Jetalon

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  • PPD Appoints Corporate Development SVP

    Contract Pharma - Breaking News
    21 Apr 2014 | 10:00 pm
    De Silva brings 15 years of biopharma experience
  • Innovators Deliver Flexible Environments

    Pharma Manufacturing
    22 Apr 2014 | 2:33 pm
    G-CON’s cleanroom PODS speed construction and commissioning of DARPA’s scalable vaccine facilities
  • Jinko Solar partners with Proinso India

    Renewable Energy Focus - Latest News
    22 Apr 2014 | 3:00 am
    As part of the deal, Proinso will begin distributing JinkoSolar solar PV modules through its extensive sales network in India.
  • Off-grid lighting companies awarded grants to benefit Kenya’s poorest

    GVEP International feed
    Deborah
    22 Apr 2014 | 7:33 am
    Eight off-grid lighting (OGL) distributors have been awarded grants in an effort to increase access to reliable and affordable OGL solutions for the Bottom of the Pyramid. Eight off-grid lighting (OGL) distributors have been awarded grants in an effort to increase access to reliable and affordable OGL solutions for the Bottom of the Pyramid.read more
  • KNF Lab interviewed at analytica 2014

    European Pharmaceutical Review
    Nicholas Jackson
    22 Apr 2014 | 2:57 am
    Freddy White speaks with Jim Findlay, Marketing Manager, KNF Lab at analytica 2014...
 
 
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    GVEP International feed

  • Off-grid lighting companies awarded grants to benefit Kenya’s poorest

    Deborah
    22 Apr 2014 | 7:33 am
    Eight off-grid lighting (OGL) distributors have been awarded grants in an effort to increase access to reliable and affordable OGL solutions for the Bottom of the Pyramid. Eight off-grid lighting (OGL) distributors have been awarded grants in an effort to increase access to reliable and affordable OGL solutions for the Bottom of the Pyramid.read more
  • New cookstove designs offer improved performance

    Deborah
    4 Apr 2014 | 5:24 am
    Through the Spark Fund Project in Kenya, GVEP has been working with local stove entrepreneurs to develop new biomass (wood & charcoal) cookstove designs for domestic use. The new stove designs will offer greater efficiency, reduced emissions, and improved safety and durability compared to other local existing models. Through the Spark Fund Project in Kenya, GVEP has been working with local stove entrepreneurread more
  • GVEP Advisory Services client selected to pitch at prestigious Amsterdam investor conference

    alessandra
    3 Apr 2014 | 5:01 am
    A Tanzanian mini-grids project whose financing process is being supported by GVEP Advisory Services has been selected to pitch at Pymwymic's Impact Days conference in Amsterdam in April. A Tanzanian mini-grids project whose financing process is being supported by GVEP Advisory Services has been selected to pitch at Pymwymic's Impact Days conference in Amsterdam in April.
  • Innovative IDEAS increasing self-sufficiency and access to renewable energy in the Caribbean

    Meghan Smith
    26 Mar 2014 | 10:12 am
    In Jamaica and Suriname, two award winning businesses are transforming the lives of those living in under-served and off-grid communities. By implementing sustainable energy solutions they promote self-sufficiency, job creation, provision of 24/7 electricity and increased economic development. In Jamaica and Suriname, two award winning businesses are transforming the lives of those living in under-served and off-grid communities.read more
  • Caribbean biogas company to provide energy from waste to housing development in Jamaica

    Meghan Smith
    13 Mar 2014 | 10:23 am
    CaribShare, a social enterprise delivering energy-from-waste solutions has signed a contract to power a new housing development in Jamaica. The deal will help to strengthen the livelihoods of rural communities through sustainable waste management and clean energy generation. CaribShare, a social eread more
 
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    American Biotechnologist

  • 2-D Electrophoresis Tips & Tricks – Part I

    American Biotechnologist
    22 Apr 2014 | 12:24 pm
    Bookmark It Hide Sites
  • Why Geneticists May Have to Learn Yet Another Language

    American Biotechnologist
    17 Apr 2014 | 2:34 pm
    When talking about genetic abnormalities at the DNA level that occur when chromosomes swap, delete or add parts, there is an evolving communication gap both in the science and medical worlds, leading to inconsistencies in clinical and research reports. Now a study by researchers at Brigham and Women’s Hospital (BWH) proposes a new classification system that may standardize how structural chromosomal rearrangements are described. Known as Next-Gen Cytogenetic Nomenclature, it is a major contribution to the classification system to potentially revolutionize how cytogeneticists worldwide…
  • Queerer Than We Suppose

    American Biotechnologist
    16 Apr 2014 | 12:48 pm
    Classic Dawkins Style Bookmark It Hide Sites
  • Transforming Cancer Research: Droplet Digital™ PCR Plays Integral Role at Fred Hutchinson Cancer Research Center

    American Biotechnologist
    15 Apr 2014 | 1:52 pm
    It’s no surprise that Droplet Digital PCR (ddPCR) has found its place in the world of cancer research. Bio-Rad’s ddPCR™ technology has a remarkable ability to quantify miniscule amounts of target DNA and RNA, and thus can contribute to early detection of rare tumorigenic mutations against a high background of “normal” DNA as well as to other applications, including identifying cancer subtypes, optimizing drug treatment plans, and studying tumor evolution. At the Fred Hutchinson Cancer Research Center in Seattle, scientists are producing some of the most important advances in…
  • The Story of Man (told in one minute)

    American Biotechnologist
    14 Apr 2014 | 3:59 am
    Bookmark It Hide Sites
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    Solid State Technology

  • Contour Semiconductor names former Intel exec as new CEO

    sdavis
    22 Apr 2014 | 12:04 pm
    Contour Semiconductor, Inc., a provider dedicated to producing low-cost, high-volume, non-volatile memory chips, today announced that it has appointed veteran semiconductor industry executive Saul Zales as Chief Executive Officer.  Zales will lead Contour’s development of next generation non-volatile chips, addressing the $25 billion NAND flash memory market opportunity with a technology that is cheaper, higher-performance and simpler to produce than flash. Zales has 28 years of experience in all management aspects of the semiconductor industry, including engineering, marketing,…
  • High-performance, low-cost ultracapacitors built with graphene and carbon nanotubes

    sdavis
    22 Apr 2014 | 10:42 am
    By combining the powers of two single-atom-thick carbon structures, researchers at the George Washington University’s Micro-propulsion and Nanotechnology Laboratory have created a new ultracapacitor that is both high performance and low cost. The device, described in the Journal of Applied Physics, capitalizes on the synergy brought by mixing graphene flakes with single-walled carbon nanotubes, two carbon nanostructures with complementary properties. Ultracapacitors are souped-up energy storage devices that hold high amounts of energy and can also quickly release that energy in a surge…
  • STS Semiconductor and Invensas to partner on high volume bond via array mobile solutions

    sdavis
    22 Apr 2014 | 10:22 am
    Tessera Technologies, Inc. announced today that Invensas Corporation and South Korea-based STS Semiconductor & Telecommunications, a semiconductor assembly and test solution provider, have entered into an agreement to validate high volume manufacturing capability for Invensas’ Bond Via Array (BVATM) technology for next generation smartphone and tablet customers. BVA is a proven advanced package-on-package (PoP) technology for System on Chip (SOC) and memory integration in mobile devices. Styled as a “Bridge Technology to 3DIC,” it is a unique solution that utilizes…
  • New technology symposium at SEMICON West 2014 to spotlight critical issues in semiconductor manufacturing

    sdavis
    22 Apr 2014 | 10:03 am
    SEMI has announced the new Semiconductor Technology Symposium (STS), to be held July 8-10 as part of the SEMICON West 2014 (www.semiconwest.org) technical and business program agenda. The new program addressing the most important and critical issues facing the future of semiconductor manufacturing in a new and more technical conference format. The three-day STS conference is a comprehensive technology and business conference addressing the key issues driving the future of semiconductor manufacturing and markets. Aligned with the latest inputs from technology roadmaps, sessions at the STS will…
  • “Exotic” material is like a switch when super thin

    sdavis
    21 Apr 2014 | 4:52 pm
    Researchers from Cornell University and Brookhaven National Laboratory have shown how to switch a particular transition metal oxide, a lanthanum nickelate (LaNiO3), from a metal to an insulator by making the material less than a nanometer thick. Ever-shrinking electronic devices could get down to atomic dimensions with the help of transition metal oxides, a class of materials that seems to have it all: superconductivity, magnetoresistance and other exotic properties. These possibilities have scientists excited to understand everything about these materials, and to find new ways to control…
 
