIM NG, and YANG MING CHIEH, Philips Lumileds Singapore Philips Lumileds collaborated with Avantor Performance Materials, a global manufacturer of high-performance chemistries, to evaluate one of Avantor’s post-etch residue remover and photoresist stripper products as a replacement for a current chemistry. Avantor’s J.T. Baker…
  • The most expensive defect

    sdavis
    18 Dec 2014 | 4:57 pm
    Defects that aren’t detected inline cost fabs the most.  By DAVID W. PRICE and DOUGLAS G. SUTHERLAND, KLA-Tencor, Milpitas, CA Defect inspection tools can be expensive. But regardless of the cost of the inspection tool needed to find a defect, the fab is almost always better off financially if it can find and fix that defect inline versus at the end of line (e.g., electrical test and failure analysis). Here, we are referring to the term defect in a general sense—the same concepts also apply to metrology measurements. The third fundamental truth of process control for the semiconductor IC…
  • From transistors to bumps: Preparing SEM cross-sections by combining site-specific cleaving and broad ion milling

    sdavis
    18 Dec 2014 | 4:42 pm
    Cross section sample preparation is demonstrated using a workflow that combines High Accuracy Cleaving I(HAC) and Broad Ion Beam (BIB) milling. By TESHIMA, LatticeGear, Beaverton, OR and JAMIL J. CLARKE, Hitachi High Technologies America, Inc., Clarksburg, MD  In order to develop and manufacture new materials and processes, the cross section is essential (FIGURE 1). Cross sections allow one to visualize, measure, and characterize the chemistry of the film stack or device structures. This allows engineers to verify the integrity of devices and to make critical decisions about the process. To…
  • Book-to-bill climbs above parity in November

    sdavis
    18 Dec 2014 | 3:13 pm
    North America-based manufacturers of semiconductor equipment posted $1.22 billion in orders worldwide in November 2014 (three-month average basis) and a book-to-bill ratio of 1.02, according to the November EMDS Book-to-Bill Report published today by SEMI.   A book-to-bill of 1.02 means that $102 worth of orders were received for every $100 of product billed for the month. The three-month average of worldwide bookings in November 2014 was $1.22 billion. The bookings figure is 10.4 percent higher than the final October 2014 level of $1.10 billion, and is 1.7 percent lower than the November…
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