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    Solid State Technology

  • Contour Semiconductor names former Intel exec as new CEO

    sdavis
    22 Apr 2014 | 12:04 pm
    Contour Semiconductor, Inc., a provider dedicated to producing low-cost, high-volume, non-volatile memory chips, today announced that it has appointed veteran semiconductor industry executive Saul Zales as Chief Executive Officer.  Zales will lead Contour’s development of next generation non-volatile chips, addressing the $25 billion NAND flash memory market opportunity with a technology that is cheaper, higher-performance and simpler to produce than flash. Zales has 28 years of experience in all management aspects of the semiconductor industry, including engineering, marketing,…
  • High-performance, low-cost ultracapacitors built with graphene and carbon nanotubes

    sdavis
    22 Apr 2014 | 10:42 am
    By combining the powers of two single-atom-thick carbon structures, researchers at the George Washington University’s Micro-propulsion and Nanotechnology Laboratory have created a new ultracapacitor that is both high performance and low cost. The device, described in the Journal of Applied Physics, capitalizes on the synergy brought by mixing graphene flakes with single-walled carbon nanotubes, two carbon nanostructures with complementary properties. Ultracapacitors are souped-up energy storage devices that hold high amounts of energy and can also quickly release that energy in a surge…
  • STS Semiconductor and Invensas to partner on high volume bond via array mobile solutions

    sdavis
    22 Apr 2014 | 10:22 am
    Tessera Technologies, Inc. announced today that Invensas Corporation and South Korea-based STS Semiconductor & Telecommunications, a semiconductor assembly and test solution provider, have entered into an agreement to validate high volume manufacturing capability for Invensas’ Bond Via Array (BVATM) technology for next generation smartphone and tablet customers. BVA is a proven advanced package-on-package (PoP) technology for System on Chip (SOC) and memory integration in mobile devices. Styled as a “Bridge Technology to 3DIC,” it is a unique solution that utilizes…
  • New technology symposium at SEMICON West 2014 to spotlight critical issues in semiconductor manufacturing

    sdavis
    22 Apr 2014 | 10:03 am
    SEMI has announced the new Semiconductor Technology Symposium (STS), to be held July 8-10 as part of the SEMICON West 2014 (www.semiconwest.org) technical and business program agenda. The new program addressing the most important and critical issues facing the future of semiconductor manufacturing in a new and more technical conference format. The three-day STS conference is a comprehensive technology and business conference addressing the key issues driving the future of semiconductor manufacturing and markets. Aligned with the latest inputs from technology roadmaps, sessions at the STS will…
  • “Exotic” material is like a switch when super thin

    sdavis
    21 Apr 2014 | 4:52 pm
    Researchers from Cornell University and Brookhaven National Laboratory have shown how to switch a particular transition metal oxide, a lanthanum nickelate (LaNiO3), from a metal to an insulator by making the material less than a nanometer thick. Ever-shrinking electronic devices could get down to atomic dimensions with the help of transition metal oxides, a class of materials that seems to have it all: superconductivity, magnetoresistance and other exotic properties. These possibilities have scientists excited to understand everything about these materials, and to find new ways to control…
  • add this feed to my.Alltop

    Solid State Technology

  • Contour Semiconductor names former Intel exec as new CEO

    sdavis
    22 Apr 2014 | 12:04 pm
    Contour Semiconductor, Inc., a provider dedicated to producing low-cost, high-volume, non-volatile memory chips, today announced that it has appointed veteran semiconductor industry executive Saul Zales as Chief Executive Officer.  Zales will lead Contour’s development of next generation non-volatile chips, addressing the $25 billion NAND flash memory market opportunity with a technology that is cheaper, higher-performance and simpler to produce than flash. Zales has 28 years of experience in all management aspects of the semiconductor industry, including engineering, marketing,…
  • High-performance, low-cost ultracapacitors built with graphene and carbon nanotubes

    sdavis
    22 Apr 2014 | 10:42 am
    By combining the powers of two single-atom-thick carbon structures, researchers at the George Washington University’s Micro-propulsion and Nanotechnology Laboratory have created a new ultracapacitor that is both high performance and low cost. The device, described in the Journal of Applied Physics, capitalizes on the synergy brought by mixing graphene flakes with single-walled carbon nanotubes, two carbon nanostructures with complementary properties. Ultracapacitors are souped-up energy storage devices that hold high amounts of energy and can also quickly release that energy in a surge…
  • STS Semiconductor and Invensas to partner on high volume bond via array mobile solutions

    sdavis
    22 Apr 2014 | 10:22 am
    Tessera Technologies, Inc. announced today that Invensas Corporation and South Korea-based STS Semiconductor & Telecommunications, a semiconductor assembly and test solution provider, have entered into an agreement to validate high volume manufacturing capability for Invensas’ Bond Via Array (BVATM) technology for next generation smartphone and tablet customers. BVA is a proven advanced package-on-package (PoP) technology for System on Chip (SOC) and memory integration in mobile devices. Styled as a “Bridge Technology to 3DIC,” it is a unique solution that utilizes…
  • New technology symposium at SEMICON West 2014 to spotlight critical issues in semiconductor manufacturing

    sdavis
    22 Apr 2014 | 10:03 am
    SEMI has announced the new Semiconductor Technology Symposium (STS), to be held July 8-10 as part of the SEMICON West 2014 (www.semiconwest.org) technical and business program agenda. The new program addressing the most important and critical issues facing the future of semiconductor manufacturing in a new and more technical conference format. The three-day STS conference is a comprehensive technology and business conference addressing the key issues driving the future of semiconductor manufacturing and markets. Aligned with the latest inputs from technology roadmaps, sessions at the STS will…
  • “Exotic” material is like a switch when super thin

    sdavis
    21 Apr 2014 | 4:52 pm
    Researchers from Cornell University and Brookhaven National Laboratory have shown how to switch a particular transition metal oxide, a lanthanum nickelate (LaNiO3), from a metal to an insulator by making the material less than a nanometer thick. Ever-shrinking electronic devices could get down to atomic dimensions with the help of transition metal oxides, a class of materials that seems to have it all: superconductivity, magnetoresistance and other exotic properties. These possibilities have scientists excited to understand everything about these materials, and to find new ways to control…
  • add this feed to my.Alltop

    Solid State Technology

  • Contour Semiconductor names former Intel exec as new CEO

    sdavis
    22 Apr 2014 | 12:04 pm
    Contour Semiconductor, Inc., a provider dedicated to producing low-cost, high-volume, non-volatile memory chips, today announced that it has appointed veteran semiconductor industry executive Saul Zales as Chief Executive Officer.  Zales will lead Contour’s development of next generation non-volatile chips, addressing the $25 billion NAND flash memory market opportunity with a technology that is cheaper, higher-performance and simpler to produce than flash. Zales has 28 years of experience in all management aspects of the semiconductor industry, including engineering, marketing,…
  • High-performance, low-cost ultracapacitors built with graphene and carbon nanotubes

    sdavis
    22 Apr 2014 | 10:42 am
    By combining the powers of two single-atom-thick carbon structures, researchers at the George Washington University’s Micro-propulsion and Nanotechnology Laboratory have created a new ultracapacitor that is both high performance and low cost. The device, described in the Journal of Applied Physics, capitalizes on the synergy brought by mixing graphene flakes with single-walled carbon nanotubes, two carbon nanostructures with complementary properties. Ultracapacitors are souped-up energy storage devices that hold high amounts of energy and can also quickly release that energy in a surge…
  • STS Semiconductor and Invensas to partner on high volume bond via array mobile solutions

    sdavis
    22 Apr 2014 | 10:22 am
    Tessera Technologies, Inc. announced today that Invensas Corporation and South Korea-based STS Semiconductor & Telecommunications, a semiconductor assembly and test solution provider, have entered into an agreement to validate high volume manufacturing capability for Invensas’ Bond Via Array (BVATM) technology for next generation smartphone and tablet customers. BVA is a proven advanced package-on-package (PoP) technology for System on Chip (SOC) and memory integration in mobile devices. Styled as a “Bridge Technology to 3DIC,” it is a unique solution that utilizes…
  • New technology symposium at SEMICON West 2014 to spotlight critical issues in semiconductor manufacturing

    sdavis
    22 Apr 2014 | 10:03 am
    SEMI has announced the new Semiconductor Technology Symposium (STS), to be held July 8-10 as part of the SEMICON West 2014 (www.semiconwest.org) technical and business program agenda. The new program addressing the most important and critical issues facing the future of semiconductor manufacturing in a new and more technical conference format. The three-day STS conference is a comprehensive technology and business conference addressing the key issues driving the future of semiconductor manufacturing and markets. Aligned with the latest inputs from technology roadmaps, sessions at the STS will…
  • “Exotic” material is like a switch when super thin

    sdavis
    21 Apr 2014 | 4:52 pm
    Researchers from Cornell University and Brookhaven National Laboratory have shown how to switch a particular transition metal oxide, a lanthanum nickelate (LaNiO3), from a metal to an insulator by making the material less than a nanometer thick. Ever-shrinking electronic devices could get down to atomic dimensions with the help of transition metal oxides, a class of materials that seems to have it all: superconductivity, magnetoresistance and other exotic properties. These possibilities have scientists excited to understand everything about these materials, and to find new ways to control…
 
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    Solid State Technology

  • Contour Semiconductor names former Intel exec as new CEO

    sdavis
    22 Apr 2014 | 12:04 pm
    Contour Semiconductor, Inc., a provider dedicated to producing low-cost, high-volume, non-volatile memory chips, today announced that it has appointed veteran semiconductor industry executive Saul Zales as Chief Executive Officer.  Zales will lead Contour’s development of next generation non-volatile chips, addressing the $25 billion NAND flash memory market opportunity with a technology that is cheaper, higher-performance and simpler to produce than flash. Zales has 28 years of experience in all management aspects of the semiconductor industry, including engineering, marketing,…
  • High-performance, low-cost ultracapacitors built with graphene and carbon nanotubes

    sdavis
    22 Apr 2014 | 10:42 am
    By combining the powers of two single-atom-thick carbon structures, researchers at the George Washington University’s Micro-propulsion and Nanotechnology Laboratory have created a new ultracapacitor that is both high performance and low cost. The device, described in the Journal of Applied Physics, capitalizes on the synergy brought by mixing graphene flakes with single-walled carbon nanotubes, two carbon nanostructures with complementary properties. Ultracapacitors are souped-up energy storage devices that hold high amounts of energy and can also quickly release that energy in a surge…
  • STS Semiconductor and Invensas to partner on high volume bond via array mobile solutions

    sdavis
    22 Apr 2014 | 10:22 am
    Tessera Technologies, Inc. announced today that Invensas Corporation and South Korea-based STS Semiconductor & Telecommunications, a semiconductor assembly and test solution provider, have entered into an agreement to validate high volume manufacturing capability for Invensas’ Bond Via Array (BVATM) technology for next generation smartphone and tablet customers. BVA is a proven advanced package-on-package (PoP) technology for System on Chip (SOC) and memory integration in mobile devices. Styled as a “Bridge Technology to 3DIC,” it is a unique solution that utilizes…
  • New technology symposium at SEMICON West 2014 to spotlight critical issues in semiconductor manufacturing

    sdavis
    22 Apr 2014 | 10:03 am
    SEMI has announced the new Semiconductor Technology Symposium (STS), to be held July 8-10 as part of the SEMICON West 2014 (www.semiconwest.org) technical and business program agenda. The new program addressing the most important and critical issues facing the future of semiconductor manufacturing in a new and more technical conference format. The three-day STS conference is a comprehensive technology and business conference addressing the key issues driving the future of semiconductor manufacturing and markets. Aligned with the latest inputs from technology roadmaps, sessions at the STS will…
  • “Exotic” material is like a switch when super thin

    sdavis
    21 Apr 2014 | 4:52 pm
    Researchers from Cornell University and Brookhaven National Laboratory have shown how to switch a particular transition metal oxide, a lanthanum nickelate (LaNiO3), from a metal to an insulator by making the material less than a nanometer thick. Ever-shrinking electronic devices could get down to atomic dimensions with the help of transition metal oxides, a class of materials that seems to have it all: superconductivity, magnetoresistance and other exotic properties. These possibilities have scientists excited to understand everything about these materials, and to find new ways to control…
  • add this feed to my.Alltop

    Solid State Technology

  • Contour Semiconductor names former Intel exec as new CEO

    sdavis
    22 Apr 2014 | 12:04 pm
    Contour Semiconductor, Inc., a provider dedicated to producing low-cost, high-volume, non-volatile memory chips, today announced that it has appointed veteran semiconductor industry executive Saul Zales as Chief Executive Officer.  Zales will lead Contour’s development of next generation non-volatile chips, addressing the $25 billion NAND flash memory market opportunity with a technology that is cheaper, higher-performance and simpler to produce than flash. Zales has 28 years of experience in all management aspects of the semiconductor industry, including engineering, marketing,…
  • High-performance, low-cost ultracapacitors built with graphene and carbon nanotubes

    sdavis
    22 Apr 2014 | 10:42 am
    By combining the powers of two single-atom-thick carbon structures, researchers at the George Washington University’s Micro-propulsion and Nanotechnology Laboratory have created a new ultracapacitor that is both high performance and low cost. The device, described in the Journal of Applied Physics, capitalizes on the synergy brought by mixing graphene flakes with single-walled carbon nanotubes, two carbon nanostructures with complementary properties. Ultracapacitors are souped-up energy storage devices that hold high amounts of energy and can also quickly release that energy in a surge…
  • STS Semiconductor and Invensas to partner on high volume bond via array mobile solutions

    sdavis
    22 Apr 2014 | 10:22 am
    Tessera Technologies, Inc. announced today that Invensas Corporation and South Korea-based STS Semiconductor & Telecommunications, a semiconductor assembly and test solution provider, have entered into an agreement to validate high volume manufacturing capability for Invensas’ Bond Via Array (BVATM) technology for next generation smartphone and tablet customers. BVA is a proven advanced package-on-package (PoP) technology for System on Chip (SOC) and memory integration in mobile devices. Styled as a “Bridge Technology to 3DIC,” it is a unique solution that utilizes…
  • New technology symposium at SEMICON West 2014 to spotlight critical issues in semiconductor manufacturing

    sdavis
    22 Apr 2014 | 10:03 am
    SEMI has announced the new Semiconductor Technology Symposium (STS), to be held July 8-10 as part of the SEMICON West 2014 (www.semiconwest.org) technical and business program agenda. The new program addressing the most important and critical issues facing the future of semiconductor manufacturing in a new and more technical conference format. The three-day STS conference is a comprehensive technology and business conference addressing the key issues driving the future of semiconductor manufacturing and markets. Aligned with the latest inputs from technology roadmaps, sessions at the STS will…
  • “Exotic” material is like a switch when super thin

    sdavis
    21 Apr 2014 | 4:52 pm
    Researchers from Cornell University and Brookhaven National Laboratory have shown how to switch a particular transition metal oxide, a lanthanum nickelate (LaNiO3), from a metal to an insulator by making the material less than a nanometer thick. Ever-shrinking electronic devices could get down to atomic dimensions with the help of transition metal oxides, a class of materials that seems to have it all: superconductivity, magnetoresistance and other exotic properties. These possibilities have scientists excited to understand everything about these materials, and to find new ways to control…
  • add this feed to my.Alltop

    Solid State Technology

  • Contour Semiconductor names former Intel exec as new CEO

    sdavis
    22 Apr 2014 | 12:04 pm
    Contour Semiconductor, Inc., a provider dedicated to producing low-cost, high-volume, non-volatile memory chips, today announced that it has appointed veteran semiconductor industry executive Saul Zales as Chief Executive Officer.  Zales will lead Contour’s development of next generation non-volatile chips, addressing the $25 billion NAND flash memory market opportunity with a technology that is cheaper, higher-performance and simpler to produce than flash. Zales has 28 years of experience in all management aspects of the semiconductor industry, including engineering, marketing,…
  • High-performance, low-cost ultracapacitors built with graphene and carbon nanotubes

    sdavis
    22 Apr 2014 | 10:42 am
    By combining the powers of two single-atom-thick carbon structures, researchers at the George Washington University’s Micro-propulsion and Nanotechnology Laboratory have created a new ultracapacitor that is both high performance and low cost. The device, described in the Journal of Applied Physics, capitalizes on the synergy brought by mixing graphene flakes with single-walled carbon nanotubes, two carbon nanostructures with complementary properties. Ultracapacitors are souped-up energy storage devices that hold high amounts of energy and can also quickly release that energy in a surge…
  • STS Semiconductor and Invensas to partner on high volume bond via array mobile solutions

    sdavis
    22 Apr 2014 | 10:22 am
    Tessera Technologies, Inc. announced today that Invensas Corporation and South Korea-based STS Semiconductor & Telecommunications, a semiconductor assembly and test solution provider, have entered into an agreement to validate high volume manufacturing capability for Invensas’ Bond Via Array (BVATM) technology for next generation smartphone and tablet customers. BVA is a proven advanced package-on-package (PoP) technology for System on Chip (SOC) and memory integration in mobile devices. Styled as a “Bridge Technology to 3DIC,” it is a unique solution that utilizes…
  • New technology symposium at SEMICON West 2014 to spotlight critical issues in semiconductor manufacturing

    sdavis
    22 Apr 2014 | 10:03 am
    SEMI has announced the new Semiconductor Technology Symposium (STS), to be held July 8-10 as part of the SEMICON West 2014 (www.semiconwest.org) technical and business program agenda. The new program addressing the most important and critical issues facing the future of semiconductor manufacturing in a new and more technical conference format. The three-day STS conference is a comprehensive technology and business conference addressing the key issues driving the future of semiconductor manufacturing and markets. Aligned with the latest inputs from technology roadmaps, sessions at the STS will…
  • “Exotic” material is like a switch when super thin

    sdavis
    21 Apr 2014 | 4:52 pm
    Researchers from Cornell University and Brookhaven National Laboratory have shown how to switch a particular transition metal oxide, a lanthanum nickelate (LaNiO3), from a metal to an insulator by making the material less than a nanometer thick. Ever-shrinking electronic devices could get down to atomic dimensions with the help of transition metal oxides, a class of materials that seems to have it all: superconductivity, magnetoresistance and other exotic properties. These possibilities have scientists excited to understand everything about these materials, and to find new ways to control…
 
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    Solid State Technology

  • Contour Semiconductor names former Intel exec as new CEO

    sdavis
    22 Apr 2014 | 12:04 pm
    Contour Semiconductor, Inc., a provider dedicated to producing low-cost, high-volume, non-volatile memory chips, today announced that it has appointed veteran semiconductor industry executive Saul Zales as Chief Executive Officer.  Zales will lead Contour’s development of next generation non-volatile chips, addressing the $25 billion NAND flash memory market opportunity with a technology that is cheaper, higher-performance and simpler to produce than flash. Zales has 28 years of experience in all management aspects of the semiconductor industry, including engineering, marketing,…
  • High-performance, low-cost ultracapacitors built with graphene and carbon nanotubes

    sdavis
    22 Apr 2014 | 10:42 am
    By combining the powers of two single-atom-thick carbon structures, researchers at the George Washington University’s Micro-propulsion and Nanotechnology Laboratory have created a new ultracapacitor that is both high performance and low cost. The device, described in the Journal of Applied Physics, capitalizes on the synergy brought by mixing graphene flakes with single-walled carbon nanotubes, two carbon nanostructures with complementary properties. Ultracapacitors are souped-up energy storage devices that hold high amounts of energy and can also quickly release that energy in a surge…
  • STS Semiconductor and Invensas to partner on high volume bond via array mobile solutions

    sdavis
    22 Apr 2014 | 10:22 am
    Tessera Technologies, Inc. announced today that Invensas Corporation and South Korea-based STS Semiconductor & Telecommunications, a semiconductor assembly and test solution provider, have entered into an agreement to validate high volume manufacturing capability for Invensas’ Bond Via Array (BVATM) technology for next generation smartphone and tablet customers. BVA is a proven advanced package-on-package (PoP) technology for System on Chip (SOC) and memory integration in mobile devices. Styled as a “Bridge Technology to 3DIC,” it is a unique solution that utilizes…
  • New technology symposium at SEMICON West 2014 to spotlight critical issues in semiconductor manufacturing

    sdavis
    22 Apr 2014 | 10:03 am
    SEMI has announced the new Semiconductor Technology Symposium (STS), to be held July 8-10 as part of the SEMICON West 2014 (www.semiconwest.org) technical and business program agenda. The new program addressing the most important and critical issues facing the future of semiconductor manufacturing in a new and more technical conference format. The three-day STS conference is a comprehensive technology and business conference addressing the key issues driving the future of semiconductor manufacturing and markets. Aligned with the latest inputs from technology roadmaps, sessions at the STS will…
  • “Exotic” material is like a switch when super thin

    sdavis
    21 Apr 2014 | 4:52 pm
    Researchers from Cornell University and Brookhaven National Laboratory have shown how to switch a particular transition metal oxide, a lanthanum nickelate (LaNiO3), from a metal to an insulator by making the material less than a nanometer thick. Ever-shrinking electronic devices could get down to atomic dimensions with the help of transition metal oxides, a class of materials that seems to have it all: superconductivity, magnetoresistance and other exotic properties. These possibilities have scientists excited to understand everything about these materials, and to find new ways to control…
  • add this feed to my.Alltop

    Solid State Technology

  • Contour Semiconductor names former Intel exec as new CEO

    sdavis
    22 Apr 2014 | 12:04 pm
    Contour Semiconductor, Inc., a provider dedicated to producing low-cost, high-volume, non-volatile memory chips, today announced that it has appointed veteran semiconductor industry executive Saul Zales as Chief Executive Officer.  Zales will lead Contour’s development of next generation non-volatile chips, addressing the $25 billion NAND flash memory market opportunity with a technology that is cheaper, higher-performance and simpler to produce than flash. Zales has 28 years of experience in all management aspects of the semiconductor industry, including engineering, marketing,…
  • High-performance, low-cost ultracapacitors built with graphene and carbon nanotubes

    sdavis
    22 Apr 2014 | 10:42 am
    By combining the powers of two single-atom-thick carbon structures, researchers at the George Washington University’s Micro-propulsion and Nanotechnology Laboratory have created a new ultracapacitor that is both high performance and low cost. The device, described in the Journal of Applied Physics, capitalizes on the synergy brought by mixing graphene flakes with single-walled carbon nanotubes, two carbon nanostructures with complementary properties. Ultracapacitors are souped-up energy storage devices that hold high amounts of energy and can also quickly release that energy in a surge…
  • STS Semiconductor and Invensas to partner on high volume bond via array mobile solutions

    sdavis
    22 Apr 2014 | 10:22 am
    Tessera Technologies, Inc. announced today that Invensas Corporation and South Korea-based STS Semiconductor & Telecommunications, a semiconductor assembly and test solution provider, have entered into an agreement to validate high volume manufacturing capability for Invensas’ Bond Via Array (BVATM) technology for next generation smartphone and tablet customers. BVA is a proven advanced package-on-package (PoP) technology for System on Chip (SOC) and memory integration in mobile devices. Styled as a “Bridge Technology to 3DIC,” it is a unique solution that utilizes…
  • New technology symposium at SEMICON West 2014 to spotlight critical issues in semiconductor manufacturing

    sdavis
    22 Apr 2014 | 10:03 am
    SEMI has announced the new Semiconductor Technology Symposium (STS), to be held July 8-10 as part of the SEMICON West 2014 (www.semiconwest.org) technical and business program agenda. The new program addressing the most important and critical issues facing the future of semiconductor manufacturing in a new and more technical conference format. The three-day STS conference is a comprehensive technology and business conference addressing the key issues driving the future of semiconductor manufacturing and markets. Aligned with the latest inputs from technology roadmaps, sessions at the STS will…
  • “Exotic” material is like a switch when super thin

    sdavis
    21 Apr 2014 | 4:52 pm
    Researchers from Cornell University and Brookhaven National Laboratory have shown how to switch a particular transition metal oxide, a lanthanum nickelate (LaNiO3), from a metal to an insulator by making the material less than a nanometer thick. Ever-shrinking electronic devices could get down to atomic dimensions with the help of transition metal oxides, a class of materials that seems to have it all: superconductivity, magnetoresistance and other exotic properties. These possibilities have scientists excited to understand everything about these materials, and to find new ways to control…
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    Solid State Technology

  • Contour Semiconductor names former Intel exec as new CEO

    sdavis
    22 Apr 2014 | 12:04 pm
    Contour Semiconductor, Inc., a provider dedicated to producing low-cost, high-volume, non-volatile memory chips, today announced that it has appointed veteran semiconductor industry executive Saul Zales as Chief Executive Officer.  Zales will lead Contour’s development of next generation non-volatile chips, addressing the $25 billion NAND flash memory market opportunity with a technology that is cheaper, higher-performance and simpler to produce than flash. Zales has 28 years of experience in all management aspects of the semiconductor industry, including engineering, marketing,…
  • High-performance, low-cost ultracapacitors built with graphene and carbon nanotubes

    sdavis
    22 Apr 2014 | 10:42 am
    By combining the powers of two single-atom-thick carbon structures, researchers at the George Washington University’s Micro-propulsion and Nanotechnology Laboratory have created a new ultracapacitor that is both high performance and low cost. The device, described in the Journal of Applied Physics, capitalizes on the synergy brought by mixing graphene flakes with single-walled carbon nanotubes, two carbon nanostructures with complementary properties. Ultracapacitors are souped-up energy storage devices that hold high amounts of energy and can also quickly release that energy in a surge…
  • STS Semiconductor and Invensas to partner on high volume bond via array mobile solutions

    sdavis
    22 Apr 2014 | 10:22 am
    Tessera Technologies, Inc. announced today that Invensas Corporation and South Korea-based STS Semiconductor & Telecommunications, a semiconductor assembly and test solution provider, have entered into an agreement to validate high volume manufacturing capability for Invensas’ Bond Via Array (BVATM) technology for next generation smartphone and tablet customers. BVA is a proven advanced package-on-package (PoP) technology for System on Chip (SOC) and memory integration in mobile devices. Styled as a “Bridge Technology to 3DIC,” it is a unique solution that utilizes…
  • New technology symposium at SEMICON West 2014 to spotlight critical issues in semiconductor manufacturing

    sdavis
    22 Apr 2014 | 10:03 am
    SEMI has announced the new Semiconductor Technology Symposium (STS), to be held July 8-10 as part of the SEMICON West 2014 (www.semiconwest.org) technical and business program agenda. The new program addressing the most important and critical issues facing the future of semiconductor manufacturing in a new and more technical conference format. The three-day STS conference is a comprehensive technology and business conference addressing the key issues driving the future of semiconductor manufacturing and markets. Aligned with the latest inputs from technology roadmaps, sessions at the STS will…
  • “Exotic” material is like a switch when super thin

    sdavis
    21 Apr 2014 | 4:52 pm
    Researchers from Cornell University and Brookhaven National Laboratory have shown how to switch a particular transition metal oxide, a lanthanum nickelate (LaNiO3), from a metal to an insulator by making the material less than a nanometer thick. Ever-shrinking electronic devices could get down to atomic dimensions with the help of transition metal oxides, a class of materials that seems to have it all: superconductivity, magnetoresistance and other exotic properties. These possibilities have scientists excited to understand everything about these materials, and to find new ways to control…
 
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    Solid State Technology

  • Contour Semiconductor names former Intel exec as new CEO

    sdavis
    22 Apr 2014 | 12:04 pm
    Contour Semiconductor, Inc., a provider dedicated to producing low-cost, high-volume, non-volatile memory chips, today announced that it has appointed veteran semiconductor industry executive Saul Zales as Chief Executive Officer.  Zales will lead Contour’s development of next generation non-volatile chips, addressing the $25 billion NAND flash memory market opportunity with a technology that is cheaper, higher-performance and simpler to produce than flash. Zales has 28 years of experience in all management aspects of the semiconductor industry, including engineering, marketing,…
  • High-performance, low-cost ultracapacitors built with graphene and carbon nanotubes

    sdavis
    22 Apr 2014 | 10:42 am
    By combining the powers of two single-atom-thick carbon structures, researchers at the George Washington University’s Micro-propulsion and Nanotechnology Laboratory have created a new ultracapacitor that is both high performance and low cost. The device, described in the Journal of Applied Physics, capitalizes on the synergy brought by mixing graphene flakes with single-walled carbon nanotubes, two carbon nanostructures with complementary properties. Ultracapacitors are souped-up energy storage devices that hold high amounts of energy and can also quickly release that energy in a surge…
  • STS Semiconductor and Invensas to partner on high volume bond via array mobile solutions

    sdavis
    22 Apr 2014 | 10:22 am
    Tessera Technologies, Inc. announced today that Invensas Corporation and South Korea-based STS Semiconductor & Telecommunications, a semiconductor assembly and test solution provider, have entered into an agreement to validate high volume manufacturing capability for Invensas’ Bond Via Array (BVATM) technology for next generation smartphone and tablet customers. BVA is a proven advanced package-on-package (PoP) technology for System on Chip (SOC) and memory integration in mobile devices. Styled as a “Bridge Technology to 3DIC,” it is a unique solution that utilizes…
  • New technology symposium at SEMICON West 2014 to spotlight critical issues in semiconductor manufacturing

    sdavis
    22 Apr 2014 | 10:03 am
    SEMI has announced the new Semiconductor Technology Symposium (STS), to be held July 8-10 as part of the SEMICON West 2014 (www.semiconwest.org) technical and business program agenda. The new program addressing the most important and critical issues facing the future of semiconductor manufacturing in a new and more technical conference format. The three-day STS conference is a comprehensive technology and business conference addressing the key issues driving the future of semiconductor manufacturing and markets. Aligned with the latest inputs from technology roadmaps, sessions at the STS will…
  • “Exotic” material is like a switch when super thin

    sdavis
    21 Apr 2014 | 4:52 pm
    Researchers from Cornell University and Brookhaven National Laboratory have shown how to switch a particular transition metal oxide, a lanthanum nickelate (LaNiO3), from a metal to an insulator by making the material less than a nanometer thick. Ever-shrinking electronic devices could get down to atomic dimensions with the help of transition metal oxides, a class of materials that seems to have it all: superconductivity, magnetoresistance and other exotic properties. These possibilities have scientists excited to understand everything about these materials, and to find new ways to control…
  • add this feed to my.Alltop

    Solid State Technology

  • Contour Semiconductor names former Intel exec as new CEO

    sdavis
    22 Apr 2014 | 12:04 pm
    Contour Semiconductor, Inc., a provider dedicated to producing low-cost, high-volume, non-volatile memory chips, today announced that it has appointed veteran semiconductor industry executive Saul Zales as Chief Executive Officer.  Zales will lead Contour’s development of next generation non-volatile chips, addressing the $25 billion NAND flash memory market opportunity with a technology that is cheaper, higher-performance and simpler to produce than flash. Zales has 28 years of experience in all management aspects of the semiconductor industry, including engineering, marketing,…
  • High-performance, low-cost ultracapacitors built with graphene and carbon nanotubes

    sdavis
    22 Apr 2014 | 10:42 am
    By combining the powers of two single-atom-thick carbon structures, researchers at the George Washington University’s Micro-propulsion and Nanotechnology Laboratory have created a new ultracapacitor that is both high performance and low cost. The device, described in the Journal of Applied Physics, capitalizes on the synergy brought by mixing graphene flakes with single-walled carbon nanotubes, two carbon nanostructures with complementary properties. Ultracapacitors are souped-up energy storage devices that hold high amounts of energy and can also quickly release that energy in a surge…
  • STS Semiconductor and Invensas to partner on high volume bond via array mobile solutions

    sdavis
    22 Apr 2014 | 10:22 am
    Tessera Technologies, Inc. announced today that Invensas Corporation and South Korea-based STS Semiconductor & Telecommunications, a semiconductor assembly and test solution provider, have entered into an agreement to validate high volume manufacturing capability for Invensas’ Bond Via Array (BVATM) technology for next generation smartphone and tablet customers. BVA is a proven advanced package-on-package (PoP) technology for System on Chip (SOC) and memory integration in mobile devices. Styled as a “Bridge Technology to 3DIC,” it is a unique solution that utilizes…
  • New technology symposium at SEMICON West 2014 to spotlight critical issues in semiconductor manufacturing

    sdavis
    22 Apr 2014 | 10:03 am
    SEMI has announced the new Semiconductor Technology Symposium (STS), to be held July 8-10 as part of the SEMICON West 2014 (www.semiconwest.org) technical and business program agenda. The new program addressing the most important and critical issues facing the future of semiconductor manufacturing in a new and more technical conference format. The three-day STS conference is a comprehensive technology and business conference addressing the key issues driving the future of semiconductor manufacturing and markets. Aligned with the latest inputs from technology roadmaps, sessions at the STS will…
  • “Exotic” material is like a switch when super thin

    sdavis
    21 Apr 2014 | 4:52 pm
    Researchers from Cornell University and Brookhaven National Laboratory have shown how to switch a particular transition metal oxide, a lanthanum nickelate (LaNiO3), from a metal to an insulator by making the material less than a nanometer thick. Ever-shrinking electronic devices could get down to atomic dimensions with the help of transition metal oxides, a class of materials that seems to have it all: superconductivity, magnetoresistance and other exotic properties. These possibilities have scientists excited to understand everything about these materials, and to find new ways to control…
  • add this feed to my.Alltop

    Solid State Technology

  • Contour Semiconductor names former Intel exec as new CEO

    sdavis
    22 Apr 2014 | 12:04 pm
    Contour Semiconductor, Inc., a provider dedicated to producing low-cost, high-volume, non-volatile memory chips, today announced that it has appointed veteran semiconductor industry executive Saul Zales as Chief Executive Officer.  Zales will lead Contour’s development of next generation non-volatile chips, addressing the $25 billion NAND flash memory market opportunity with a technology that is cheaper, higher-performance and simpler to produce than flash. Zales has 28 years of experience in all management aspects of the semiconductor industry, including engineering, marketing,…
  • High-performance, low-cost ultracapacitors built with graphene and carbon nanotubes

    sdavis
    22 Apr 2014 | 10:42 am
    By combining the powers of two single-atom-thick carbon structures, researchers at the George Washington University’s Micro-propulsion and Nanotechnology Laboratory have created a new ultracapacitor that is both high performance and low cost. The device, described in the Journal of Applied Physics, capitalizes on the synergy brought by mixing graphene flakes with single-walled carbon nanotubes, two carbon nanostructures with complementary properties. Ultracapacitors are souped-up energy storage devices that hold high amounts of energy and can also quickly release that energy in a surge…
  • STS Semiconductor and Invensas to partner on high volume bond via array mobile solutions

    sdavis
    22 Apr 2014 | 10:22 am
    Tessera Technologies, Inc. announced today that Invensas Corporation and South Korea-based STS Semiconductor & Telecommunications, a semiconductor assembly and test solution provider, have entered into an agreement to validate high volume manufacturing capability for Invensas’ Bond Via Array (BVATM) technology for next generation smartphone and tablet customers. BVA is a proven advanced package-on-package (PoP) technology for System on Chip (SOC) and memory integration in mobile devices. Styled as a “Bridge Technology to 3DIC,” it is a unique solution that utilizes…
  • New technology symposium at SEMICON West 2014 to spotlight critical issues in semiconductor manufacturing

    sdavis
    22 Apr 2014 | 10:03 am
    SEMI has announced the new Semiconductor Technology Symposium (STS), to be held July 8-10 as part of the SEMICON West 2014 (www.semiconwest.org) technical and business program agenda. The new program addressing the most important and critical issues facing the future of semiconductor manufacturing in a new and more technical conference format. The three-day STS conference is a comprehensive technology and business conference addressing the key issues driving the future of semiconductor manufacturing and markets. Aligned with the latest inputs from technology roadmaps, sessions at the STS will…
  • “Exotic” material is like a switch when super thin

    sdavis
    21 Apr 2014 | 4:52 pm
    Researchers from Cornell University and Brookhaven National Laboratory have shown how to switch a particular transition metal oxide, a lanthanum nickelate (LaNiO3), from a metal to an insulator by making the material less than a nanometer thick. Ever-shrinking electronic devices could get down to atomic dimensions with the help of transition metal oxides, a class of materials that seems to have it all: superconductivity, magnetoresistance and other exotic properties. These possibilities have scientists excited to understand everything about these materials, and to find new ways to control…
 
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    Solid State Technology

  • Contour Semiconductor names former Intel exec as new CEO

    sdavis
    22 Apr 2014 | 12:04 pm
    Contour Semiconductor, Inc., a provider dedicated to producing low-cost, high-volume, non-volatile memory chips, today announced that it has appointed veteran semiconductor industry executive Saul Zales as Chief Executive Officer.  Zales will lead Contour’s development of next generation non-volatile chips, addressing the $25 billion NAND flash memory market opportunity with a technology that is cheaper, higher-performance and simpler to produce than flash. Zales has 28 years of experience in all management aspects of the semiconductor industry, including engineering, marketing,…
  • High-performance, low-cost ultracapacitors built with graphene and carbon nanotubes

    sdavis
    22 Apr 2014 | 10:42 am
    By combining the powers of two single-atom-thick carbon structures, researchers at the George Washington University’s Micro-propulsion and Nanotechnology Laboratory have created a new ultracapacitor that is both high performance and low cost. The device, described in the Journal of Applied Physics, capitalizes on the synergy brought by mixing graphene flakes with single-walled carbon nanotubes, two carbon nanostructures with complementary properties. Ultracapacitors are souped-up energy storage devices that hold high amounts of energy and can also quickly release that energy in a surge…
  • STS Semiconductor and Invensas to partner on high volume bond via array mobile solutions

    sdavis
    22 Apr 2014 | 10:22 am
    Tessera Technologies, Inc. announced today that Invensas Corporation and South Korea-based STS Semiconductor & Telecommunications, a semiconductor assembly and test solution provider, have entered into an agreement to validate high volume manufacturing capability for Invensas’ Bond Via Array (BVATM) technology for next generation smartphone and tablet customers. BVA is a proven advanced package-on-package (PoP) technology for System on Chip (SOC) and memory integration in mobile devices. Styled as a “Bridge Technology to 3DIC,” it is a unique solution that utilizes…
  • New technology symposium at SEMICON West 2014 to spotlight critical issues in semiconductor manufacturing

    sdavis
    22 Apr 2014 | 10:03 am
    SEMI has announced the new Semiconductor Technology Symposium (STS), to be held July 8-10 as part of the SEMICON West 2014 (www.semiconwest.org) technical and business program agenda. The new program addressing the most important and critical issues facing the future of semiconductor manufacturing in a new and more technical conference format. The three-day STS conference is a comprehensive technology and business conference addressing the key issues driving the future of semiconductor manufacturing and markets. Aligned with the latest inputs from technology roadmaps, sessions at the STS will…
  • “Exotic” material is like a switch when super thin

    sdavis
    21 Apr 2014 | 4:52 pm
    Researchers from Cornell University and Brookhaven National Laboratory have shown how to switch a particular transition metal oxide, a lanthanum nickelate (LaNiO3), from a metal to an insulator by making the material less than a nanometer thick. Ever-shrinking electronic devices could get down to atomic dimensions with the help of transition metal oxides, a class of materials that seems to have it all: superconductivity, magnetoresistance and other exotic properties. These possibilities have scientists excited to understand everything about these materials, and to find new ways to control…
  • add this feed to my.Alltop

    Solid State Technology

  • Contour Semiconductor names former Intel exec as new CEO

    sdavis
    22 Apr 2014 | 12:04 pm
    Contour Semiconductor, Inc., a provider dedicated to producing low-cost, high-volume, non-volatile memory chips, today announced that it has appointed veteran semiconductor industry executive Saul Zales as Chief Executive Officer.  Zales will lead Contour’s development of next generation non-volatile chips, addressing the $25 billion NAND flash memory market opportunity with a technology that is cheaper, higher-performance and simpler to produce than flash. Zales has 28 years of experience in all management aspects of the semiconductor industry, including engineering, marketing,…
  • High-performance, low-cost ultracapacitors built with graphene and carbon nanotubes

    sdavis
    22 Apr 2014 | 10:42 am
    By combining the powers of two single-atom-thick carbon structures, researchers at the George Washington University’s Micro-propulsion and Nanotechnology Laboratory have created a new ultracapacitor that is both high performance and low cost. The device, described in the Journal of Applied Physics, capitalizes on the synergy brought by mixing graphene flakes with single-walled carbon nanotubes, two carbon nanostructures with complementary properties. Ultracapacitors are souped-up energy storage devices that hold high amounts of energy and can also quickly release that energy in a surge…
  • STS Semiconductor and Invensas to partner on high volume bond via array mobile solutions

    sdavis
    22 Apr 2014 | 10:22 am
    Tessera Technologies, Inc. announced today that Invensas Corporation and South Korea-based STS Semiconductor & Telecommunications, a semiconductor assembly and test solution provider, have entered into an agreement to validate high volume manufacturing capability for Invensas’ Bond Via Array (BVATM) technology for next generation smartphone and tablet customers. BVA is a proven advanced package-on-package (PoP) technology for System on Chip (SOC) and memory integration in mobile devices. Styled as a “Bridge Technology to 3DIC,” it is a unique solution that utilizes…
  • New technology symposium at SEMICON West 2014 to spotlight critical issues in semiconductor manufacturing

    sdavis
    22 Apr 2014 | 10:03 am
    SEMI has announced the new Semiconductor Technology Symposium (STS), to be held July 8-10 as part of the SEMICON West 2014 (www.semiconwest.org) technical and business program agenda. The new program addressing the most important and critical issues facing the future of semiconductor manufacturing in a new and more technical conference format. The three-day STS conference is a comprehensive technology and business conference addressing the key issues driving the future of semiconductor manufacturing and markets. Aligned with the latest inputs from technology roadmaps, sessions at the STS will…
  • “Exotic” material is like a switch when super thin

    sdavis
    21 Apr 2014 | 4:52 pm
    Researchers from Cornell University and Brookhaven National Laboratory have shown how to switch a particular transition metal oxide, a lanthanum nickelate (LaNiO3), from a metal to an insulator by making the material less than a nanometer thick. Ever-shrinking electronic devices could get down to atomic dimensions with the help of transition metal oxides, a class of materials that seems to have it all: superconductivity, magnetoresistance and other exotic properties. These possibilities have scientists excited to understand everything about these materials, and to find new ways to control…
  • add this feed to my.Alltop

    Solid State Technology

  • Contour Semiconductor names former Intel exec as new CEO

    sdavis
    22 Apr 2014 | 12:04 pm
    Contour Semiconductor, Inc., a provider dedicated to producing low-cost, high-volume, non-volatile memory chips, today announced that it has appointed veteran semiconductor industry executive Saul Zales as Chief Executive Officer.  Zales will lead Contour’s development of next generation non-volatile chips, addressing the $25 billion NAND flash memory market opportunity with a technology that is cheaper, higher-performance and simpler to produce than flash. Zales has 28 years of experience in all management aspects of the semiconductor industry, including engineering, marketing,…
  • High-performance, low-cost ultracapacitors built with graphene and carbon nanotubes

    sdavis
    22 Apr 2014 | 10:42 am
    By combining the powers of two single-atom-thick carbon structures, researchers at the George Washington University’s Micro-propulsion and Nanotechnology Laboratory have created a new ultracapacitor that is both high performance and low cost. The device, described in the Journal of Applied Physics, capitalizes on the synergy brought by mixing graphene flakes with single-walled carbon nanotubes, two carbon nanostructures with complementary properties. Ultracapacitors are souped-up energy storage devices that hold high amounts of energy and can also quickly release that energy in a surge…
  • STS Semiconductor and Invensas to partner on high volume bond via array mobile solutions

    sdavis
    22 Apr 2014 | 10:22 am
    Tessera Technologies, Inc. announced today that Invensas Corporation and South Korea-based STS Semiconductor & Telecommunications, a semiconductor assembly and test solution provider, have entered into an agreement to validate high volume manufacturing capability for Invensas’ Bond Via Array (BVATM) technology for next generation smartphone and tablet customers. BVA is a proven advanced package-on-package (PoP) technology for System on Chip (SOC) and memory integration in mobile devices. Styled as a “Bridge Technology to 3DIC,” it is a unique solution that utilizes…
  • New technology symposium at SEMICON West 2014 to spotlight critical issues in semiconductor manufacturing

    sdavis
    22 Apr 2014 | 10:03 am
    SEMI has announced the new Semiconductor Technology Symposium (STS), to be held July 8-10 as part of the SEMICON West 2014 (www.semiconwest.org) technical and business program agenda. The new program addressing the most important and critical issues facing the future of semiconductor manufacturing in a new and more technical conference format. The three-day STS conference is a comprehensive technology and business conference addressing the key issues driving the future of semiconductor manufacturing and markets. Aligned with the latest inputs from technology roadmaps, sessions at the STS will…
  • “Exotic” material is like a switch when super thin

    sdavis
    21 Apr 2014 | 4:52 pm
    Researchers from Cornell University and Brookhaven National Laboratory have shown how to switch a particular transition metal oxide, a lanthanum nickelate (LaNiO3), from a metal to an insulator by making the material less than a nanometer thick. Ever-shrinking electronic devices could get down to atomic dimensions with the help of transition metal oxides, a class of materials that seems to have it all: superconductivity, magnetoresistance and other exotic properties. These possibilities have scientists excited to understand everything about these materials, and to find new ways to control…
 
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    Solid State Technology

  • Contour Semiconductor names former Intel exec as new CEO

    sdavis
    22 Apr 2014 | 12:04 pm
    Contour Semiconductor, Inc., a provider dedicated to producing low-cost, high-volume, non-volatile memory chips, today announced that it has appointed veteran semiconductor industry executive Saul Zales as Chief Executive Officer.  Zales will lead Contour’s development of next generation non-volatile chips, addressing the $25 billion NAND flash memory market opportunity with a technology that is cheaper, higher-performance and simpler to produce than flash. Zales has 28 years of experience in all management aspects of the semiconductor industry, including engineering, marketing,…
  • High-performance, low-cost ultracapacitors built with graphene and carbon nanotubes

    sdavis
    22 Apr 2014 | 10:42 am
    By combining the powers of two single-atom-thick carbon structures, researchers at the George Washington University’s Micro-propulsion and Nanotechnology Laboratory have created a new ultracapacitor that is both high performance and low cost. The device, described in the Journal of Applied Physics, capitalizes on the synergy brought by mixing graphene flakes with single-walled carbon nanotubes, two carbon nanostructures with complementary properties. Ultracapacitors are souped-up energy storage devices that hold high amounts of energy and can also quickly release that energy in a surge…
  • STS Semiconductor and Invensas to partner on high volume bond via array mobile solutions

    sdavis
    22 Apr 2014 | 10:22 am
    Tessera Technologies, Inc. announced today that Invensas Corporation and South Korea-based STS Semiconductor & Telecommunications, a semiconductor assembly and test solution provider, have entered into an agreement to validate high volume manufacturing capability for Invensas’ Bond Via Array (BVATM) technology for next generation smartphone and tablet customers. BVA is a proven advanced package-on-package (PoP) technology for System on Chip (SOC) and memory integration in mobile devices. Styled as a “Bridge Technology to 3DIC,” it is a unique solution that utilizes…
  • New technology symposium at SEMICON West 2014 to spotlight critical issues in semiconductor manufacturing

    sdavis
    22 Apr 2014 | 10:03 am
    SEMI has announced the new Semiconductor Technology Symposium (STS), to be held July 8-10 as part of the SEMICON West 2014 (www.semiconwest.org) technical and business program agenda. The new program addressing the most important and critical issues facing the future of semiconductor manufacturing in a new and more technical conference format. The three-day STS conference is a comprehensive technology and business conference addressing the key issues driving the future of semiconductor manufacturing and markets. Aligned with the latest inputs from technology roadmaps, sessions at the STS will…
  • “Exotic” material is like a switch when super thin

    sdavis
    21 Apr 2014 | 4:52 pm
    Researchers from Cornell University and Brookhaven National Laboratory have shown how to switch a particular transition metal oxide, a lanthanum nickelate (LaNiO3), from a metal to an insulator by making the material less than a nanometer thick. Ever-shrinking electronic devices could get down to atomic dimensions with the help of transition metal oxides, a class of materials that seems to have it all: superconductivity, magnetoresistance and other exotic properties. These possibilities have scientists excited to understand everything about these materials, and to find new ways to control…
  • add this feed to my.Alltop

    Solid State Technology

  • Contour Semiconductor names former Intel exec as new CEO

    sdavis
    22 Apr 2014 | 12:04 pm
    Contour Semiconductor, Inc., a provider dedicated to producing low-cost, high-volume, non-volatile memory chips, today announced that it has appointed veteran semiconductor industry executive Saul Zales as Chief Executive Officer.  Zales will lead Contour’s development of next generation non-volatile chips, addressing the $25 billion NAND flash memory market opportunity with a technology that is cheaper, higher-performance and simpler to produce than flash. Zales has 28 years of experience in all management aspects of the semiconductor industry, including engineering, marketing,…
  • High-performance, low-cost ultracapacitors built with graphene and carbon nanotubes

    sdavis
    22 Apr 2014 | 10:42 am
    By combining the powers of two single-atom-thick carbon structures, researchers at the George Washington University’s Micro-propulsion and Nanotechnology Laboratory have created a new ultracapacitor that is both high performance and low cost. The device, described in the Journal of Applied Physics, capitalizes on the synergy brought by mixing graphene flakes with single-walled carbon nanotubes, two carbon nanostructures with complementary properties. Ultracapacitors are souped-up energy storage devices that hold high amounts of energy and can also quickly release that energy in a surge…
  • STS Semiconductor and Invensas to partner on high volume bond via array mobile solutions

    sdavis
    22 Apr 2014 | 10:22 am
    Tessera Technologies, Inc. announced today that Invensas Corporation and South Korea-based STS Semiconductor & Telecommunications, a semiconductor assembly and test solution provider, have entered into an agreement to validate high volume manufacturing capability for Invensas’ Bond Via Array (BVATM) technology for next generation smartphone and tablet customers. BVA is a proven advanced package-on-package (PoP) technology for System on Chip (SOC) and memory integration in mobile devices. Styled as a “Bridge Technology to 3DIC,” it is a unique solution that utilizes…
  • New technology symposium at SEMICON West 2014 to spotlight critical issues in semiconductor manufacturing

    sdavis
    22 Apr 2014 | 10:03 am
    SEMI has announced the new Semiconductor Technology Symposium (STS), to be held July 8-10 as part of the SEMICON West 2014 (www.semiconwest.org) technical and business program agenda. The new program addressing the most important and critical issues facing the future of semiconductor manufacturing in a new and more technical conference format. The three-day STS conference is a comprehensive technology and business conference addressing the key issues driving the future of semiconductor manufacturing and markets. Aligned with the latest inputs from technology roadmaps, sessions at the STS will…
  • “Exotic” material is like a switch when super thin

    sdavis
    21 Apr 2014 | 4:52 pm
    Researchers from Cornell University and Brookhaven National Laboratory have shown how to switch a particular transition metal oxide, a lanthanum nickelate (LaNiO3), from a metal to an insulator by making the material less than a nanometer thick. Ever-shrinking electronic devices could get down to atomic dimensions with the help of transition metal oxides, a class of materials that seems to have it all: superconductivity, magnetoresistance and other exotic properties. These possibilities have scientists excited to understand everything about these materials, and to find new ways to control…
  • add this feed to my.Alltop

    Solid State Technology

  • Contour Semiconductor names former Intel exec as new CEO

    sdavis
    22 Apr 2014 | 12:04 pm
    Contour Semiconductor, Inc., a provider dedicated to producing low-cost, high-volume, non-volatile memory chips, today announced that it has appointed veteran semiconductor industry executive Saul Zales as Chief Executive Officer.  Zales will lead Contour’s development of next generation non-volatile chips, addressing the $25 billion NAND flash memory market opportunity with a technology that is cheaper, higher-performance and simpler to produce than flash. Zales has 28 years of experience in all management aspects of the semiconductor industry, including engineering, marketing,…
  • High-performance, low-cost ultracapacitors built with graphene and carbon nanotubes

    sdavis
    22 Apr 2014 | 10:42 am
    By combining the powers of two single-atom-thick carbon structures, researchers at the George Washington University’s Micro-propulsion and Nanotechnology Laboratory have created a new ultracapacitor that is both high performance and low cost. The device, described in the Journal of Applied Physics, capitalizes on the synergy brought by mixing graphene flakes with single-walled carbon nanotubes, two carbon nanostructures with complementary properties. Ultracapacitors are souped-up energy storage devices that hold high amounts of energy and can also quickly release that energy in a surge…
  • STS Semiconductor and Invensas to partner on high volume bond via array mobile solutions

    sdavis
    22 Apr 2014 | 10:22 am
    Tessera Technologies, Inc. announced today that Invensas Corporation and South Korea-based STS Semiconductor & Telecommunications, a semiconductor assembly and test solution provider, have entered into an agreement to validate high volume manufacturing capability for Invensas’ Bond Via Array (BVATM) technology for next generation smartphone and tablet customers. BVA is a proven advanced package-on-package (PoP) technology for System on Chip (SOC) and memory integration in mobile devices. Styled as a “Bridge Technology to 3DIC,” it is a unique solution that utilizes…
  • New technology symposium at SEMICON West 2014 to spotlight critical issues in semiconductor manufacturing

    sdavis
    22 Apr 2014 | 10:03 am
    SEMI has announced the new Semiconductor Technology Symposium (STS), to be held July 8-10 as part of the SEMICON West 2014 (www.semiconwest.org) technical and business program agenda. The new program addressing the most important and critical issues facing the future of semiconductor manufacturing in a new and more technical conference format. The three-day STS conference is a comprehensive technology and business conference addressing the key issues driving the future of semiconductor manufacturing and markets. Aligned with the latest inputs from technology roadmaps, sessions at the STS will…
  • “Exotic” material is like a switch when super thin

    sdavis
    21 Apr 2014 | 4:52 pm
    Researchers from Cornell University and Brookhaven National Laboratory have shown how to switch a particular transition metal oxide, a lanthanum nickelate (LaNiO3), from a metal to an insulator by making the material less than a nanometer thick. Ever-shrinking electronic devices could get down to atomic dimensions with the help of transition metal oxides, a class of materials that seems to have it all: superconductivity, magnetoresistance and other exotic properties. These possibilities have scientists excited to understand everything about these materials, and to find new ways to control…
 
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    Solid State Technology

  • Contour Semiconductor names former Intel exec as new CEO

    sdavis
    22 Apr 2014 | 12:04 pm
    Contour Semiconductor, Inc., a provider dedicated to producing low-cost, high-volume, non-volatile memory chips, today announced that it has appointed veteran semiconductor industry executive Saul Zales as Chief Executive Officer.  Zales will lead Contour’s development of next generation non-volatile chips, addressing the $25 billion NAND flash memory market opportunity with a technology that is cheaper, higher-performance and simpler to produce than flash. Zales has 28 years of experience in all management aspects of the semiconductor industry, including engineering, marketing,…
  • High-performance, low-cost ultracapacitors built with graphene and carbon nanotubes

    sdavis
    22 Apr 2014 | 10:42 am
    By combining the powers of two single-atom-thick carbon structures, researchers at the George Washington University’s Micro-propulsion and Nanotechnology Laboratory have created a new ultracapacitor that is both high performance and low cost. The device, described in the Journal of Applied Physics, capitalizes on the synergy brought by mixing graphene flakes with single-walled carbon nanotubes, two carbon nanostructures with complementary properties. Ultracapacitors are souped-up energy storage devices that hold high amounts of energy and can also quickly release that energy in a surge…
  • STS Semiconductor and Invensas to partner on high volume bond via array mobile solutions

    sdavis
    22 Apr 2014 | 10:22 am
    Tessera Technologies, Inc. announced today that Invensas Corporation and South Korea-based STS Semiconductor & Telecommunications, a semiconductor assembly and test solution provider, have entered into an agreement to validate high volume manufacturing capability for Invensas’ Bond Via Array (BVATM) technology for next generation smartphone and tablet customers. BVA is a proven advanced package-on-package (PoP) technology for System on Chip (SOC) and memory integration in mobile devices. Styled as a “Bridge Technology to 3DIC,” it is a unique solution that utilizes…
  • New technology symposium at SEMICON West 2014 to spotlight critical issues in semiconductor manufacturing

    sdavis
    22 Apr 2014 | 10:03 am
    SEMI has announced the new Semiconductor Technology Symposium (STS), to be held July 8-10 as part of the SEMICON West 2014 (www.semiconwest.org) technical and business program agenda. The new program addressing the most important and critical issues facing the future of semiconductor manufacturing in a new and more technical conference format. The three-day STS conference is a comprehensive technology and business conference addressing the key issues driving the future of semiconductor manufacturing and markets. Aligned with the latest inputs from technology roadmaps, sessions at the STS will…
  • “Exotic” material is like a switch when super thin

    sdavis
    21 Apr 2014 | 4:52 pm
    Researchers from Cornell University and Brookhaven National Laboratory have shown how to switch a particular transition metal oxide, a lanthanum nickelate (LaNiO3), from a metal to an insulator by making the material less than a nanometer thick. Ever-shrinking electronic devices could get down to atomic dimensions with the help of transition metal oxides, a class of materials that seems to have it all: superconductivity, magnetoresistance and other exotic properties. These possibilities have scientists excited to understand everything about these materials, and to find new ways to control…
  • add this feed to my.Alltop

    Solid State Technology

  • Contour Semiconductor names former Intel exec as new CEO

    sdavis
    22 Apr 2014 | 12:04 pm
    Contour Semiconductor, Inc., a provider dedicated to producing low-cost, high-volume, non-volatile memory chips, today announced that it has appointed veteran semiconductor industry executive Saul Zales as Chief Executive Officer.  Zales will lead Contour’s development of next generation non-volatile chips, addressing the $25 billion NAND flash memory market opportunity with a technology that is cheaper, higher-performance and simpler to produce than flash. Zales has 28 years of experience in all management aspects of the semiconductor industry, including engineering, marketing,…
  • High-performance, low-cost ultracapacitors built with graphene and carbon nanotubes

    sdavis
    22 Apr 2014 | 10:42 am
    By combining the powers of two single-atom-thick carbon structures, researchers at the George Washington University’s Micro-propulsion and Nanotechnology Laboratory have created a new ultracapacitor that is both high performance and low cost. The device, described in the Journal of Applied Physics, capitalizes on the synergy brought by mixing graphene flakes with single-walled carbon nanotubes, two carbon nanostructures with complementary properties. Ultracapacitors are souped-up energy storage devices that hold high amounts of energy and can also quickly release that energy in a surge…
  • STS Semiconductor and Invensas to partner on high volume bond via array mobile solutions

    sdavis
    22 Apr 2014 | 10:22 am
    Tessera Technologies, Inc. announced today that Invensas Corporation and South Korea-based STS Semiconductor & Telecommunications, a semiconductor assembly and test solution provider, have entered into an agreement to validate high volume manufacturing capability for Invensas’ Bond Via Array (BVATM) technology for next generation smartphone and tablet customers. BVA is a proven advanced package-on-package (PoP) technology for System on Chip (SOC) and memory integration in mobile devices. Styled as a “Bridge Technology to 3DIC,” it is a unique solution that utilizes…
  • New technology symposium at SEMICON West 2014 to spotlight critical issues in semiconductor manufacturing

    sdavis
    22 Apr 2014 | 10:03 am
    SEMI has announced the new Semiconductor Technology Symposium (STS), to be held July 8-10 as part of the SEMICON West 2014 (www.semiconwest.org) technical and business program agenda. The new program addressing the most important and critical issues facing the future of semiconductor manufacturing in a new and more technical conference format. The three-day STS conference is a comprehensive technology and business conference addressing the key issues driving the future of semiconductor manufacturing and markets. Aligned with the latest inputs from technology roadmaps, sessions at the STS will…
  • “Exotic” material is like a switch when super thin

    sdavis
    21 Apr 2014 | 4:52 pm
    Researchers from Cornell University and Brookhaven National Laboratory have shown how to switch a particular transition metal oxide, a lanthanum nickelate (LaNiO3), from a metal to an insulator by making the material less than a nanometer thick. Ever-shrinking electronic devices could get down to atomic dimensions with the help of transition metal oxides, a class of materials that seems to have it all: superconductivity, magnetoresistance and other exotic properties. These possibilities have scientists excited to understand everything about these materials, and to find new ways to control…
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